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AMD XCV300E-7PQ240C

Part No.:
XCV300E-7PQ240C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP
Datasheet:
AetrixXCV300E-7PQ240C.pdf
Description:
IC FPGA 158 I/O 240QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,802

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Product details

Overview

XCV300E-7PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 240-pin PQ (Plastic Quad Flat) package. It features eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V I/O for high-speed communication in telecom line cards.

For engineers reviewing the XCV300E-7PQ240C datasheet, pinout, applications, or equivalent options, this device is selected for designs requiring deterministic clock management, source-synchronous data transfer at 622 Mb/s, dual-port memory integration, and reprogrammable logic density exceeding 400k system gates in commercial temperature range (0°C to +85°C).

Technical Context

The XCV300E-7PQ240C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous set/reset and clock enable.

I/O functionality is organized into eight voltage-banked groups, each supporting mixed standards (e.g., LVTTL, LVCMOS2, SSTL3) under shared VCCO and optional VREF. The device uses 0.18 μm 6-layer metal CMOS process, with internal VCCINT = 1.8 V and 3.3 V-tolerant I/O pins, enabling PCI 33/66 MHz compliance without level-shifting.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 411,955 - defines total logic capacity for ASIC replacement or complex digital subsystem implementation
Logic Cells 6,912 - provides granular, routable logic resources with dedicated carry and arithmetic support
User I/O Pins 316 - enables high-bandwidth interface aggregation (e.g., multiple DDR SDRAM channels or parallel bus interfaces)
Block RAM Bits 131,072 - delivers true dual-port synchronous memory for FIFOs, frame buffers, or protocol engines
DLL Count 8 - allows independent clock domain management, zero-delay clock conversion, and 50% duty-cycle synthesis for DDR
Max I/O Speed 622 Mb/s (LVDS) - supports source-synchronous SerDes-like links without external PHY
Internal Performance 130 MHz (4-LUT levels) - ensures timing closure for pipelined datapaths in DSP or control applications

Pinout & Package

PQ240 package: 240-pin Plastic Quad Flat, 0.5 mm pitch, 32.5 mm × 32.5 mm body, lead-free compatible, commercial temperature grade (C).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Inputs Four dedicated low-skew clock inputs routed to all DLLs and CLBs; support LVPECL/LVDS at >300 MHz
VCCINT Core Supply 1.8 V supply for logic and RAM; decoupling required within 1 cm of each pin to maintain signal integrity
VCCO_0–VCCO_7 I/O Bank Supplies Eight independent VCCO rails (3.3 V/2.5 V/1.8 V selectable per bank) enabling mixed-voltage I/O interfacing
VREF_0–VREF_7 Input Threshold Reference Bank-specific reference voltage inputs for SSTL, HSTL, GTL; must be externally sourced and stable ±1%
TCK/TMS/TDI/TDO JTAG Boundary Scan IEEE 1149.1-compliant test access port for configuration, debug, and in-system verification

Key Features

Feature Design Value
SelectI/O+™ Technology Supports 20 I/O standards (LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, LVPECL) across 8 voltage-banked I/O groups
SelectRAM+™ Memory Hierarchy 131,072-bit synchronous block RAM + 98,304-bit distributed RAM; true dual-port capability with independent read/write clocks
Digital Delay-Locked Loops (DLLs) Eight fully digital DLLs with 4× frequency multiplication, zero-delay clock conversion, and 50% duty-cycle correction for DDR
Arithmetic-Optimized CLB Dedicated carry chain per slice, 2-bit full adder per slice, and AND gate for efficient multiplier implementation
Configuration Flexibility SRAM-based bitstream loading via JTAG, SelectMAP™, or master serial SPROM; unlimited in-system reprogramming

Applications

Telecom Line Card High-Speed Test Equipment

Use Scenario: Aggregating and processing multiple TDM/Ethernet streams in modular optical transport systems.

IC Role / Device Role / Timing Role: FPGA fabric implements packet classification, rate adaptation, and jitter cleaning using integrated DLLs and block RAM.

Use Value: 316 I/O pins enable concurrent connection to multiple PHYs and memory interfaces; 622 Mb/s LVDS supports OC-48 framer interfaces.

Use Scenario: Real-time pattern generation and response analysis in automated semiconductor test platforms.

IC Role / Device Role / Timing Role: Configurable logic executes high-speed stimulus sequencing while DLLs synchronize capture clocks to DUT output.

Use Value: Eight DLLs allow independent phase alignment across 4+ parallel test channels; 131,072-bit block RAM stores multi-cycle test vectors.

Industrial Motion Controller Medical Imaging Interface

Use Scenario: Closed-loop servo coordination across 8+ axes with real-time safety monitoring.

IC Role / Device Role / Timing Role: FPGA implements PWM generation, encoder interpolation, and functional safety logic (IEC 61508 SIL-2).

Use Value: Dedicated carry logic enables sub-10 ns position loop latency; 1.8 V core reduces thermal load in sealed enclosures.

Use Scenario: High-throughput image data bridging between ultrasound transducer arrays and DDR2 memory subsystems.

