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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV300E-6PQ240I

Name: XCV300E-6PQ240I
Brand: AMD
SKU: XCV300E-6PQ240I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV300E-6PQ240I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 240-BFQFP

Datasheet:: XCV300E-6PQ240I.pdf

Description:: IC FPGA 158 I/O 240QFP

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Product details

Overview

XCV300E-6PQ240I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 32 × 48 CLB array. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communication interface design.

For engineers reviewing the XCV300E-6PQ240I datasheet, pinout, applications, or equivalent options, this device is selected for PCI-compliant 33/66-MHz embedded control, DDR memory interfacing at 200 Mb/s, and source-synchronous data transmission architectures requiring deterministic clock management and flexible I/O banking.

Technical Context

The XCV300E-6PQ240I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 20 I/O standards-including LVTTL, SSTL3, HSTL, LVDS, and LVPECL-organized across eight voltage-banked I/O groups. VCCO-supplied input buffers (not VCCINT) and per-bank VREF constraints govern mixed-standard compatibility, while eight DLLs provide zero-delay clock conversion, duty-cycle correction, and frequency multiplication for DDR timing and high-speed clock domain bridging.

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	411,955 - defines total logic capacity for complex state machines and datapaths
Logic Cells	6,912 - provides granular resource allocation for HDL synthesis and place-and-route
CLB Array	32 × 48 - determines maximum routable interconnect density and floorplanning flexibility
Block RAM Bits	131,072 - enables true dual-port memory configurations up to 4096 × 32 per block
Differential I/O Pairs	137 - supports high-bandwidth SerDes-like interfaces using LVDS/BLVDS signaling
Max User I/O (PQ240)	158 - constrains PCB pin count and board-level signal integrity planning
Internal Performance	130 MHz (4-LUT level) - sets achievable clock frequency for combinatorial-heavy designs
Speed Grade	-6 - specifies worst-case timing margin for TCO, TPD, and setup/hold compliance

Pinout & Package

PQ240 package: 240-pin Plastic Quad Flatpack (PQFP), 0.5 mm pitch, 32.5 mm × 32.5 mm body, lead-free compatible, industrial temperature range (–40°C to +100°C).

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Input	Four dedicated low-skew clock inputs routed to all DLLs and CLBs
VCCINT	Core Supply	1.8 V power for logic and memory; requires tight regulation ±3%
VCCO_0–VCCO_7	I/O Bank Supply	Independent 1.5–3.3 V supplies per bank enabling mixed-voltage I/O
VREF_0–VREF_7	Input Threshold Reference	Per-bank reference for SSTL/HSTL/LVCMOS input buffers; must be externally sourced
TCK/TMS/TDI/TDO	JTAG Boundary Scan	IEEE 1149.1 compliant test access port for in-system programming and verification
PROGRAM_B	Configuration Reset	Active-low asynchronous reset that clears configuration memory and restarts boot

Key Features

Feature	Design Value
Eight Digital DLLs	Enables zero-delay clock distribution, 50% duty-cycle correction, and 4× frequency multiplication for DDR and source-synchronous interfaces
SelectRAM+™ Hierarchy	131,072 bits of true dual-port block RAM + 98,304 bits distributed RAM for pipelined memory-intensive algorithms
SelectI/O+™ Technology	Supports 20 I/O standards including LVPECL (300+ MHz clock inputs) and LVDS (622 Mb/s) with per-bank VCCO/VREF control
Flexible CLB Architecture	Each CLB contains 4 logic cells with 4-LUTs, dedicated carry chains, and dual flip-flops per slice for arithmetic and pipeline optimization
SRAM-Based Configuration	Unlimited in-system reprogramming via JTAG, SelectMAP, or master serial mode using external PROM

