AMD XCV300E-7PQ240C
- Part No.:
- XCV300E-7PQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCV300E-7PQ240C.pdf
- Description:
- IC FPGA 158 I/O 240QFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV300E-7PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 240-pin PQ (Plastic Quad Flat) package. It features eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V I/O for high-speed communication in telecom line cards.
For engineers reviewing the XCV300E-7PQ240C datasheet, pinout, applications, or equivalent options, this device is selected for designs requiring deterministic clock management, source-synchronous data transfer at 622 Mb/s, dual-port memory integration, and reprogrammable logic density exceeding 400k system gates in commercial temperature range (0°C to +85°C).
Technical Context
The XCV300E-7PQ240C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous set/reset and clock enable.
I/O functionality is organized into eight voltage-banked groups, each supporting mixed standards (e.g., LVTTL, LVCMOS2, SSTL3) under shared VCCO and optional VREF. The device uses 0.18 μm 6-layer metal CMOS process, with internal VCCINT = 1.8 V and 3.3 V-tolerant I/O pins, enabling PCI 33/66 MHz compliance without level-shifting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 411,955 - defines total logic capacity for ASIC replacement or complex digital subsystem implementation |
| Logic Cells | 6,912 - provides granular, routable logic resources with dedicated carry and arithmetic support |
| User I/O Pins | 316 - enables high-bandwidth interface aggregation (e.g., multiple DDR SDRAM channels or parallel bus interfaces) |
| Block RAM Bits | 131,072 - delivers true dual-port synchronous memory for FIFOs, frame buffers, or protocol engines |
| DLL Count | 8 - allows independent clock domain management, zero-delay clock conversion, and 50% duty-cycle synthesis for DDR |
| Max I/O Speed | 622 Mb/s (LVDS) - supports source-synchronous SerDes-like links without external PHY |
| Internal Performance | 130 MHz (4-LUT levels) - ensures timing closure for pipelined datapaths in DSP or control applications |
Pinout & Package
PQ240 package: 240-pin Plastic Quad Flat, 0.5 mm pitch, 32.5 mm × 32.5 mm body, lead-free compatible, commercial temperature grade (C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Four dedicated low-skew clock inputs routed to all DLLs and CLBs; support LVPECL/LVDS at >300 MHz |
| VCCINT | Core Supply | 1.8 V supply for logic and RAM; decoupling required within 1 cm of each pin to maintain signal integrity |
| VCCO_0–VCCO_7 | I/O Bank Supplies | Eight independent VCCO rails (3.3 V/2.5 V/1.8 V selectable per bank) enabling mixed-voltage I/O interfacing |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage inputs for SSTL, HSTL, GTL; must be externally sourced and stable ±1% |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for configuration, debug, and in-system verification |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, LVPECL) across 8 voltage-banked I/O groups |
| SelectRAM+™ Memory Hierarchy | 131,072-bit synchronous block RAM + 98,304-bit distributed RAM; true dual-port capability with independent read/write clocks |
| Digital Delay-Locked Loops (DLLs) | Eight fully digital DLLs with 4× frequency multiplication, zero-delay clock conversion, and 50% duty-cycle correction for DDR |
| Arithmetic-Optimized CLB | Dedicated carry chain per slice, 2-bit full adder per slice, and AND gate for efficient multiplier implementation |
| Configuration Flexibility | SRAM-based bitstream loading via JTAG, SelectMAP™, or master serial SPROM; unlimited in-system reprogramming |
Applications
| Telecom Line Card | High-Speed Test Equipment |
|---|---|
Use Scenario: Aggregating and processing multiple TDM/Ethernet streams in modular optical transport systems. IC Role / Device Role / Timing Role: FPGA fabric implements packet classification, rate adaptation, and jitter cleaning using integrated DLLs and block RAM. Use Value: 316 I/O pins enable concurrent connection to multiple PHYs and memory interfaces; 622 Mb/s LVDS supports OC-48 framer interfaces. |
Use Scenario: Real-time pattern generation and response analysis in automated semiconductor test platforms. IC Role / Device Role / Timing Role: Configurable logic executes high-speed stimulus sequencing while DLLs synchronize capture clocks to DUT output. Use Value: Eight DLLs allow independent phase alignment across 4+ parallel test channels; 131,072-bit block RAM stores multi-cycle test vectors. |
| Industrial Motion Controller | Medical Imaging Interface |
Use Scenario: Closed-loop servo coordination across 8+ axes with real-time safety monitoring. IC Role / Device Role / Timing Role: FPGA implements PWM generation, encoder interpolation, and functional safety logic (IEC 61508 SIL-2). Use Value: Dedicated carry logic enables sub-10 ns position loop latency; 1.8 V core reduces thermal load in sealed enclosures. |
Use Scenario: High-throughput image data bridging between ultrasound transducer arrays and DDR2 memory subsystems. IC Role / Device Role / Timing Role: FPGA acts as pixel pipeline processor and memory controller, leveraging dual-port block RAM for ping-pong buffering. Use Value: 200 MHz ZBT SRAM and DDR SDRAM support interfaces; 32 CLB columns adjacent to RAM blocks minimize interconnect delay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300E-6PQ240C | Slower speed grade (-6 vs. -7); 0.3 ns longer register-to-register delay (4.6 ns vs. 4.3 ns) | Suitable for non-critical timing paths or lower-frequency clock domains (≤120 MHz system clock) | Select when design meets timing with margin and cost reduction is prioritized over peak performance. |
| XCV400E-7PQ240C | Higher density (569,952 system gates, 10,800 logic cells); same PQ240 package and pinout | Enables larger state machines or additional protocol stacks without PCB redesign | Choose when future scalability or added logic capacity is required; identical footprint allows drop-in upgrade path. |
Compared with XCV300E-7PQ240C, the -6 variant trades speed for cost in stable environments, while the XCV400E-7PQ240C offers higher logic density with full pin compatibility-making it a direct migration option for evolving designs needing more gates without layout change.
