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AMD XCV300E-8PQ240C

Part No.:
XCV300E-8PQ240C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP
Datasheet:
AetrixXCV300E-8PQ240C.pdf
Description:
IC FPGA 158 I/O 240QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,139

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Product details

Overview

XCV300E-8PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 32 × 48 CLB array. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communication interface design.

For engineers reviewing the XCV300E-8PQ240C datasheet, pinout, applications, or equivalent options, this device is selected for demanding FPGA applications requiring PCI-compliant 3.3 V I/O, true dual-port block RAM, and deterministic clock management in commercial temperature range (0°C to +85°C).

Technical Context

The XCV300E-8PQ240C implements a flexible architecture with 32 × 48 CLB array and eight fully digital DLLs-each supporting clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay conversion of LVPECL/LVDS clocks to any I/O standard. Its SelectI/O+™ technology enables up to 316 user I/O pins across 8 banks, each configurable for standards including LVTTL, SSTL3, HSTL, and LVDS.

It integrates 131,072 bits of synchronous block RAM (organized as 32 × 4096-bit true dual-port blocks) and 98,304 bits of distributed RAM, with dedicated carry logic and F5/F6 multiplexers enabling efficient arithmetic and wide-input function implementation. The device uses a 0.18 μm 6-layer metal CMOS process and requires 1.8 V VCCINT with 3.3 V-tolerant I/O banks powered by VCCO.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 411,955 - defines total logic capacity for complex RTL synthesis and gate-level mapping.
Logic Cells 6,912 - provides granular programmable resources for fine-grained control and pipelining.
CLB Array 32 × 48 - determines maximum routable logic density and placement flexibility in floorplanning.
User I/O Pins 316 - supports high-bandwidth parallel interfaces such as DDR SDRAM, ZBT SRAM, and PCI 66 MHz.
Block RAM Bits 131,072 - enables 32 independent 4096-bit true dual-port memory blocks for simultaneous read/write operations.
DLL Count 8 - allows independent clock domain management for multi-clock systems and jitter-sensitive interfaces.
Max I/O Speed 622 Mb/s (LVDS) - enables source-synchronous data capture for high-speed serial links and ADC/DAC interfaces.
VCCINT / VCCO 1.8 V / 3.3 V - separates core logic power from I/O voltage, enabling mixed-voltage board design and low-power operation.

Pinout & Package

PQ240 package: 240-pin Plastic Quad Flatpack (PQFP), 0.5 mm pitch, 32.5 mm × 32.5 mm body size, lead-free compatible per RoHS requirements at time of production.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Dedicated low-skew clock inputs routed to all DLLs and CLBs; essential for synchronous timing closure.
VCCINT Core Logic Supply 1.8 V supply for CLBs, RAM, and routing; must be decoupled locally to minimize switching noise.
VCCO_0–VCCO_7 I/O Bank Power Independent 3.3 V supplies per I/O bank; enables mixed-standard I/O (e.g., LVTTL + SSTL3) on same device.
VREF_0–VREF_7 Input Threshold Reference Bank-specific reference voltage for SSTL/HSTL/GTL input buffers; must be externally sourced and stable ±1%.
TCK/TMS/TDI/TDO JTAG Boundary Scan IEEE 1149.1-compliant test interface for configuration, debugging, and in-system verification.
PROGRAM_B Configuration Reset Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence.

Key Features

Feature Design Value
Eight Digital DLLs Enables precise clock deskew, frequency multiplication (up to 4×), and 50% duty cycle correction for DDR interfaces without external PLLs.
SelectRAM+™ Memory Hierarchy Combines 131,072-bit block RAM (true dual-port, 250 MHz) with 98,304-bit distributed RAM for hierarchical memory access and bandwidth optimization.
SelectI/O+™ Technology Supports 20 I/O standards-including LVDS, BLVDS, LVPECL, SSTL3, HSTL IV-with per-bank VCCO/VREF control for mixed-voltage board integration.
SRAM-Based In-System Configuration Allows unlimited reprogramming via JTAG, SelectMAP, or master serial mode; supports dynamic partial reconfiguration in select designs.
Dedicated Carry & Arithmetic Logic Two-bit-per-slice carry chains and integrated XOR/AND gates accelerate adder, accumulator, and multiplier implementations with predictable timing.

Applications

High-Speed Communication Interface PCI 66 MHz Host Adapter

Use Scenario: Implementing a 32-bit, 66 MHz PCI bus master interface between an embedded processor and custom peripherals.

IC Role / Device Role / Timing Role: XCV300E-8PQ240C acts as the protocol bridge and timing controller, managing address/data multiplexing, arbitration, and setup/hold compliance per PCI specification.

Use Value: Native PCI-compliant I/O with 3.3 V tolerance and DLL-controlled clocking eliminates level-shifter ICs and reduces timing margin uncertainty.

Use Scenario: Building a PCIe-to-legacy PCI bridge ASIC replacement in industrial control backplanes.

IC Role / Device Role / Timing Role: XCV300E-8PQ240C serves as the PCI transaction translator and DMA engine, synchronizing between upstream PCIe and downstream PCI domains.

Use Value: 316 user I/O pins and 8 DLLs enable concurrent handling of multiple PCI command queues and deterministic latency control.

DDR SDRAM Controller LVDS SerDes Interface

Use Scenario: Controlling 200 Mb/s DDR SDRAM in a video frame buffer subsystem for broadcast-grade imaging equipment.

