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AMD XCV300E-6PQ240C

Part No.:
XCV300E-6PQ240C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP
Datasheet:
AetrixXCV300E-6PQ240C.pdf
Description:
IC FPGA 158 I/O 240QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,314

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Product details

Overview

XCV300E-6PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 32 × 48 CLB array. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communication interface implementation.

For engineers reviewing the XCV300E-6PQ240C datasheet, pinout, applications, or equivalent options, this device serves as a production-grade Virtex-E FPGA targeting PCI-compliant 33/66-MHz systems, source-synchronous data transmission architectures, and high-bandwidth memory interfacing including 200 MHz ZBT SRAM and DDR SDRAM.

Technical Context

The XCV300E-6PQ240C implements a flexible architecture with configurable logic blocks (CLBs) containing four logic cells each, dual-slice organization, dedicated carry chains for arithmetic, and F5/F6 multiplexers enabling 5- to 6-input logic functions. Its IOBs support SelectI/O+ technology with independent clock enable, synchronous/asynchronous set/reset, and programmable delay for zero pad-to-pad hold time.

It integrates 131,072 bits of synchronous block RAM (32 × 4096-bit True Dual-Port blocks), 98,304 bits of distributed RAM, and eight fully digital DLLs offering clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay conversion of LVPECL/LVDS clocks to any I/O standard - all operating from a 1.8 V VCCINT supply.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 411,955 - defines total logic capacity for complex digital system integration
Logic Cells 6,912 - provides granular, routable logic resources for efficient place-and-route
CLB Array 32 × 48 - determines maximum combinational depth and register count per row/column
Block RAM Bits 131,072 - enables true dual-port memory access at up to 200 MHz for buffering and FIFOs
DLL Count 8 - allows independent clock domain management for multi-rate I/O and DDR interfaces
Max I/O Pins 316 user I/O - supports high-pin-count parallel buses and multiple differential channel groups
Speed Grade -6 - guarantees timing closure at 130 MHz internal performance (4-LUT level)
VCCINT 1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling higher density without thermal penalty

Pinout & Package

PQ240 package: 240-pin Plastic Quad Flatpack (PQFP), 0.5 mm pitch, 32.5 mm × 32.5 mm body size, lead-free compatible, with 316 user I/O pins distributed across 8 I/O banks (Bank 0–7), plus dedicated global clock inputs (GCLK0–GCLK3), configuration pins (M0–M2, INIT_B, PROGRAM_B, DONE), and power/ground pins (VCCINT, VCCO, GND).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Low-skew dedicated routing path to all DLLs and CLBs; required for synchronous system timing
M0–M2 Configuration Mode Select Determines boot mode (Master Serial, Slave Serial, SelectMAP, JTAG); sets startup behavior
INIT_B Configuration Initialization Status Active-low open-drain output indicating configuration memory readiness or error condition
PROGRAM_B Configuration Reset Active-low input that clears configuration memory and initiates reconfiguration sequence
DONE Configuration Completion Indicator Open-drain output asserted high when bitstream loading and CRC verification complete
VCCINT Core Logic Supply 1.8 V supply powering CLBs, DLLs, and internal RAM; decoupling critical for jitter control
VCCO_0–VCCO_7 I/O Bank Power Independent 1.5–3.3 V supplies per bank; defines output voltage and input threshold compatibility

Key Features

Feature Design Value
SelectI/O+ Technology Supports 20 I/O standards (LVTTL, LVCMOS, SSTL, HSTL, GTL+, LVDS, LVPECL) with per-bank VCCO/VREF control
SelectRAM+ Memory Hierarchy 131,072-bit block RAM + 98,304-bit distributed RAM enables mixed-depth, dual-port, and shift-register memory structures
SelectLink™ DDR Interface Hardware-optimized DDR link between FPGA fabric and external memory controllers using double-data-rate signaling
Digital DLLs Eight fully digital delay-locked loops provide jitter-free clock multiplication, division, phase alignment, and duty-cycle correction
IEEE 1149.1 Boundary Scan Full JTAG TAP controller integrated for board-level test, debug, and in-system programming
Die Temperature Sensor On-die diode enables real-time thermal monitoring for thermal throttling or reliability analysis

Applications

PCI 33/66-MHz Interface Source-Synchronous Data Acquisition

Use Scenario: Implementation of compliant 32-bit/33-MHz or 32-bit/66-MHz PCI bus master and target logic in embedded host adapters.

IC Role / Device Role / Timing Role: Configurable protocol engine handling address/data multiplexing, arbitration, burst transfers, and parity generation/checking.

Use Value: Leverages 3.3 V tolerant I/O, 130 MHz internal speed, and DLL-controlled setup/hold margins to meet PCI timing spec without external glue logic.

Use Scenario: High-speed ADC/DAC interface in test equipment or radar front-ends using source-synchronous strobes (e.g., LVDS DQS).

IC Role / Device Role / Timing Role: Real-time data capture and preprocessing unit synchronizing to external clock domains via DLL-aligned sampling windows.

Use Value: Achieves 622 Mb/s differential I/O bandwidth and zero pad-to-pad hold time using programmable input delay and DLL deskew.