Availability
XCV300E-7PQ240C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, high-speed test instrumentation, and medical imaging equipment requiring stable component supply across extended production lifecycles.
Supply support for XCV300E-7PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex-E family was designed for high-performance, high-density reconfigurable logic in communications and computing systems where speed, I/O flexibility, and memory integration are critical.
FAQ
What is the maximum operating frequency of the XCV300E-7PQ240C internal logic?
The XCV300E-7PQ240C achieves 130 MHz internal performance for four-LUT-level logic paths, as specified in DS022-1 (v2.3). This is measured under worst-case timing conditions and assumes proper placement and routing. The actual achievable frequency depends on design topology, but representative circuits like pipelined multipliers reach 311 MHz. The XCV300E-7PQ240C's eight DLLs support clock multiplication and duty-cycle correction to sustain high-speed operation.
Does the XCV300E-7PQ240C support JTAG boundary scan?
Yes, the XCV300E-7PQ240C includes IEEE 1149.1-compliant boundary-scan logic. Pins TCK, TMS, TDI, and TDO are dedicated for JTAG configuration, debugging, and in-system verification. This capability enables programming, testing, and diagnostics without requiring external test fixtures. The XCV300E-7PQ240C's boundary-scan implementation is fully documented in Module 4 (Pinout Tables) of DS022-4.
What I/O standards are supported by the XCV300E-7PQ240C?
The XCV300E-7PQ240C supports 20 I/O standards via SelectI/O+™ technology, including LVTTL, LVCMOS2, SSTL3 I/II, HSTL I/III/IV, LVDS, BLVDS, LVPECL, PCI33_3, and PCI66_3. Standards are grouped into eight voltage-banked I/O sections, each with independent VCCO and optional VREF. The XCV300E-7PQ240C does not support 5 V PCI; its I/O pins are 3.3 V tolerant and require external 100 Ω resistors for 5 V tolerance.
How much block RAM is available in the XCV300E-7PQ240C?
The XCV300E-7PQ240C integrates 32 block SelectRAM units totaling 131,072 bits of synchronous memory. Each block is a true dual-port 4096-bit RAM with independent read/write clocks and configurable data widths. This memory is arranged in columns adjacent to CLB arrays, enabling low-latency access for FIFOs, buffer memories, or lookup tables. The XCV300E-7PQ240C also provides 98,304 bits of distributed RAM implemented in LUTs.
Is the XCV300E-7PQ240C pin-compatible with other Virtex-E devices in PQ240 packaging?
Yes, the XCV300E-7PQ240C shares the same PQ240 pinout with other Virtex-E devices in that package, including XCV200E-7PQ240C and XCV400E-7PQ240C. Xilinx confirms pin compatibility across the Virtex-E family for identical packages, with only minor exceptions documented in the pinout tables (Module 4 of DS022). This allows hardware reuse and scalable logic upgrades. The XCV300E-7PQ240C's pin mapping is fixed and verified in DS022-4.
XCV300E-7PQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 6912
- Total RAM Bits:
- 131072
- Number of I/O:
- 158
- Number of Gates:
- 411955
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV300E-7PQ240C FAQ
1.How can I place an order for XCV300E-7PQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV300E-7PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV300E-7PQ240C reliable?
The price and inventory of XCV300E-7PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300E-7PQ240C is usually 5 days.
3.What payment methods are accepted for XCV300E-7PQ240C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300E-7PQ240C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV300E-7PQ240C?
XCV300E-7PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV300E-7PQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV300E-7PQ240C?
For technical support, including XCV300E-7PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300E-7PQ240C requirements.
6.How does Aetrix verify that XCV300E-7PQ240C is sourced from the original manufacturer or authorized distributors?
All XCV300E-7PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300E-7PQ240C meets industry standards.
7.What is the process for return or replacement of XCV300E-7PQ240C?
All XCV300E-7PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300E-7PQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV300E-7PQ240C part is unused and in its original packaging.
Return procedure for XCV300E-7PQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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