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AMD XCV300E-8FG456C

Part No.:
XCV300E-8FG456C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
456-BBGA
Datasheet:
AetrixXCV300E-8FG456C.pdf
Description:
IC FPGA 312 I/O 456FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,655

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Product details

Overview

XCV300E-8FG456C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 456-ball Fine-Pitch Ball Grid Array (FG456) package. It integrates eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communication subsystems.

For engineers reviewing the XCV300E-8FG456C datasheet, pinout, applications, or equivalent options, this device is selected for high-density reconfigurable logic in telecom line cards, video processing pipelines, and industrial control FPGAs requiring deterministic clock management, dual-port memory, and multi-standard I/O banking.

Technical Context

The XCV300E-8FG456C implements a regular array architecture of Configurable Logic Blocks (CLBs), each containing four 4-input LUTs with dedicated carry chains and dual flip-flops per slice. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR, and frequency multiplication up to 4× - enabling precise timing control across multiple clock domains.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed signaling standards (e.g., LVTTL, LVCMOS2, SSTL3, HSTL IV) only when sharing compatible voltage rails. The device uses 0.18 μm 6-layer metal CMOS process, delivering 240 MHz synchronous system performance and 622 Mb/s source-synchronous data rates using SelectI/O+ technology.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 411,955 - defines total logic capacity for complex RTL synthesis targeting telecom or imaging applications.
Logic Cells 6,912 - provides granular, routable logic resources with dedicated carry and arithmetic support.
User I/O Pins 316 - enables high-bandwidth interface aggregation (e.g., parallel video + DDR SDRAM + PCIe-like control).
Block RAM Bits 131,072 - delivers true dual-port synchronous memory for FIFOs, frame buffers, or protocol engines without external SRAM.
DLL Count 8 - allows independent clock domain management for multi-rate systems (e.g., 100 MHz system clock + 311 MHz DDR interface clock).
Max I/O Speed 622 Mb/s (LVDS) - supports high-speed serial links such as camera sensor interfaces or backplane data channels.
Supply Voltage (VCCINT) 1.8 V - reduces dynamic power vs. 2.5 V Virtex family while maintaining timing closure at higher frequencies.

Pinout & Package

Package: 456-ball Fine-Pitch Ball Grid Array (FG456), 1.0 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0°C to +85°C).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK7 Global Clock Input Dedicated low-skew clock inputs routed to all DLLs; required for synchronous timing control across CLB and I/O domains.
VCCINT Core Logic Supply 1.8 V supply for CLBs, BRAM, and DLLs; must be decoupled locally to meet noise and transient current requirements.
VCCO_0–VCCO_7 I/O Bank Power Independent 1.5–3.3 V supplies per I/O bank; determines output voltage level and input threshold compatibility within that bank.
VREF_0–VREF_7 I/O Threshold Reference External reference voltage for SSTL/HSTL/LVCMOS input standards; shared across all pins in same bank.
TCK/TMS/TDI/TDO JTAG Boundary Scan IEEE 1149.1-compliant test interface for configuration verification, in-system programming, and production testing.
PROGRAM_B Configuration Reset Active-low asynchronous reset that clears configuration memory and initiates reconfiguration from external PROM or host processor.

Key Features

Feature Design Value
SelectI/O+ Technology Supports 20 I/O standards including LVDS, LVPECL, SSTL3, HSTL IV, and PCI 3.3 V - enables direct interfacing to memory, transceivers, and legacy peripherals without level shifters.
SelectRAM+ Memory Hierarchy 131,072-bit block RAM + 98,304-bit distributed RAM - provides on-chip memory bandwidth >1.66 Tb/s for real-time video buffering or packet processing.
SelectLink™ DDR Link Double Data Rate interconnect between FPGA and external devices - reduces pin count and improves throughput vs. single-data-rate parallel buses.
Digital DLLs Eight fully digital delay-locked loops with 4× frequency multiplication and duty-cycle correction - eliminates external clock synthesizers in DDR and SerDes subsystems.
Thermal Monitoring Integrated die-temperature sensor diode - enables closed-loop thermal management in fanless industrial enclosures or telecom chassis.

Applications

Telecom Line Card Processing High-Speed Video Interface

Use Scenario: Aggregating and switching multiple TDM/E1/J1 streams in carrier-grade access equipment.

IC Role / Device Role / Timing Role: Reconfigurable logic fabric implementing HDLC framing, CRC generation, and time-slot interchange with sub-ns jitter tolerance.

Use Value: Eight DLLs enable independent clock domain crossing between 2.048 MHz E1 clocks and 125 MHz system bus, eliminating external clock cleaners.

Use Scenario: Real-time 1080p60 video capture, scaling, and HDMI output in broadcast production hardware.

IC Role / Device Role / Timing Role: Parallel pixel pipeline controller with embedded frame buffer using true dual-port block RAM for simultaneous read/write access.

Use Value: 316 user I/O pins support concurrent LVDS camera input (24-bit @ 74.25 MHz), DDR2 SDRAM interface (16-bit @ 200 MHz), and TMDS output (3× data + clock).

