AMD XCV300E-8PQ240C
- Part No.:
- XCV300E-8PQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCV300E-8PQ240C.pdf
- Description:
- IC FPGA 158 I/O 240QFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV300E-8PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 32 × 48 CLB array. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communication interface design.
For engineers reviewing the XCV300E-8PQ240C datasheet, pinout, applications, or equivalent options, this device is selected for demanding FPGA applications requiring PCI-compliant 3.3 V I/O, true dual-port block RAM, and deterministic clock management in commercial temperature range (0°C to +85°C).
Technical Context
The XCV300E-8PQ240C implements a flexible architecture with 32 × 48 CLB array and eight fully digital DLLs-each supporting clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay conversion of LVPECL/LVDS clocks to any I/O standard. Its SelectI/O+™ technology enables up to 316 user I/O pins across 8 banks, each configurable for standards including LVTTL, SSTL3, HSTL, and LVDS.
It integrates 131,072 bits of synchronous block RAM (organized as 32 × 4096-bit true dual-port blocks) and 98,304 bits of distributed RAM, with dedicated carry logic and F5/F6 multiplexers enabling efficient arithmetic and wide-input function implementation. The device uses a 0.18 μm 6-layer metal CMOS process and requires 1.8 V VCCINT with 3.3 V-tolerant I/O banks powered by VCCO.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 411,955 - defines total logic capacity for complex RTL synthesis and gate-level mapping. |
| Logic Cells | 6,912 - provides granular programmable resources for fine-grained control and pipelining. |
| CLB Array | 32 × 48 - determines maximum routable logic density and placement flexibility in floorplanning. |
| User I/O Pins | 316 - supports high-bandwidth parallel interfaces such as DDR SDRAM, ZBT SRAM, and PCI 66 MHz. |
| Block RAM Bits | 131,072 - enables 32 independent 4096-bit true dual-port memory blocks for simultaneous read/write operations. |
| DLL Count | 8 - allows independent clock domain management for multi-clock systems and jitter-sensitive interfaces. |
| Max I/O Speed | 622 Mb/s (LVDS) - enables source-synchronous data capture for high-speed serial links and ADC/DAC interfaces. |
| VCCINT / VCCO | 1.8 V / 3.3 V - separates core logic power from I/O voltage, enabling mixed-voltage board design and low-power operation. |
Pinout & Package
PQ240 package: 240-pin Plastic Quad Flatpack (PQFP), 0.5 mm pitch, 32.5 mm × 32.5 mm body size, lead-free compatible per RoHS requirements at time of production.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew clock inputs routed to all DLLs and CLBs; essential for synchronous timing closure. |
| VCCINT | Core Logic Supply | 1.8 V supply for CLBs, RAM, and routing; must be decoupled locally to minimize switching noise. |
| VCCO_0–VCCO_7 | I/O Bank Power | Independent 3.3 V supplies per I/O bank; enables mixed-standard I/O (e.g., LVTTL + SSTL3) on same device. |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/GTL input buffers; must be externally sourced and stable ±1%. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface for configuration, debugging, and in-system verification. |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence. |
Key Features
| Feature | Design Value |
|---|---|
| Eight Digital DLLs | Enables precise clock deskew, frequency multiplication (up to 4×), and 50% duty cycle correction for DDR interfaces without external PLLs. |
| SelectRAM+™ Memory Hierarchy | Combines 131,072-bit block RAM (true dual-port, 250 MHz) with 98,304-bit distributed RAM for hierarchical memory access and bandwidth optimization. |
| SelectI/O+™ Technology | Supports 20 I/O standards-including LVDS, BLVDS, LVPECL, SSTL3, HSTL IV-with per-bank VCCO/VREF control for mixed-voltage board integration. |
| SRAM-Based In-System Configuration | Allows unlimited reprogramming via JTAG, SelectMAP, or master serial mode; supports dynamic partial reconfiguration in select designs. |
| Dedicated Carry & Arithmetic Logic | Two-bit-per-slice carry chains and integrated XOR/AND gates accelerate adder, accumulator, and multiplier implementations with predictable timing. |
Applications
| High-Speed Communication Interface | PCI 66 MHz Host Adapter |
|---|---|
Use Scenario: Implementing a 32-bit, 66 MHz PCI bus master interface between an embedded processor and custom peripherals. IC Role / Device Role / Timing Role: XCV300E-8PQ240C acts as the protocol bridge and timing controller, managing address/data multiplexing, arbitration, and setup/hold compliance per PCI specification. Use Value: Native PCI-compliant I/O with 3.3 V tolerance and DLL-controlled clocking eliminates level-shifter ICs and reduces timing margin uncertainty. |
Use Scenario: Building a PCIe-to-legacy PCI bridge ASIC replacement in industrial control backplanes. IC Role / Device Role / Timing Role: XCV300E-8PQ240C serves as the PCI transaction translator and DMA engine, synchronizing between upstream PCIe and downstream PCI domains. Use Value: 316 user I/O pins and 8 DLLs enable concurrent handling of multiple PCI command queues and deterministic latency control. |
| DDR SDRAM Controller | LVDS SerDes Interface |
Use Scenario: Controlling 200 Mb/s DDR SDRAM in a video frame buffer subsystem for broadcast-grade imaging equipment. IC Role / Device Role / Timing Role: XCV300E-8PQ240C implements full DDR PHY layer, including DQS strobe alignment, write leveling, and read capture using DLL-derived phase-shifted clocks. Use Value: On-die DLLs and 200 MHz block RAM provide sub-nanosecond clock-to-data alignment without external delay elements. |
