AMD XCV300E-7BG432I

Overview

XCV300E-7BG432I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 432-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communications infrastructure.

For engineers reviewing the XCV300E-7BG432I datasheet, pinout, applications, or equivalent options, this device is selected for high-density, high-performance reconfigurable logic in telecom line cards, protocol bridging engines, and real-time signal processing subsystems where deterministic clock management and multi-standard I/O interoperability are critical.

Technical Context

The XCV300E-7BG432I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR applications, and frequency multiplication up to 4×. The IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL-with banked VCCO and VREF constraints governing mixed-standard placement.

Key Specifications

Pinout & Package

The XCV300E-7BG432I is housed in a 432-ball fine-pitch Ball Grid Array (BG432) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal reliability in industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV300E-7BG432I, the -6 variant trades 8% speed for cost reduction while maintaining identical I/O and memory resources; the XCV400E-7BG432I retains pin compatibility but adds 38% more logic cells and 25% more block RAM for scalable upgrades.

Availability

XCV300E-7BG432I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and embedded signal processing requiring stable component supply across extended product lifecycles.

Supply support for XCV300E-7BG432I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was engineered for high-performance, high-density reconfigurable logic in mission-critical systems demanding deterministic timing, multi-standard I/O, and long-term industrial reliability.

FAQ

What is the maximum LVDS data rate supported by XCV300E-7BG432I?

XCV300E-7BG432I supports LVDS signaling at up to 622 Mb/s, verified in source-synchronous architectures per DS022-1. This rate is achievable using dedicated differential I/O pairs and proper PCB layout with controlled impedance and matched trace lengths. The device's DLLs ensure precise clock alignment for reliable data capture at this speed.

Does XCV300E-7BG432I support true dual-port block RAM?

Yes, XCV300E-7BG432I includes 32 block RAM units totaling 131,072 bits, each configured as true dual-port memory with independent read/write addresses, enables, and clocks per port. This allows concurrent access for applications like ping-pong buffering and FIFO implementation without external memory arbitration logic.

How many global clock inputs does XCV300E-7BG432I have?

XCV300E-7BG432I provides eight dedicated global clock inputs (GCLK0–GCLK7), each connected to the device's eight DLLs and distributed via low-skew routing networks. These pins accept LVPECL, LVDS, or single-ended clocks and support zero-delay conversion to any I/O standard through DLL configuration.

Is XCV300E-7BG432I pin-compatible with other Virtex-E devices in BG432 packaging?

Yes, XCV300E-7BG432I shares identical pinout with XCV200E-7BG432I and XCV400E-7BG432I per DS022-4 Pinout Tables. All three devices use the same 432-ball BGA footprint, allowing hardware reuse across density tiers-though I/O banking constraints and VCCO/VREF pin assignments must be verified for each specific design.

What is the core supply voltage requirement for XCV300E-7BG432I?

XCV300E-7BG432I requires a regulated 1.8 V ±3% supply on VCCINT pins for internal logic and memory operation. This voltage is distinct from I/O bank supplies (VCCO), which range from 1.5 V to 3.3 V depending on selected signaling standards. Decoupling capacitors must be placed near each VCCINT ball per Xilinx layout guidelines.