AMD XCV300E-7FG456C

Overview

XCV300E-7FG456C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 456-ball Fine-Pitch Ball Grid Array (FG456) package. It integrates eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communication subsystems in telecom line cards.

For engineers reviewing the XCV300E-7FG456C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, low-voltage reconfigurable logic platform for source-synchronous data transmission, DDR memory interfacing, and clock-domain bridging in legacy telecom and industrial control systems requiring stable 133+ MHz internal timing and 240 MHz system-level operation.

Technical Context

The XCV300E-7FG456C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous set/reset and clock enable.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS/LVPECL-with banked VCCO and VREF management. Eight DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise clock domain control across mixed-signaling designs.

Key Specifications

Pinout & Package

Package: 456-ball Fine-Pitch Ball Grid Array (FG456), 1.0 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV300E-7FG456C, the -6 variant trades timing margin for lower unit cost in relaxed timing environments, while the XCV400E-7FG456C offers direct pin-compatible scalability-both retain identical I/O banking rules, DLL architecture, and SelectRAM+ hierarchy for seamless integration into existing PCB layouts.

Availability

XCV300E-7FG456C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging subsystems, and automated test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XCV300E-7FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined platforms for high-performance computing and embedded systems.

The Virtex-E family was designed for high-speed, high-density reconfigurable logic in telecom, military, and industrial applications-emphasizing low-voltage operation (1.8 V core), advanced I/O flexibility, and robust clock management for legacy system upgrades.

FAQ

What is the maximum supported LVDS data rate for XCV300E-7FG456C?

The XCV300E-7FG456C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Table 2 and Module 2 functional description. This rate applies to source-synchronous interfaces using dedicated differential I/O pairs and is validated under worst-case -7 speed grade timing conditions. The device uses internal termination and DLL-assisted clock recovery to maintain signal integrity at this rate without external retiming.

Does XCV300E-7FG456C support true dual-port block RAM?

Yes, XCV300E-7FG456C implements true dual-port block RAM with independent read/write addresses, enables, and clocks per port, as specified in DS022-2 (v2.8) Section "Block SelectRAM" and Table 4. Each of its 32 block RAMs (131,072 total bits) allows concurrent access-critical for FIFOs, buffer memory, and real-time data streaming applications where read and write operations must occur simultaneously without arbitration delay.

How many Delay-Locked Loops (DLLs) does XCV300E-7FG456C include?

XCV300E-7FG456C includes eight fully digital Delay-Locked Loops (DLLs), as documented in DS022-1 (v2.3) Features section and DS022-2 (v2.8) Architectural Description. These DLLs support clock multiply (up to 4×), divide, duty-cycle correction, and zero-delay conversion-enabling independent clock domain management for mixed I/O standards and DDR memory interfaces without external PLLs.

Is XCV300E-7FG456C pin-compatible with other Virtex-E devices in FG456 packaging?

XCV300E-7FG456C shares the same FG456 footprint and pinout with XCV200E-7FG456C and XCV400E-7FG456C, as verified in DS022-1 Table 3 and DS022-4 Pinout Tables. However, I/O bank assignments and VCCO/VREF pin allocations differ across densities-requiring careful review of bank-specific voltage constraints and signal placement during PCB reuse or migration.

What is the operating temperature range for XCV300E-7FG456C?

XCV300E-7FG456C is rated for commercial temperature operation from 0°C to +85°C, as indicated by the "C" suffix in its ordering code per DS022-1 Figure 1. This range is validated for sustained operation under full I/O loading and 133 MHz internal logic activity, with on-die thermal sensing supporting system-level thermal management in enclosed industrial enclosures.