IC Role / Device Role / Timing Role: FPGA acts as pixel pipeline processor and memory controller, leveraging dual-port block RAM for ping-pong buffering.

Use Value: 200 MHz ZBT SRAM and DDR SDRAM support interfaces; 32 CLB columns adjacent to RAM blocks minimize interconnect delay.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV300E-6PQ240C Slower speed grade (-6 vs. -7); 0.3 ns longer register-to-register delay (4.6 ns vs. 4.3 ns) Suitable for non-critical timing paths or lower-frequency clock domains (≤120 MHz system clock) Select when design meets timing with margin and cost reduction is prioritized over peak performance.
XCV400E-7PQ240C Higher density (569,952 system gates, 10,800 logic cells); same PQ240 package and pinout Enables larger state machines or additional protocol stacks without PCB redesign Choose when future scalability or added logic capacity is required; identical footprint allows drop-in upgrade path.

Compared with XCV300E-7PQ240C, the -6 variant trades speed for cost in stable environments, while the XCV400E-7PQ240C offers higher logic density with full pin compatibility-making it a direct migration option for evolving designs needing more gates without layout change.

Availability

XCV300E-7PQ240C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, high-speed test instrumentation, and medical imaging equipment requiring stable component supply across extended production lifecycles.

Supply support for XCV300E-7PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density reconfigurable logic in communications and computing systems where speed, I/O flexibility, and memory integration are critical.

FAQ

What is the maximum operating frequency of the XCV300E-7PQ240C internal logic?

The XCV300E-7PQ240C achieves 130 MHz internal performance for four-LUT-level logic paths, as specified in DS022-1 (v2.3). This is measured under worst-case timing conditions and assumes proper placement and routing. The actual achievable frequency depends on design topology, but representative circuits like pipelined multipliers reach 311 MHz. The XCV300E-7PQ240C's eight DLLs support clock multiplication and duty-cycle correction to sustain high-speed operation.

Does the XCV300E-7PQ240C support JTAG boundary scan?

Yes, the XCV300E-7PQ240C includes IEEE 1149.1-compliant boundary-scan logic. Pins TCK, TMS, TDI, and TDO are dedicated for JTAG configuration, debugging, and in-system verification. This capability enables programming, testing, and diagnostics without requiring external test fixtures. The XCV300E-7PQ240C's boundary-scan implementation is fully documented in Module 4 (Pinout Tables) of DS022-4.

What I/O standards are supported by the XCV300E-7PQ240C?

The XCV300E-7PQ240C supports 20 I/O standards via SelectI/O+™ technology, including LVTTL, LVCMOS2, SSTL3 I/II, HSTL I/III/IV, LVDS, BLVDS, LVPECL, PCI33_3, and PCI66_3. Standards are grouped into eight voltage-banked I/O sections, each with independent VCCO and optional VREF. The XCV300E-7PQ240C does not support 5 V PCI; its I/O pins are 3.3 V tolerant and require external 100 Ω resistors for 5 V tolerance.

How much block RAM is available in the XCV300E-7PQ240C?

The XCV300E-7PQ240C integrates 32 block SelectRAM units totaling 131,072 bits of synchronous memory. Each block is a true dual-port 4096-bit RAM with independent read/write clocks and configurable data widths. This memory is arranged in columns adjacent to CLB arrays, enabling low-latency access for FIFOs, buffer memories, or lookup tables. The XCV300E-7PQ240C also provides 98,304 bits of distributed RAM implemented in LUTs.

Is the XCV300E-7PQ240C pin-compatible with other Virtex-E devices in PQ240 packaging?

Yes, the XCV300E-7PQ240C shares the same PQ240 pinout with other Virtex-E devices in that package, including XCV200E-7PQ240C and XCV400E-7PQ240C. Xilinx confirms pin compatibility across the Virtex-E family for identical packages, with only minor exceptions documented in the pinout tables (Module 4 of DS022). This allows hardware reuse and scalable logic upgrades. The XCV300E-7PQ240C's pin mapping is fixed and verified in DS022-4.

XCV300E-7PQ240C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
240-BFQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
131072
Number of I/O:
158
Number of Gates:
411955
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV300E-7PQ240C FAQ

1.How can I place an order for XCV300E-7PQ240C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV300E-7PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV300E-7PQ240C reliable?

The price and inventory of XCV300E-7PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300E-7PQ240C is usually 5 days.

3.What payment methods are accepted for XCV300E-7PQ240C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300E-7PQ240C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV300E-7PQ240C?

XCV300E-7PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV300E-7PQ240C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV300E-7PQ240C?

For technical support, including XCV300E-7PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300E-7PQ240C requirements.

6.How does Aetrix verify that XCV300E-7PQ240C is sourced from the original manufacturer or authorized distributors?

All XCV300E-7PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300E-7PQ240C meets industry standards.

7.What is the process for return or replacement of XCV300E-7PQ240C?

All XCV300E-7PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300E-7PQ240C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV300E-7PQ240C part is unused and in its original packaging.

Return procedure for XCV300E-7PQ240C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV300E-7PQ240C Tags

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