AMD XCV300E-7FG456C0773

Overview

XCV300E-7FG456C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 32 × 48 CLB array. It delivers 130 MHz internal performance (four LUT levels), supports up to 312 user I/Os in FG456 package, and integrates eight digital Delay-Locked Loops (DLLs) for clock management - used in high-speed communication interface design and reconfigurable signal processing systems.

For engineers reviewing the XCV300E-7FG456C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration options, and real-world FPGA implementation considerations for legacy Virtex-E migration and industrial control logic replacement.

Technical Context

The XCV300E-7FG456C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice - enabling high-speed arithmetic and wide-input logic synthesis.

Its IOBs support 20 interface standards including LVDS (622 Mb/s), LVPECL, SSTL, HSTL, and PCI-compliant 3.3 V operation, with banked VCCO/VREF assignment requiring strict voltage segregation across eight I/O banks. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication - all operating independently per bank.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG456) with 456 solder balls, 1.0 mm pitch, and 27 mm × 27 mm body size. Designed for high-density PCB layouts with thermal and signal integrity optimization.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV300E-7FG456C, the -6 variant trades 0.3 ns timing margin for lower cost, while the XCV400E-7FG456C extends logic and memory resources without changing PCB layout - both retain identical DLL architecture, SelectI/O+ standards support, and 1.8 V VCCINT operation.

Availability

XCV300E-7FG456C is available at Aetrix Electronics and suitable for industrial control logic replacement, high-speed communication interface design, and legacy system emulation requiring stable component supply and long-term lifecycle support.

Supply support for XCV300E-7FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-capacity reconfigurable logic in telecommunications infrastructure, test equipment, and industrial automation - emphasizing I/O flexibility, clock management, and SRAM-based in-system reprogrammability.

FAQ

What is the maximum differential I/O pair count supported by XCV300E-7FG456C?

XCV300E-7FG456C supports up to 137 differential I/O pairs, as specified in Table 1 of DS022-1. This count is fixed for the XCV300E device regardless of package; the FG456 package provides 312 total user I/Os, allowing flexible allocation between single-ended and differential signaling based on bank constraints and VCCO/VREF assignments.

Does XCV300E-7FG456C support LVPECL clock inputs?

Yes, XCV300E-7FG456C supports LVPECL clock inputs up to 300+ MHz, as confirmed in the Features section of DS022-1. LVPECL signals can be applied to dedicated global clock pins (GCLK0–GCLK7), and the integrated DLLs perform zero-delay conversion to internal 1.8 V logic levels for distribution across the device.

Is XCV300E-7FG456C pin-compatible with other Virtex-E devices in FG456 package?

XCV300E-7FG456C is pin-compatible with XCV200E-7FG456C and XCV400E-7FG456C in the same FG456 package, as stated in "Virtex-E Compared to Virtex Devices" section. All share identical ball map, power pin locations, and JTAG interface - though I/O bank voltage assignments and unused pin states differ per device density.

What is the block RAM configuration capability of XCV300E-7FG456C?

XCV300E-7FG456C contains 32 block SelectRAM units totaling 131,072 bits, each configurable as true dual-port 4096-bit RAM with independent width settings per port. These blocks support built-in bus-width conversion and are arranged in columns aligned with CLB arrays - enabling efficient FIFO, buffer, and coefficient storage in DSP pipelines.

Can XCV300E-7FG456C operate in industrial temperature range?

No, XCV300E-7FG456C is specified only for commercial temperature range (0°C to +85°C), indicated by the 'C' suffix in its ordering code. Industrial-grade variants (e.g., XCV300E-7FG456I) exist but require separate ordering; the C-grade version is not rated or tested for -40°C to +100°C operation.