Applications

PCI Bridge Controller	DDR Memory Interface
Use Scenario: Implementing a configurable PCI-to-custom bus bridge in industrial motion controllers requiring real-time DMA and interrupt handling. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and timing arbiter, managing 33/66-MHz PCI clock domains and synchronizing burst transfers to local peripherals. Use Value: Leverages PCI-compliant I/O banks and DLL-controlled clock domain crossing to meet PCI specification tSU/tH and setup/hold timing without external glue logic.	Use Scenario: Interfacing with 200 Mb/s DDR SDRAM in video frame buffer subsystems for broadcast equipment. IC Role / Device Role / Timing Role: FPGA serves as memory controller with precise DQS strobe alignment, using DLL outputs to generate phase-aligned read/write clocks. Use Value: Achieves reliable DDR timing closure via digitally synthesized 50% duty cycle clocks and programmable I/O delay elements within IOBs.
Source-Synchronous Data Capture	LVDS Serializer/Deserializer
Use Scenario: Capturing high-speed parallel data from ADCs in radar signal processing systems operating at >200 MSPS. IC Role / Device Role / Timing Role: FPGA performs source-synchronous capture using LVDS inputs synchronized to an embedded clock, then processes samples in pipeline stages. Use Value: Uses LVDS-compatible differential inputs and DLL-mirrored clock paths to eliminate skew between data and capture clock, enabling >622 Mb/s valid data sampling.	Use Scenario: Building a custom 10-bit parallel-to-serial converter for optical transceiver modules using LVDS physical layer. IC Role / Device Role / Timing Role: FPGA implements serializer logic with embedded PLL-equivalent timing using DLL outputs to generate bit-clock multiples. Use Value: Delivers deterministic 622 Mb/s serial output using LVDS drivers and DLL-derived clocks, avoiding external clock multipliers or jitter-prone PLLs.

PCI Bridge Controller

DDR Memory Interface

Use Scenario: Implementing a configurable PCI-to-custom bus bridge in industrial motion controllers requiring real-time DMA and interrupt handling.

IC Role / Device Role / Timing Role: FPGA acts as protocol translator and timing arbiter, managing 33/66-MHz PCI clock domains and synchronizing burst transfers to local peripherals.

Use Value: Leverages PCI-compliant I/O banks and DLL-controlled clock domain crossing to meet PCI specification tSU/tH and setup/hold timing without external glue logic.

Use Scenario: Interfacing with 200 Mb/s DDR SDRAM in video frame buffer subsystems for broadcast equipment.

IC Role / Device Role / Timing Role: FPGA serves as memory controller with precise DQS strobe alignment, using DLL outputs to generate phase-aligned read/write clocks.

Use Value: Achieves reliable DDR timing closure via digitally synthesized 50% duty cycle clocks and programmable I/O delay elements within IOBs.

Source-Synchronous Data Capture

LVDS Serializer/Deserializer

Use Scenario: Capturing high-speed parallel data from ADCs in radar signal processing systems operating at >200 MSPS.

IC Role / Device Role / Timing Role: FPGA performs source-synchronous capture using LVDS inputs synchronized to an embedded clock, then processes samples in pipeline stages.

Use Value: Uses LVDS-compatible differential inputs and DLL-mirrored clock paths to eliminate skew between data and capture clock, enabling >622 Mb/s valid data sampling.

Use Scenario: Building a custom 10-bit parallel-to-serial converter for optical transceiver modules using LVDS physical layer.

IC Role / Device Role / Timing Role: FPGA implements serializer logic with embedded PLL-equivalent timing using DLL outputs to generate bit-clock multiples.

Use Value: Delivers deterministic 622 Mb/s serial output using LVDS drivers and DLL-derived clocks, avoiding external clock multipliers or jitter-prone PLLs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV300E-7PQ240I	Same architecture and pinout, but -7 speed grade offers 15% faster worst-case timing (e.g., 4.3 ns register-to-register vs. 5.1 ns for -6)	Better suited for designs pushing 133+ MHz internal clocks or tighter I/O timing margins	Select when timing closure fails on -6 grade or when migrating from prototype to production with margin headroom
XCV400E-6PQ240I	Higher density (569,952 system gates, 10,800 logic cells), same PQ240 package and -6 speed grade	Required for larger datapaths, additional memory blocks (163,840 bits), or expanded I/O count (still 158 pins but more internal routing resources)	Choose when design exceeds XCV300E-6PQ240I resource utilization or requires future scalability without PCB change

Compared with XCV300E-6PQ240I, the -7 variant improves timing margin without layout changes, while the XCV400E-6PQ240I increases logic and memory capacity within identical footprint-enabling incremental upgrades in gate count and bandwidth without redesigning the board.