IC Role / Device Role / Timing Role: XCV300E-8PQ240C implements full DDR PHY layer, including DQS strobe alignment, write leveling, and read capture using DLL-derived phase-shifted clocks.

Use Value: On-die DLLs and 200 MHz block RAM provide sub-nanosecond clock-to-data alignment without external delay elements.

Use Scenario: Receiving 622 Mb/s LVDS data streams from high-speed ADCs in radar signal processing modules.

IC Role / Device Role / Timing Role: XCV300E-8PQ240C functions as a source-synchronous deserializer, using LVDS input buffers and DLL-managed sampling clocks aligned to incoming DQS.

Use Value: LVDS I/O support with 622 Mb/s capability and built-in input delay matching eliminates external CDR ICs and reduces BOM count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and logic acceleration applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV300E-7PQ240C Slower speed grade (-7 vs. -8): 133 MHz max register-to-register, 4.6 ns adder delay vs. 4.3 ns for -8. Suitable for cost-sensitive designs where 130 MHz internal performance suffices and tighter timing margins are not required. Select XCV300E-7PQ240C when budget constraints outweigh need for worst-case 130 MHz operation or 622 Mb/s LVDS margin.
XCV400E-8PQ240C Higher density: 569,952 system gates, 10,800 logic cells, 40 × 60 CLB array, 404 user I/O pins. Required when design exceeds XCV300E-8PQ240C resource limits-e.g., multi-channel DDR + PCI + DSP cores in single device. Choose XCV400E-8PQ240C for scalability path; pin-compatible with XCV300E-8PQ240C in PQ240 package but requires PCB I/O reallocation.

Compared with XCV300E-7PQ240C, the XCV300E-8PQ240C delivers higher timing margin for 130 MHz operation and 622 Mb/s LVDS; compared with XCV400E-8PQ240C, it offers lower cost and power while retaining identical package and clock architecture-but with reduced logic and I/O headroom.

Availability

XCV300E-8PQ240C is available at Aetrix Electronics and suitable for high-reliability communication infrastructure, industrial control logic, and embedded vision systems requiring stable component supply and long-term obsolescence planning.

Supply support for XCV300E-8PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools for high-performance digital system design.

The Virtex-E family was designed for high-speed, high-density logic implementation in communications, computing, and signal processing applications-emphasizing I/O flexibility, clock management, and memory hierarchy over raw gate count.

FAQ

What is the maximum operating frequency of the XCV300E-8PQ240C?

The XCV300E-8PQ240C achieves up to 130 MHz internal performance (four LUT levels) and synchronous system clock rates up to 240 MHz including I/O. Its speed grade -8 rating guarantees worst-case register-to-register timing of 4.3 ns, validated under commercial temperature conditions (0°C to +85°C). Actual frequency depends on design topology and place-and-route results.

Does the XCV300E-8PQ240C support LVDS I/O?

Yes, the XCV300E-8PQ240C supports LVDS (622 Mb/s), BLVDS, and LVPECL differential signaling. It provides dedicated differential I/O pairs with internal termination and programmable drive strength. LVDS inputs and outputs can be configured per bank using VCCO = 2.5 V and appropriate I/O standards settings in the Xilinx design tools.

How many block RAMs does the XCV300E-8PQ240C contain?

The XCV300E-8PQ240C contains 32 block SelectRAM+™ units, totaling 131,072 bits of synchronous memory. Each block is a true dual-port 4096-bit RAM with independent read/write addresses and controls, enabling simultaneous access for FIFOs, frame buffers, or coefficient storage in DSP pipelines.

Is the XCV300E-8PQ240C pin-compatible with other Virtex-E devices in PQ240 package?

Yes, the XCV300E-8PQ240C shares the same PQ240 pinout with XCV50E, XCV100E, XCV200E, and XCV400E in the same package variant. All use identical pin assignments for global clocks, configuration, JTAG, and power; however, unused pins may differ, and I/O bank allocations scale with device size-requiring careful review of Module 4 pinout tables.

What development tools support the XCV300E-8PQ240C?

The XCV300E-8PQ240C is supported by Xilinx Foundation Series™ and Alliance Series™ design tools (v3.1+), including schematic entry, VHDL/Verilog synthesis, place-and-route, and bitstream generation. It is also compatible with early versions of ISE Foundation (v4.x) and requires speed file DS022-3 for accurate timing analysis.

XCV300E-8PQ240C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
240-BFQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
131072
Number of I/O:
158
Number of Gates:
411955
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV300E-8PQ240C FAQ

1.How can I place an order for XCV300E-8PQ240C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV300E-8PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV300E-8PQ240C reliable?

The price and inventory of XCV300E-8PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300E-8PQ240C is usually 5 days.

3.What payment methods are accepted for XCV300E-8PQ240C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300E-8PQ240C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV300E-8PQ240C?

XCV300E-8PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV300E-8PQ240C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV300E-8PQ240C?

For technical support, including XCV300E-8PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300E-8PQ240C requirements.

6.How does Aetrix verify that XCV300E-8PQ240C is sourced from the original manufacturer or authorized distributors?

All XCV300E-8PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300E-8PQ240C meets industry standards.

7.What is the process for return or replacement of XCV300E-8PQ240C?

All XCV300E-8PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300E-8PQ240C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV300E-8PQ240C part is unused and in its original packaging.

Return procedure for XCV300E-8PQ240C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV300E-8PQ240C Tags

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