AMD XCV300E-6PQ240C
- Part No.:
- XCV300E-6PQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCV300E-6PQ240C.pdf
- Description:
- IC FPGA 158 I/O 240QFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV300E-6PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 32 × 48 CLB array. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communication interface implementation.
For engineers reviewing the XCV300E-6PQ240C datasheet, pinout, applications, or equivalent options, this device serves as a production-grade Virtex-E FPGA targeting PCI-compliant 33/66-MHz systems, source-synchronous data transmission architectures, and high-bandwidth memory interfacing including 200 MHz ZBT SRAM and DDR SDRAM.
Technical Context
The XCV300E-6PQ240C implements a flexible architecture with configurable logic blocks (CLBs) containing four logic cells each, dual-slice organization, dedicated carry chains for arithmetic, and F5/F6 multiplexers enabling 5- to 6-input logic functions. Its IOBs support SelectI/O+ technology with independent clock enable, synchronous/asynchronous set/reset, and programmable delay for zero pad-to-pad hold time.
It integrates 131,072 bits of synchronous block RAM (32 × 4096-bit True Dual-Port blocks), 98,304 bits of distributed RAM, and eight fully digital DLLs offering clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay conversion of LVPECL/LVDS clocks to any I/O standard - all operating from a 1.8 V VCCINT supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 411,955 - defines total logic capacity for complex digital system integration |
| Logic Cells | 6,912 - provides granular, routable logic resources for efficient place-and-route |
| CLB Array | 32 × 48 - determines maximum combinational depth and register count per row/column |
| Block RAM Bits | 131,072 - enables true dual-port memory access at up to 200 MHz for buffering and FIFOs |
| DLL Count | 8 - allows independent clock domain management for multi-rate I/O and DDR interfaces |
| Max I/O Pins | 316 user I/O - supports high-pin-count parallel buses and multiple differential channel groups |
| Speed Grade | -6 - guarantees timing closure at 130 MHz internal performance (4-LUT level) |
| VCCINT | 1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling higher density without thermal penalty |
Pinout & Package
PQ240 package: 240-pin Plastic Quad Flatpack (PQFP), 0.5 mm pitch, 32.5 mm × 32.5 mm body size, lead-free compatible, with 316 user I/O pins distributed across 8 I/O banks (Bank 0–7), plus dedicated global clock inputs (GCLK0–GCLK3), configuration pins (M0–M2, INIT_B, PROGRAM_B, DONE), and power/ground pins (VCCINT, VCCO, GND).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Low-skew dedicated routing path to all DLLs and CLBs; required for synchronous system timing |
| M0–M2 | Configuration Mode Select | Determines boot mode (Master Serial, Slave Serial, SelectMAP, JTAG); sets startup behavior |
| INIT_B | Configuration Initialization Status | Active-low open-drain output indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and initiates reconfiguration sequence |
| DONE | Configuration Completion Indicator | Open-drain output asserted high when bitstream loading and CRC verification complete |
| VCCINT | Core Logic Supply | 1.8 V supply powering CLBs, DLLs, and internal RAM; decoupling critical for jitter control |
| VCCO_0–VCCO_7 | I/O Bank Power | Independent 1.5–3.3 V supplies per bank; defines output voltage and input threshold compatibility |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+ Technology | Supports 20 I/O standards (LVTTL, LVCMOS, SSTL, HSTL, GTL+, LVDS, LVPECL) with per-bank VCCO/VREF control |
| SelectRAM+ Memory Hierarchy | 131,072-bit block RAM + 98,304-bit distributed RAM enables mixed-depth, dual-port, and shift-register memory structures |
| SelectLink™ DDR Interface | Hardware-optimized DDR link between FPGA fabric and external memory controllers using double-data-rate signaling |
| Digital DLLs | Eight fully digital delay-locked loops provide jitter-free clock multiplication, division, phase alignment, and duty-cycle correction |
| IEEE 1149.1 Boundary Scan | Full JTAG TAP controller integrated for board-level test, debug, and in-system programming |
| Die Temperature Sensor | On-die diode enables real-time thermal monitoring for thermal throttling or reliability analysis |
Applications
| PCI 33/66-MHz Interface | Source-Synchronous Data Acquisition |
|---|---|
Use Scenario: Implementation of compliant 32-bit/33-MHz or 32-bit/66-MHz PCI bus master and target logic in embedded host adapters. IC Role / Device Role / Timing Role: Configurable protocol engine handling address/data multiplexing, arbitration, burst transfers, and parity generation/checking. Use Value: Leverages 3.3 V tolerant I/O, 130 MHz internal speed, and DLL-controlled setup/hold margins to meet PCI timing spec without external glue logic. |
Use Scenario: High-speed ADC/DAC interface in test equipment or radar front-ends using source-synchronous strobes (e.g., LVDS DQS). IC Role / Device Role / Timing Role: Real-time data capture and preprocessing unit synchronizing to external clock domains via DLL-aligned sampling windows. Use Value: Achieves 622 Mb/s differential I/O bandwidth and zero pad-to-pad hold time using programmable input delay and DLL deskew. |
| DDR SDRAM Controller | ZBT SRAM Interface |
Use Scenario: Embedded memory controller for 200 Mb/s DDR SDRAM in networking packet buffers or video frame stores. IC Role / Device Role / Timing Role: Timing-critical command/address/data path generator with DLL-synchronized write leveling and read DQS gating. Use Value: Uses True Dual-Port BlockRAM for command queueing and DLL-matched clock outputs to meet DDR tAC/tDQS skew requirements. |
