AMD XCV300E-7FG256I

Overview

XCV300E-7FG256I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 176 user I/O pins in a 256-ball Fine-Pitch Ball Grid Array (FG256) package. It features eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of true dual-port block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V I/O standards for high-speed communication interfaces.

For engineers reviewing the XCV300E-7FG256I datasheet, pinout, applications, or equivalent options, this device serves as a high-density, low-power reprogrammable logic solution for telecom line cards, industrial motion controllers, and embedded vision preprocessing pipelines requiring deterministic timing, differential signaling, and on-chip memory hierarchy.

Technical Context

The XCV300E-7FG256I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and peripheral VersaRing™ routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 I/O standards-including LVDS (622 Mb/s), LVPECL, SSTL, and PCI-via banked VCCO/VREF supplies, with all input buffers powered by VCCO (not VCCINT) for LVTTL/LVCMOS2/PCI. Eight DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and 4× frequency multiplication.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV300E-7FG256I, the -6 variant trades 7% timing headroom for reduced power, while the XCV400E-7FG256I delivers 38% more logic cells in pin-compatible form-making it ideal for scalable platform designs where I/O count is fixed but logic growth is anticipated.

Availability

XCV300E-7FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and embedded vision applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.

Supply support for XCV300E-7FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density reconfigurable computing in wireline telecom, military/aerospace, and industrial control-emphasizing speed, I/O flexibility, and on-chip memory integration over cost-optimized alternatives.

FAQ

What is the maximum supported LVDS data rate for XCV300E-7FG256I?

The XCV300E-7FG256I supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 Table 2 and the SelectI/O+™ feature list. This rate is achievable using source-synchronous architectures with DLL-synchronized capture, and is validated for worst-case industrial temperature operation under the -7 speed grade.

Does XCV300E-7FG256I support true dual-port block RAM?

Yes, XCV300E-7FG256I includes 32 block RAM units totaling 131,072 bits, each configurable as true dual-port memory with independent read/write addresses, clocks, and enables per port. This capability is documented in DS022-2 Module 2 and enables concurrent access for applications like ping-pong buffering and FFT twiddle-factor lookup.

How many digital DLLs does XCV300E-7FG256I integrate?

XCV300E-7FG256I integrates eight fully digital Delay-Locked Loops (DLLs), doubling the count found in earlier Virtex devices. Each DLL supports clock multiply (up to 4×), divide, duty-cycle correction, and zero-delay conversion of LVPECL/LVDS inputs-critical for synchronizing multiple high-speed I/O banks and DDR interfaces.

Is XCV300E-7FG256I pin-compatible with other Virtex-E devices in FG256 packaging?

Yes, XCV300E-7FG256I shares identical FG256 pinout with XCV100E-7FG256I, XCV200E-7FG256I, and XCV400E-7FG256I per DS022-1 Module 4 pinout tables. However, I/O banking constraints, VCCO/VREF pin assignments, and unused pin states differ across densities-requiring careful review of bank-specific voltage and standard compatibility.

What is the VCCINT requirement for XCV300E-7FG256I?

XCV300E-7FG256I requires a regulated 1.8 V ±3% supply on VCCINT pins for core logic, CLBs, block RAM, and routing. This lower voltage versus 2.5 V Virtex devices reduces dynamic power consumption by ~40% at equivalent frequency, enabling higher logic density within thermal limits for industrial temperature operation.