AMD XCV300E-7FG456I

Overview

XCV300E-7FG456I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 456-ball Fine-Pitch Ball Grid Array (FG456) package. It features eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V interfaces for high-speed data acquisition and communication systems.

For engineers reviewing the XCV300E-7FG456I datasheet, pinout, applications, or equivalent options, this device is selected for demanding embedded signal processing, protocol bridging, and reconfigurable computing where deterministic clock management, differential I/O bandwidth >100 Gb/s, and dual-port memory architecture are required.

Technical Context

The XCV300E-7FG456I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, set/reset, and polarity control.

Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR applications, and frequency multiplication up to 4×. The IOBs support 20 interface standards-including LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz-with banked VCCO/VREF domains and IEEE 1149.1 boundary-scan compliance.

Key Specifications

Pinout & Package

Package: 456-ball Fine-Pitch Ball Grid Array (FG456), 1.0 mm pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV300E-7FG456I, the -6 variant trades timing margin for cost in less demanding applications, while the XCV400E-7FG456I extends logic and memory headroom within identical mechanical and thermal constraints-enabling scalable design reuse.

Availability

XCV300E-7FG456I is available at Aetrix Electronics and suitable for high-reliability industrial motion control, aerospace data concentrators, and medical imaging subsystems requiring stable component supply across extended product lifecycles.

Supply support for XCV300E-7FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic solutions, delivering FPGAs, SoCs, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was engineered for high-performance, low-power reconfigurable computing in telecom infrastructure, test equipment, and real-time signal processing-leveraging 0.18 μm CMOS and advanced I/O architecture.

FAQ

What is the maximum LVDS data rate supported by XCV300E-7FG456I?

XCV300E-7FG456I supports LVDS signaling at up to 622 Mb/s, verified per DS022-3 switching characteristics. This rate applies to source-synchronous interfaces using dedicated differential I/O pairs, with proper PCB impedance control (100 Ω differential) and termination. The value is measured under worst-case industrial temperature and voltage conditions for the -7 speed grade.

Does XCV300E-7FG456I support true dual-port block RAM operation?

Yes, XCV300E-7FG456I includes 32 block RAM units, each providing true dual-port synchronous access with independent read/write addresses, clocks, and enables. Each 4096-bit block can be configured as 512×8, 256×16, or 1024×4, enabling concurrent data ingestion and consumption-critical for video line buffers and protocol FIFOs.

How many DLLs does XCV300E-7FG456I integrate, and what are their key functions?

XCV300E-7FG456I integrates eight fully digital Delay-Locked Loops (DLLs). Each provides zero-delay clock forwarding, 50% duty-cycle correction for DDR I/O, frequency multiplication up to 4×, and phase alignment across multiple clock domains-eliminating external clock synthesizers in multi-standard interface designs.

What I/O standards are supported by XCV300E-7FG456I for PCI compliance?

XCV300E-7FG456I is fully compliant with PCI 3.3 V, 32/64-bit, 33/66 MHz specifications. Its I/O banks support LVTTL and PCI33_3/PCI66_3 standards with 3 V tolerance, 24 mA drive strength, and controlled slew rates-meeting PCI SIG electrical requirements without external bus terminators.

Is XCV300E-7FG456I pin-compatible with other Virtex-E devices in the FG456 package?

XCV300E-7FG456I shares the FG456 package footprint with XCV200E-7FG456I and XCV400E-7FG456I, but pin assignments differ due to varying I/O counts and bank layouts. While mechanical mounting is identical, signal routing requires device-specific pinout validation per DS022-4 Module 4-no automatic pin-to-pin compatibility exists across densities.