AMD XCV300E-8BG432C

Overview

XCV300E-8BG432C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 432-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communications infrastructure.

For engineers reviewing the XCV300E-8BG432C datasheet, pinout, applications, or equivalent options, this device is selected for high-density reconfigurable logic in telecom line cards, protocol bridging, and embedded vision preprocessing where deterministic clock management and multi-standard I/O are critical.

Technical Context

The XCV300E-8BG432C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

I/O functionality is organized into eight banks, each supporting mixed voltage standards (e.g., LVTTL, LVCMOS2, SSTL3) under shared VCCO and optional VREF. The device integrates 32 block RAMs (4096-bit each, true dual-port), eight DLLs for zero-delay clock conversion and 50% duty-cycle synthesis, and SelectI/O+ circuitry enabling 622 Mb/s LVDS differential signaling with programmable drive strength and slew rate control.

Key Specifications

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 1.0 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV300E-7BG432C, the XCV300E-8BG432C delivers 12% faster internal timing for high-throughput datapaths; compared with XCV400E-8BG432C, it offers identical speed grade and package form factor but trades 158,000 system gates for guaranteed pin compatibility and lower BOM cost.

Availability

XCV300E-8BG432C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, embedded vision, and protocol bridging applications requiring stable component supply and long-term obsolescence management.

Supply support for XCV300E-8BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, adaptive SoCs, and software tools for high-performance digital systems.

The Virtex-E family was designed for high-speed, high-density reconfigurable computing in wired communications, test equipment, and military systems where SRAM-based flexibility and deterministic timing are essential.

FAQ

What is the maximum operating junction temperature for XCV300E-8BG432C?

The XCV300E-8BG432C is rated for commercial temperature range (0°C to +85°C). Its junction temperature must not exceed +100°C under steady-state conditions. Thermal design must account for 1.8 V core power dissipation and I/O switching activity; the integrated die-temperature sensor diode enables real-time monitoring via external ADC.

Does XCV300E-8BG432C support JTAG boundary scan for production testing?

Yes, XCV300E-8BG432C includes full IEEE 1149.1 boundary-scan logic with TCK, TMS, TDI, and TDO pins. This enables in-circuit testing of solder joints, interconnect integrity, and pre-configuration verification without requiring functional firmware, making it suitable for high-reliability manufacturing environments.

Can XCV300E-8BG432C interface directly with 200 MHz DDR SDRAM?

Yes, XCV300E-8BG432C supports 200 Mb/s DDR SDRAM interfaces using its SelectI/O+ technology and DLL-controlled clocking. The device provides source-synchronous strobes, programmable output delays, and dedicated capture registers to meet DDR setup/hold windows; reference designs are provided in Xilinx Application Note XAPP130.

How many block RAMs does XCV300E-8BG432C contain, and what is their configuration flexibility?

XCV300E-8BG432C contains 32 block RAMs, each 4096 bits with true dual-port capability. Each port supports independent data widths (1–36 bits) and depths (up to 4096), enabling asymmetric configurations such as 256×32 write / 512×16 read for video line buffers or packet header extraction.

Is XCV300E-8BG432C pin-compatible with earlier Virtex devices?

No, XCV300E-8BG432C is not bitstream- or pin-compatible with original Virtex devices. While some BG432 packages share mechanical dimensions, the XCV300E-8BG432C has distinct pin assignments for VCCO, VREF, and global clocks; migration requires full PCB and HDL redesign per Xilinx DS022-4 Pinout Tables.