Industrial Motion Control PCI-Based Data Acquisition

Use Scenario: Closed-loop servo drive with multi-axis interpolation and real-time safety monitoring.

IC Role / Device Role / Timing Role: Deterministic logic engine executing position loop updates at 20 kHz while managing EtherCAT slave communication.

Use Value: Dedicated carry logic and fast arithmetic paths achieve <4.3 ns adder propagation - meeting hard real-time cycle budget for 50 µs control loops.

Use Scenario: High-throughput analog-to-digital acquisition card for test instrumentation with PCI 33/66 MHz host interface.

IC Role / Device Role / Timing Role: PCI target endpoint bridging ADC FIFOs to host memory via burst-mode DMA transfers.

Use Value: Native PCI 3.3 V compliance and 316 I/O allow full 64-bit/66 MHz PCI bus implementation without glue logic or voltage translators.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV300E-7FG456C Slower speed grade (-7 vs. -8); 133 MHz max register-to-register performance vs. 133–240 MHz range for -8. Suitable for cost-sensitive designs where worst-case timing margin is ≥15% below critical path. Select when thermal derating or lower-frequency operation justifies reduced price and guaranteed setup/hold slack.
XCV400E-8FG456C Higher density (569,952 system gates, 10,800 logic cells, 404 I/O) in identical FG456 package; same speed grade and I/O capability. Required when design exceeds XCV300E resource utilization by >15% but PCB footprint must remain unchanged. Choose for seamless migration path - same pinout, voltage, and thermal profile with added logic and memory headroom.

Compared with XCV300E-8FG456C, the -7 variant trades timing margin for cost in stable-temperature environments, while the XCV400E-8FG456C offers identical packaging and speed with 38% more logic cells and 24% more I/O - enabling feature-rich upgrades without board redesign.

Availability

XCV300E-8FG456C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial motion controllers, and PCI-based data acquisition systems requiring stable component supply across extended product lifecycles.

Supply support for XCV300E-8FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA architecture and tools for programmable logic, delivering silicon-proven platforms for high-performance digital systems since 1984.

The Virtex-E family was designed specifically for high-speed, high-density reconfigurable computing in communications and signal processing - emphasizing I/O flexibility, clock precision, and memory integration over raw gate count alone.

FAQ

What is the maximum operating frequency of the XCV300E-8FG456C?

The XCV300E-8FG456C achieves up to 240 MHz synchronous system clock rates in typical designs, with worst-case register-to-register delays as low as 4.3 ns for adder functions. Its eight DLLs support internal clock multiplication and duty-cycle correction, enabling reliable DDR interfaces and multi-domain timing closure - verified in DS022-3 switching characteristics tables.

Does the XCV300E-8FG456C support LVDS I/O?

Yes, the XCV300E-8FG456C supports LVDS (622 Mb/s) as a native I/O standard via its SelectI/O+ technology. LVDS pairs require dedicated differential routing and must be assigned to the same I/O bank with matching VCCO = 2.5 V; termination resistors are external, and the device provides internal current sources for proper biasing.

How many block RAMs does the XCV300E-8FG456C contain?

The XCV300E-8FG456C contains 32 block SelectRAM units totaling 131,072 bits of synchronous, true dual-port memory. Each block is 4096 bits deep and configurable for widths from 1 to 36 bits per port - supporting independent read/write operations essential for video frame buffers and protocol FIFOs.

Is the XCV300E-8FG456C pin-compatible with other Virtex-E devices in FG456 packaging?

Yes, the XCV300E-8FG456C shares identical FG456 pinout with XCV200E-8FG456C and XCV400E-8FG456C per DS022-4 Pinout Tables. All three use the same ball map, power/ground distribution, and I/O bank layout - enabling hardware reuse across density tiers when logic utilization stays within XCV300E capacity limits.

What development tools support the XCV300E-8FG456C?

The XCV300E-8FG456C is fully supported by Xilinx Foundation Series and Alliance Series design environments, including schematic entry, VHDL/Verilog synthesis, place-and-route, and bitstream generation. These tools deliver compile-time reduction of 50% versus prior generations and include Internet Team Design (ITD) for collaborative million-gate projects.

XCV300E-8FG456C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
456-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
131072
Number of I/O:
312
Number of Gates:
411955
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
456-FBGA (23x23)

XCV300E-8FG456C FAQ

1.How can I place an order for XCV300E-8FG456C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV300E-8FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV300E-8FG456C reliable?

The price and inventory of XCV300E-8FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300E-8FG456C is usually 5 days.

3.What payment methods are accepted for XCV300E-8FG456C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300E-8FG456C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV300E-8FG456C?

XCV300E-8FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV300E-8FG456C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV300E-8FG456C?

For technical support, including XCV300E-8FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300E-8FG456C requirements.

6.How does Aetrix verify that XCV300E-8FG456C is sourced from the original manufacturer or authorized distributors?

All XCV300E-8FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300E-8FG456C meets industry standards.

7.What is the process for return or replacement of XCV300E-8FG456C?

All XCV300E-8FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300E-8FG456C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV300E-8FG456C part is unused and in its original packaging.

Return procedure for XCV300E-8FG456C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV300E-8FG456C Tags

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