DDR SDRAM Controller ZBT SRAM Interface

Use Scenario: Embedded memory controller for 200 Mb/s DDR SDRAM in networking packet buffers or video frame stores.

IC Role / Device Role / Timing Role: Timing-critical command/address/data path generator with DLL-synchronized write leveling and read DQS gating.

Use Value: Uses True Dual-Port BlockRAM for command queueing and DLL-matched clock outputs to meet DDR tAC/tDQS skew requirements.

Use Scenario: High-throughput buffer between processor and ZBT SRAM in telecom line cards requiring 200 MHz burst-mode access.

IC Role / Device Role / Timing Role: Burst-length-aware interface managing ZBT-specific early-write and late-read protocols with precise cycle alignment.

Use Value: Delivers 200 MHz synchronous operation using DLL-generated clocks and dedicated carry logic for address incrementing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV300E-7PQ240C Higher speed grade (-7): 140 MHz internal performance (vs. 130 MHz for -6), tighter timing margins, same pinout and logic resources Suitable for designs requiring additional timing slack or higher clock frequencies in critical paths Select when design fails timing closure at -6 grade or targets >130 MHz system clock
XCV400E-6PQ240C Larger device: 569,952 system gates, 10,800 logic cells, 40 × 60 CLB array, 163,840 block RAM bits - same PQ240 package Enables larger logic partitions, deeper memory buffers, or additional protocol stacks without PCB change Choose for design scalability where future feature expansion or higher gate count is anticipated

Compared with XCV300E-6PQ240C, the -7 variant improves timing margin without altering footprint or functionality, while the XCV400E-6PQ240C offers 38% more logic and 25% more block RAM in identical packaging - both serve as direct migration paths within the Virtex-E family.

Availability

XCV300E-6PQ240C is available at Aetrix Electronics and suitable for PCI interface development, source-synchronous data acquisition systems, DDR SDRAM controller implementation, and ZBT SRAM interfacing requiring stable component supply across industrial and communications product lifecycles.

Supply support for XCV300E-6PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-E product line was engineered for high-speed, high-density applications demanding advanced I/O flexibility, integrated memory, and deterministic clock management - specifically targeting communications infrastructure, test equipment, and embedded computing.

FAQ

What is the maximum differential I/O bandwidth supported by the XCV300E-6PQ240C?

The XCV300E-6PQ240C supports up to 344 differential I/O pairs with aggregate bandwidth exceeding 100 Gb/s. Its LVDS and LVPECL interfaces operate at up to 622 Mb/s per lane, enabled by DLL-synchronized sampling and programmable input delay. This capability is confirmed in DS022-1 Table 1 and Module 2 architectural description for the XCV300E-6PQ240C device.

Does the XCV300E-6PQ240C support true dual-port block RAM?

Yes, the XCV300E-6PQ240C includes 32 block SelectRAM units, each providing true dual-port 4096-bit RAM with independent read/write addresses, enables, and clocks per port. This is documented in DS022-2 Module 2, Table 4, and Figure 6, and allows concurrent access for applications like FIFOs and ping-pong buffering without arbitration logic.

What clock management resources does the XCV300E-6PQ240C include?

The XCV300E-6PQ240C integrates eight fully digital Delay-Locked Loops (DLLs) supporting clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay conversion of high-speed LVPECL/LVDS inputs to any I/O standard. These DLLs are detailed in DS022-1 Features section and Module 2 architectural description for the XCV300E-6PQ240C.

Is the XCV300E-6PQ240C pin-compatible with other Virtex-E devices in the PQ240 package?

Yes, the XCV300E-6PQ240C shares identical pinout with other Virtex-E devices in the PQ240 package, including XCV100E, XCV200E, and XCV400E variants. DS022-1 explicitly states "same device in same package … are pin-compatible with some minor exceptions" and confirms PQ240 supports 316 user I/O across these densities.

What is the VCCINT supply requirement for the XCV300E-6PQ240C?

The XCV300E-6PQ240C requires a regulated 1.8 V ± 3% supply on VCCINT pins to power its core logic, CLBs, DLLs, and internal RAM. This lower voltage versus earlier Virtex families reduces dynamic power and enables higher density, as specified in DS022-1 General Description and Module 3 DC characteristics for the XCV300E-6PQ240C.

XCV300E-6PQ240C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
240-BFQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
131072
Number of I/O:
158
Number of Gates:
411955
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV300E-6PQ240C FAQ

1.How can I place an order for XCV300E-6PQ240C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV300E-6PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV300E-6PQ240C reliable?

The price and inventory of XCV300E-6PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300E-6PQ240C is usually 5 days.

3.What payment methods are accepted for XCV300E-6PQ240C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300E-6PQ240C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV300E-6PQ240C?

XCV300E-6PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV300E-6PQ240C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV300E-6PQ240C?

For technical support, including XCV300E-6PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300E-6PQ240C requirements.

6.How does Aetrix verify that XCV300E-6PQ240C is sourced from the original manufacturer or authorized distributors?

All XCV300E-6PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300E-6PQ240C meets industry standards.

7.What is the process for return or replacement of XCV300E-6PQ240C?

All XCV300E-6PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300E-6PQ240C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV300E-6PQ240C part is unused and in its original packaging.

Return procedure for XCV300E-6PQ240C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV300E-6PQ240C Tags

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