AMD XCV300E-7BG432C

Overview

XCV300E-7BG432C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 432-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communications infrastructure.

For engineers reviewing the XCV300E-7BG432C datasheet, pinout, applications, or equivalent options, key selection criteria include internal 130 MHz performance (four LUT levels), 1.8 V core voltage with 3.3 V I/O tolerance, DLL-based clock multiplication/division, true dual-port block RAM configuration, and compatibility with Xilinx Foundation™ and Alliance Series™ design tools.

Technical Context

The XCV300E-7BG432C implements a flexible CLB architecture with two slices per block, each containing four 4-input LUTs, dedicated carry logic, and configurable storage elements (flip-flops or latches) with independent clock enable, synchronous/asynchronous set/reset. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and up to 4× frequency multiplication.

I/O functionality is organized into eight banks with bank-specific VCCO and VREF requirements; supported standards include LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, BLVDS, and LVPECL. Input buffers for LVTTL/LVCMOS2/PCI are powered by VCCO-not VCCINT-enabling mixed-voltage I/O operation within bank constraints.

Key Specifications

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 1.0 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0 °C to +85 °C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV300E-7BG432C, the -6 variant trades 7% timing margin for lower cost and power, while the XCV400E-7BG432C offers 38% more logic and 28% more I/O in identical packaging-making it ideal for scalable platform designs where future-proofing justifies initial gate overhead.

Availability

XCV300E-7BG432C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, medical imaging subsystems, industrial motion control hubs, and PCI-compliant embedded computing requiring stable component supply across extended product lifecycles.

Supply support for XCV300E-7BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, historically known for FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-E family was engineered for high-performance, high-density digital system integration in telecommunications, test equipment, and industrial automation-emphasizing speed, I/O flexibility, and embedded memory hierarchy.

FAQ

What is the maximum operating junction temperature for XCV300E-7BG432C?

The XCV300E-7BG432C is rated for commercial temperature range (0 °C to +85 °C junction temperature). This specification is defined in the DS022-1 Production Product Specification, and thermal design must ensure adequate heatsinking or airflow to maintain Tj ≤ 85 °C under full static/dynamic loading conditions. The device includes an on-die temperature sensor diode for monitoring.

Does XCV300E-7BG432C support JTAG boundary scan testing?

Yes, XCV300E-7BG432C includes full IEEE 1149.1-compliant boundary scan logic. Pins TCK, TMS, TDI, and TDO are dedicated for this function, enabling in-circuit testing, configuration verification, and debug access. The boundary scan chain covers all user I/O and internal logic, and is documented in Module 4 (Pinout Tables) of the DS022-4 data sheet.

Can XCV300E-7BG432C interface directly with 200 MHz DDR SDRAM?

Yes, XCV300E-7BG432C supports 200 Mb/s DDR SDRAM interfaces via its SelectRAM+™ memory controller infrastructure and DLL-synchronized I/O. The device's LVDS-capable I/O banks and DLL-generated 50% duty cycle clocks meet timing requirements for DDR data capture, and reference designs for ZBT SRAM and DDR SDRAM are provided free by Xilinx.

Is XCV300E-7BG432C pin-compatible with other Virtex-E devices in BG432 packaging?

Yes, XCV300E-7BG432C shares identical BG432 pinout with XCV200E-7BG432C and XCV400E-7BG432C per Table 3 in DS022-1. All three devices use the same ball map, allowing PCB reuse across density tiers. However, unused pins may differ in function (e.g., additional VCCO/VREF balls in larger devices), requiring appropriate termination.

What configuration modes does XCV300E-7BG432C support?

XCV300E-7BG432C supports master serial (via external SPROM), slave serial, SelectMAP™ parallel, and JTAG configuration modes. Configuration data loads into internal SRAM on power-up or reset; PROGRAM_B initiates reconfiguration. Mode selection is controlled by mode pins M0–M2, and all methods are fully documented in DS022-2 (Functional Description) Module 2.