Availability

XCV300E-6PQ240I is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, DDR memory interface designs, source-synchronous data acquisition systems, and LVDS-based high-speed serial link development requiring stable component supply over extended product lifecycles.

Supply support for XCV300E-6PQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-E family was designed for high-speed, high-density applications demanding advanced clock management, flexible I/O banking, and integrated memory-targeting communications infrastructure, test equipment, and industrial control systems.

FAQ

What is the core supply voltage requirement for XCV300E-6PQ240I?

XCV300E-6PQ240I requires a tightly regulated 1.8 V ±3% VCCINT supply for its internal logic and memory. Deviation beyond this tolerance risks timing violations, configuration corruption, or functional failure. The device does not support 2.5 V core operation, distinguishing it from earlier Virtex families.

Does XCV300E-6PQ240I support LVPECL clock inputs?

Yes, XCV300E-6PQ240I supports LVPECL clock inputs up to 300+ MHz through dedicated global clock pins (GCLK0–GCLK3). These inputs are compatible with standard LVPECL drivers and require proper termination (typically 50 Ω to VCCO – 2 V) to ensure signal integrity and jitter performance.

How many block RAMs does XCV300E-6PQ240I contain?

XCV300E-6PQ240I contains 32 block SelectRAM units totaling 131,072 bits. Each block is a true dual-port 4096-bit RAM with independent address, data, and control lines per port, supporting simultaneous read/write operations and built-in bus-width conversion.

Is XCV300E-6PQ240I pin-compatible with other Virtex-E devices in PQ240 packaging?

Yes, XCV300E-6PQ240I shares identical pinout and package dimensions with other Virtex-E devices offered in the PQ240 package (e.g., XCV100E-6PQ240I, XCV200E-6PQ240I), enabling footprint reuse across density grades-subject to I/O banking and VCCO/VREF pin allocation consistency.

What configuration modes are supported by XCV300E-6PQ240I?

XCV300E-6PQ240I supports JTAG (IEEE 1149.1), SelectMAP, slave serial, and master serial configuration modes. JTAG is used for debugging and in-system programming; SelectMAP enables high-speed parallel loading via microprocessor bus; master serial uses external PROM for autonomous boot.

XCV300E-6PQ240I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®-E

Package/Case:: 240-BFQFP

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 1536

Number of Logic Elements/Cells:: 6912

Total RAM Bits:: 131072

Number of I/O:: 158

Number of Gates:: 411955

Voltage - Supply:: 1.71V ~ 1.89V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 240-PQFP (32x32)

XCV300E-6PQ240I FAQ

1.How can I place an order for XCV300E-6PQ240I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV300E-6PQ240I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV300E-6PQ240I reliable?

The price and inventory of XCV300E-6PQ240I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300E-6PQ240I is usually 5 days.

3.What payment methods are accepted for XCV300E-6PQ240I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300E-6PQ240I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV300E-6PQ240I?

XCV300E-6PQ240I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV300E-6PQ240I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV300E-6PQ240I?

For technical support, including XCV300E-6PQ240I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300E-6PQ240I requirements.

6.How does Aetrix verify that XCV300E-6PQ240I is sourced from the original manufacturer or authorized distributors?

All XCV300E-6PQ240I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300E-6PQ240I meets industry standards.

7.What is the process for return or replacement of XCV300E-6PQ240I?

All XCV300E-6PQ240I units undergo pre-shipment inspection (PSI). If there is an issue with XCV300E-6PQ240I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV300E-6PQ240I part is unused and in its original packaging.

Return procedure for XCV300E-6PQ240I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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