AMD XCV300E-7BG352I

Overview

XCV300E-7BG352I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 352-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communications infrastructure.

For engineers reviewing the XCV300E-7BG352I datasheet, pinout, applications, or equivalent options, this device is selected for high-density, low-power reconfigurable logic in telecom line cards, protocol acceleration engines, and FPGA-based test equipment requiring deterministic clock management and multi-standard I/O.

Technical Context

The XCV300E-7BG352I implements a regular array architecture with configurable logic blocks (CLBs) and input/output blocks (IOBs) interconnected via a programmable routing matrix. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous/asynchronous set/reset.

Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR, and frequency multiplication up to 4×. I/O banks support mixed voltage standards including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS/LVPECL - all powered by bank-specific VCCO, not VCCINT.

Key Specifications

Pinout & Package

Package: 352-ball Ball Grid Array (BG352), 1.27 mm pitch, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV300E-6BG352I, the XCV300E-7BG352I delivers tighter timing closure for high-speed I/O and logic; compared with XCV400E-7BG352I, it offers identical speed and package compatibility at lower cost and power for mid-scale implementations.

Availability

XCV300E-7BG352I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XCV300E-7BG352I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and toolchain development for reconfigurable computing.

The Virtex-E family was designed for high-performance, low-power reconfigurable logic in communications and computing systems, emphasizing I/O flexibility, clock management, and memory hierarchy for ASIC replacement.

FAQ

What is the maximum LVDS data rate supported by the XCV300E-7BG352I?

The XCV300E-7BG352I supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Section "Differential Signalling Support". This rate applies to source-synchronous data transmission architectures using dedicated differential I/O pairs, and is validated under worst-case timing conditions for the -7 speed grade.

Does the XCV300E-7BG352I support PCI 66 MHz operation?

Yes, the XCV300E-7BG352I is PCI compliant for both 32/64-bit, 33 MHz and 66 MHz operation at 3.3 V, as stated in the "Features" section of DS022-1 (v2.3). Its I/O buffers meet PCI specification electrical requirements, and its DLLs support zero-delay clock conversion for PCI timing compliance.

How many block RAMs does the XCV300E-7BG352I contain?

The XCV300E-7BG352I contains 32 block RAMs totaling 131,072 bits, as specified in Table 4 of DS022-2 (v2.8). Each block is a true dual-port 4096-bit synchronous RAM with independent address/control per port, enabling efficient FIFO and buffer implementation.

Is the XCV300E-7BG352I pin-compatible with other Virtex-E devices in BG352 packaging?

Yes, the XCV300E-7BG352I shares the same BG352 pinout with XCV200E-7BG352I and XCV400E-7BG352I per DS022-1 Table 3 and Module 4 pinout documentation. However, I/O banking constraints and VCCO/VREF pin assignments must be verified per device density due to differing bank configurations.

What is the core supply voltage requirement for the XCV300E-7BG352I?

The XCV300E-7BG352I requires a 1.8 V ±3% supply on VCCINT for internal logic and memory operation, as documented in DS022-1 Section "General Description" and DS022-3 DC characteristics. This lower voltage versus prior Virtex families reduces dynamic power consumption while maintaining performance.