AMD XCV300E-8FG256C

Overview

XCV300E-8FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 32 × 48 CLB array. It features eight digital Delay-Locked Loops (DLLs), 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications and signal processing systems.

For engineers reviewing the XCV300E-8FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its -8 speed grade (130 MHz internal performance), FG256 fine-pitch BGA package (176 user I/O), 1.8 V core voltage with 3.3 V I/O tolerance, and dual-port block RAM architecture for memory-intensive FPGA designs.

Technical Context

The XCV300E-8FG256C implements a regular array architecture with configurable logic blocks (CLBs) and input/output blocks (IOBs) interconnected via a programmable routing matrix. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous/asynchronous set/reset.

Its IO subsystem uses SelectI/O+™ technology with banked VCCO and VREF management, enabling mixed-voltage I/O standards including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS/LVPECL. Eight DLLs provide zero-delay clock conversion, duty-cycle correction, and frequency multiplication up to 4× for DDR timing control.

Key Specifications

Pinout & Package

Package: Fine-Pitch Ball Grid Array (FG256) with 256 balls, 1.0 mm pitch, and 176 user I/O pins distributed across eight I/O banks. Thermal and mechanical characteristics comply with JEDEC MO-230 standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV300E-7FG256C, the XCV300E-8FG256C delivers guaranteed 130 MHz internal performance and tighter hold-time margins; compared with XCV400E-8FG256C, it offers lower power and cost for designs fitting within 6,912 logic cells, avoiding over-provisioning.

Availability

XCV300E-8FG256C is available at Aetrix Electronics and suitable for high-speed communications, memory interface controllers, PCI bus bridges, and DSP acceleration engines requiring stable component supply throughout product lifecycles.

Supply support for XCV300E-8FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and development tools for reconfigurable computing.

The Virtex-E family was designed for high-performance, high-capacity digital systems demanding advanced I/O flexibility, integrated memory, and deterministic clock management - targeting telecom, military, and industrial applications.

FAQ

What is the maximum supported I/O standard speed for XCV300E-8FG256C?

XCV300E-8FG256C supports LVDS signaling at up to 622 Mb/s and LVPECL clock inputs exceeding 300 MHz. Its SelectI/O+™ technology enables these rates using source-synchronous architectures and DLL-assisted clock deskewing, verified in DS022-1 Table 2 for representative circuits under -8 speed grade conditions.

Does XCV300E-8FG256C support true dual-port block RAM?

Yes, XCV300E-8FG256C includes 32 block RAMs totaling 131,072 bits, each configured as true dual-port memory with independent read/write addresses, enables, and clocks per port. This capability is documented in DS022-2 Module 2 and used in reference designs for FIFO buffering and ping-pong memory access.

What is the core supply voltage requirement for XCV300E-8FG256C?

XCV300E-8FG256C requires a regulated 1.8 V ±3% supply on VCCINT pins for internal logic and memory operation. This lower voltage versus prior Virtex families reduces dynamic power by ~40% while maintaining performance, as confirmed in DS022-1 Section "Virtex-E Compared to Virtex Devices".

How many Delay-Locked Loops (DLLs) does XCV300E-8FG256C integrate?

XCV300E-8FG256C integrates eight fully digital Delay-Locked Loops (DLLs), doubling the count of the original Virtex family. Each DLL supports clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay conversion of LVPECL/LVDS inputs - critical for high-speed I/O timing closure.

Is XCV300E-8FG256C pin-compatible with other Virtex-E devices in FG256 packaging?

XCV300E-8FG256C shares the FG256 package footprint with XCV200E-8FG256C and XCV400E-8FG256C, but pin functions differ due to varying I/O counts and block RAM column placements. Pin compatibility is limited to same-device variants (e.g., XCV300E-7FG256C); migration requires netlist and constraint file updates per DS022-4 pinout tables.