Use Scenario: High-throughput buffer between processor and ZBT SRAM in telecom line cards requiring 200 MHz burst-mode access. IC Role / Device Role / Timing Role: Burst-length-aware interface managing ZBT-specific early-write and late-read protocols with precise cycle alignment. Use Value: Delivers 200 MHz synchronous operation using DLL-generated clocks and dedicated carry logic for address incrementing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300E-7PQ240C | Higher speed grade (-7): 140 MHz internal performance (vs. 130 MHz for -6), tighter timing margins, same pinout and logic resources | Suitable for designs requiring additional timing slack or higher clock frequencies in critical paths | Select when design fails timing closure at -6 grade or targets >130 MHz system clock |
| XCV400E-6PQ240C | Larger device: 569,952 system gates, 10,800 logic cells, 40 × 60 CLB array, 163,840 block RAM bits - same PQ240 package | Enables larger logic partitions, deeper memory buffers, or additional protocol stacks without PCB change | Choose for design scalability where future feature expansion or higher gate count is anticipated |
Compared with XCV300E-6PQ240C, the -7 variant improves timing margin without altering footprint or functionality, while the XCV400E-6PQ240C offers 38% more logic and 25% more block RAM in identical packaging - both serve as direct migration paths within the Virtex-E family.
Availability
XCV300E-6PQ240C is available at Aetrix Electronics and suitable for PCI interface development, source-synchronous data acquisition systems, DDR SDRAM controller implementation, and ZBT SRAM interfacing requiring stable component supply across industrial and communications product lifecycles.
Supply support for XCV300E-6PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architecture and tools for high-performance digital system design.
The Virtex-E product line was engineered for high-speed, high-density applications demanding advanced I/O flexibility, integrated memory, and deterministic clock management - specifically targeting communications infrastructure, test equipment, and embedded computing.
FAQ
What is the maximum differential I/O bandwidth supported by the XCV300E-6PQ240C?
The XCV300E-6PQ240C supports up to 344 differential I/O pairs with aggregate bandwidth exceeding 100 Gb/s. Its LVDS and LVPECL interfaces operate at up to 622 Mb/s per lane, enabled by DLL-synchronized sampling and programmable input delay. This capability is confirmed in DS022-1 Table 1 and Module 2 architectural description for the XCV300E-6PQ240C device.
Does the XCV300E-6PQ240C support true dual-port block RAM?
Yes, the XCV300E-6PQ240C includes 32 block SelectRAM units, each providing true dual-port 4096-bit RAM with independent read/write addresses, enables, and clocks per port. This is documented in DS022-2 Module 2, Table 4, and Figure 6, and allows concurrent access for applications like FIFOs and ping-pong buffering without arbitration logic.
What clock management resources does the XCV300E-6PQ240C include?
The XCV300E-6PQ240C integrates eight fully digital Delay-Locked Loops (DLLs) supporting clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay conversion of high-speed LVPECL/LVDS inputs to any I/O standard. These DLLs are detailed in DS022-1 Features section and Module 2 architectural description for the XCV300E-6PQ240C.
Is the XCV300E-6PQ240C pin-compatible with other Virtex-E devices in the PQ240 package?
Yes, the XCV300E-6PQ240C shares identical pinout with other Virtex-E devices in the PQ240 package, including XCV100E, XCV200E, and XCV400E variants. DS022-1 explicitly states "same device in same package … are pin-compatible with some minor exceptions" and confirms PQ240 supports 316 user I/O across these densities.
What is the VCCINT supply requirement for the XCV300E-6PQ240C?
The XCV300E-6PQ240C requires a regulated 1.8 V ± 3% supply on VCCINT pins to power its core logic, CLBs, DLLs, and internal RAM. This lower voltage versus earlier Virtex families reduces dynamic power and enables higher density, as specified in DS022-1 General Description and Module 3 DC characteristics for the XCV300E-6PQ240C.
XCV300E-6PQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 6912
- Total RAM Bits:
- 131072
- Number of I/O:
- 158
- Number of Gates:
- 411955
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV300E-6PQ240C FAQ
1.How can I place an order for XCV300E-6PQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV300E-6PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV300E-6PQ240C reliable?
The price and inventory of XCV300E-6PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300E-6PQ240C is usually 5 days.
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Once your XCV300E-6PQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV300E-6PQ240C?
For technical support, including XCV300E-6PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300E-6PQ240C requirements.
6.How does Aetrix verify that XCV300E-6PQ240C is sourced from the original manufacturer or authorized distributors?
All XCV300E-6PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300E-6PQ240C meets industry standards.
7.What is the process for return or replacement of XCV300E-6PQ240C?
All XCV300E-6PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300E-6PQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV300E-6PQ240C part is unused and in its original packaging.
Return procedure for XCV300E-6PQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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