AMD XCV300E-6FG456I

Overview

XCV300E-6FG456I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 411,955 system gates and 6,912 logic cells in a 32 × 48 CLB array. It features eight digital Delay-Locked Loops (DLLs), 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications and embedded signal processing systems.

For engineers reviewing the XCV300E-6FG456I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and industrial-grade (-40°C to +100°C) thermal performance for deterministic FPGA integration.

Technical Context

The XCV300E-6FG456I implements a regular array architecture with Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

I/O functionality is organized into eight voltage-isolated banks, each supporting mixed standards (e.g., LVTTL, LVCMOS2, SSTL3, HSTL) under shared VCCO and single VREF per bank. The device uses eight fully digital DLLs for zero-delay clock conversion, duty-cycle correction for DDR, and frequency multiplication up to 4× - all operating at 1.8 V core supply with 3.3 V tolerant I/O pins.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG456) with 456 balls, 1.0 mm pitch, and 27 × 27 mm body size. Thermal pad on underside for industrial thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV300E-6PQ240I, the XCV300E-6FG456I delivers 97% more I/Os for parallel bus interfacing, while XCV400E-6FG456I offers 32% higher logic capacity without changing PCB layout - making the XCV300E-6FG456I optimal for balanced I/O-rich, medium-complexity industrial systems.

Availability

XCV300E-6FG456I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging data acquisition, and avionics sensor fusion requiring stable component supply across extended product lifecycles.

Supply support for XCV300E-6FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-E family was designed for high-speed, high-density system-on-chip replacements in wired communications and industrial computing - emphasizing I/O flexibility, clock management, and low-voltage efficiency over prior Virtex generations.

FAQ

What is the maximum differential I/O pair count supported by XCV300E-6FG456I?

The XCV300E-6FG456I supports up to 137 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This count is fixed for the XCV300E device regardless of package; the FG456 variant realizes 137 pairs within its 312 total user I/O pins, enabling high-bandwidth LVDS or BLVDS interfaces such as camera links or backplane interconnects. Each pair consumes two physical pins and shares common VCCO/VREF constraints per bank.

Does XCV300E-6FG456I support IEEE 1149.1 boundary scan?

Yes, XCV300E-6FG456I includes full IEEE 1149.1 boundary scan logic integrated into all IOBs, as stated in the "Flexible Architecture" feature list and confirmed in DS022-2 section "Input/Output Block". The TCK, TMS, TDI, and TDO pins are dedicated and functional in all packages including FG456, enabling JTAG-based testing, in-system programming, and interconnect verification without additional hardware.

Can XCV300E-6FG456I operate with 2.5 V VCCO in I/O banks?

Yes, XCV300E-6FG456I supports 2.5 V VCCO in I/O banks, enabling use of SSTL2, LVCMOS2, and BLVDS standards as specified in Table 1 of DS022-2. Each bank's VCCO pins must be tied to a clean 2.5 V supply, and compatible standards (e.g., SSTL2 I/II, LVCMOS2) may be mixed within that bank. This allows direct interfacing with 2.5 V memory and logic without level shifters.

What is the block RAM organization for XCV300E-6FG456I?

XCV300E-6FG456I contains 32 block SelectRAM units, each providing 4096 bits of true dual-port synchronous RAM, totaling 131,072 bits. As documented in Table 4 of DS022-2, these blocks are arranged in columns aligned with CLB columns (e.g., columns 0, 12, 24, 36), with each block spanning four CLB rows. They support independent read/write widths per port and built-in bus-width conversion.

Is XCV300E-6FG456I pin-compatible with other Virtex-E devices in FG456 packaging?

XCV300E-6FG456I is pin-compatible with XCV200E-6FG456I and XCV400E-6FG456I in the same FG456 package, as confirmed in DS022-1 section "Virtex-E Compared to Virtex Devices" and Table 3. All share identical ball map, power pin locations, and I/O bank assignments - allowing PCB reuse across density tiers. However, unused pins in smaller devices (e.g., XCV200E) are No Connect, not functionally equivalent.