AMD XCV300E-7FG256C

Overview

XCV300E-7FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 176 user I/O pins in a 256-ball Fine-Pitch Ball Grid Array (FG256) package. It integrates eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communication subsystems in telecom line cards.

For engineers reviewing the XCV300E-7FG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and speed-grade–specific performance metrics for synchronous system clock rates up to 240 MHz and source-synchronous data transmission at 622 Mb/s.

Technical Context

The XCV300E-7FG256C implements a regular array architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), and a general routing matrix (GRM). Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous set/reset and clock enable.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL-organized across eight I/O banks with bank-specific VCCO and VREF requirements. All I/O buffers are powered by VCCO (not VCCINT), and differential signaling is supported on dedicated pin pairs with programmable termination and weak-keeper circuits.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, thermal pad optional. Dimensions: 17 mm × 17 mm. Compatible with standard BGA reflow profiles for 1.8 V core logic.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV300E-6FG256C, the XCV300E-7FG256C delivers tighter timing closure for 240 MHz system clocks and 622 Mb/s LVDS links; compared with XCV400E-7FG256C, it offers identical speed grade and package footprint but trades logic capacity and I/O count for lower cost and power in mid-scale implementations.

Availability

XCV300E-7FG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and protocol bridging applications requiring stable component supply and long-term obsolescence management.

Supply support for XCV300E-7FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and development tools for high-performance digital system design.

The Virtex-E family was designed for high-speed, high-density logic replacement in communications and computing systems, emphasizing I/O flexibility, embedded memory, and clock management for ASIC migration and rapid prototyping.

FAQ

What is the maximum operating junction temperature for XCV300E-7FG256C?

The XCV300E-7FG256C is rated for commercial temperature range (0 °C to +85 °C junction temperature). Its thermal design requires a maximum θ_JA of 32 °C/W under typical airflow conditions; derating applies above 70 °C ambient. The device includes an on-die temperature sensor diode for real-time monitoring, and thermal shutdown is not implemented-system-level thermal management is mandatory.

Does XCV300E-7FG256C support JTAG boundary scan for production testing?

Yes, XCV300E-7FG256C fully complies with IEEE 1149.1 boundary scan. It implements a 4-wire TAP controller with instruction register, bypass register, and boundary scan register supporting EXTEST, SAMPLE/PRELOAD, and IDCODE instructions. All user I/O pins and key internal nodes are accessible through the scan chain, enabling automated test pattern generation for PCB assembly verification.

Can XCV300E-7FG256C configure from a serial PROM in master mode?

Yes, XCV300E-7FG256C supports master serial configuration mode using an external serial PROM (e.g., Xilinx XC18V02). In this mode, the FPGA generates configuration clock CCLK and initiates read cycles automatically after PROGRAM_B assertion. The PROM must be SPI-compatible with 20 MHz max read speed; configuration bitstream size is 1.82 Mbits for full device initialization.

What I/O standards are supported on bank 0 of XCV300E-7FG256C?

Bank 0 of XCV300E-7FG256C supports LVTTL, LVCMOS2, PCI33_3, and SSTL3 I/II when VCCO_0 = 3.3 V and VREF_0 = 1.5 V. LVDS and LVPECL are not supported in bank 0 due to missing differential pin pairing in the FG256 pinout; those standards require banks with dedicated differential pairs (e.g., banks 2–5). GTL/GTL+ are compatible regardless of VCCO setting.

Is XCV300E-7FG256C pin-compatible with any Virtex family devices?

No, XCV300E-7FG256C is not pin-compatible with original Virtex devices (e.g., XCV300), despite identical FG256 packaging. Differences in I/O banking structure, VCCO/VREF pin allocation, and dedicated clock pin assignments (e.g., GCLK0 location) prevent direct substitution. Migration requires PCB layout revision and full timing revalidation-even for functionally equivalent designs.