Use Scenario: Receiving 622 Mb/s LVDS data streams from high-speed ADCs in radar signal processing modules. IC Role / Device Role / Timing Role: XCV300E-8PQ240C functions as a source-synchronous deserializer, using LVDS input buffers and DLL-managed sampling clocks aligned to incoming DQS. Use Value: LVDS I/O support with 622 Mb/s capability and built-in input delay matching eliminates external CDR ICs and reduces BOM count. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300E-7PQ240C | Slower speed grade (-7 vs. -8): 133 MHz max register-to-register, 4.6 ns adder delay vs. 4.3 ns for -8. | Suitable for cost-sensitive designs where 130 MHz internal performance suffices and tighter timing margins are not required. | Select XCV300E-7PQ240C when budget constraints outweigh need for worst-case 130 MHz operation or 622 Mb/s LVDS margin. |
| XCV400E-8PQ240C | Higher density: 569,952 system gates, 10,800 logic cells, 40 × 60 CLB array, 404 user I/O pins. | Required when design exceeds XCV300E-8PQ240C resource limits-e.g., multi-channel DDR + PCI + DSP cores in single device. | Choose XCV400E-8PQ240C for scalability path; pin-compatible with XCV300E-8PQ240C in PQ240 package but requires PCB I/O reallocation. |
Compared with XCV300E-7PQ240C, the XCV300E-8PQ240C delivers higher timing margin for 130 MHz operation and 622 Mb/s LVDS; compared with XCV400E-8PQ240C, it offers lower cost and power while retaining identical package and clock architecture-but with reduced logic and I/O headroom.
Availability
XCV300E-8PQ240C is available at Aetrix Electronics and suitable for high-reliability communication infrastructure, industrial control logic, and embedded vision systems requiring stable component supply and long-term obsolescence planning.
Supply support for XCV300E-8PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools for high-performance digital system design.
The Virtex-E family was designed for high-speed, high-density logic implementation in communications, computing, and signal processing applications-emphasizing I/O flexibility, clock management, and memory hierarchy over raw gate count.
FAQ
What is the maximum operating frequency of the XCV300E-8PQ240C?
The XCV300E-8PQ240C achieves up to 130 MHz internal performance (four LUT levels) and synchronous system clock rates up to 240 MHz including I/O. Its speed grade -8 rating guarantees worst-case register-to-register timing of 4.3 ns, validated under commercial temperature conditions (0°C to +85°C). Actual frequency depends on design topology and place-and-route results.
Does the XCV300E-8PQ240C support LVDS I/O?
Yes, the XCV300E-8PQ240C supports LVDS (622 Mb/s), BLVDS, and LVPECL differential signaling. It provides dedicated differential I/O pairs with internal termination and programmable drive strength. LVDS inputs and outputs can be configured per bank using VCCO = 2.5 V and appropriate I/O standards settings in the Xilinx design tools.
How many block RAMs does the XCV300E-8PQ240C contain?
The XCV300E-8PQ240C contains 32 block SelectRAM+™ units, totaling 131,072 bits of synchronous memory. Each block is a true dual-port 4096-bit RAM with independent read/write addresses and controls, enabling simultaneous access for FIFOs, frame buffers, or coefficient storage in DSP pipelines.
Is the XCV300E-8PQ240C pin-compatible with other Virtex-E devices in PQ240 package?
Yes, the XCV300E-8PQ240C shares the same PQ240 pinout with XCV50E, XCV100E, XCV200E, and XCV400E in the same package variant. All use identical pin assignments for global clocks, configuration, JTAG, and power; however, unused pins may differ, and I/O bank allocations scale with device size-requiring careful review of Module 4 pinout tables.
What development tools support the XCV300E-8PQ240C?
The XCV300E-8PQ240C is supported by Xilinx Foundation Series™ and Alliance Series™ design tools (v3.1+), including schematic entry, VHDL/Verilog synthesis, place-and-route, and bitstream generation. It is also compatible with early versions of ISE Foundation (v4.x) and requires speed file DS022-3 for accurate timing analysis.
XCV300E-8PQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 6912
- Total RAM Bits:
- 131072
- Number of I/O:
- 158
- Number of Gates:
- 411955
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV300E-8PQ240C FAQ
1.How can I place an order for XCV300E-8PQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV300E-8PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV300E-8PQ240C reliable?
The price and inventory of XCV300E-8PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300E-8PQ240C is usually 5 days.
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Once your XCV300E-8PQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV300E-8PQ240C?
For technical support, including XCV300E-8PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300E-8PQ240C requirements.
6.How does Aetrix verify that XCV300E-8PQ240C is sourced from the original manufacturer or authorized distributors?
All XCV300E-8PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300E-8PQ240C meets industry standards.
7.What is the process for return or replacement of XCV300E-8PQ240C?
All XCV300E-8PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300E-8PQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV300E-8PQ240C part is unused and in its original packaging.
Return procedure for XCV300E-8PQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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