AMD XCV400-4BG560C

Overview

XCV400-4BG560C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) delivering 468,252 system gates in a 40×60 CLB array with 10,800 logic cells and 404 user I/O pins. It features four delay-locked loops (DLLs), hierarchical memory (including 81,920-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation. It is used in high-speed digital signal processing, communications infrastructure, and reconfigurable embedded control systems.

For engineers reviewing the XCV400-4BG560C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL jitter specifications, CLB-level timing parameters, and migration guidance from Virtex-1 family to successor platforms.

Technical Context

The XCV400-4BG560C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing-enabling pin-locking and PCB reuse across logic revisions. Its CLBs contain four logic cells each, with dual-slice structure supporting 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and configurable storage elements with synchronous/asynchronous set/reset.

I/O functionality is organized into eight banks, each requiring shared VCCO and (where applicable) single VREF voltage; supported standards include LVTTL (5 V tolerant), LVCMOS2, PCI 3.3 V, HSTL Class I/III/IV, SSTL2/3, GTL/GTL+, and CTT. Each IOB includes input/output flip-flops with programmable polarity, weak-keeper, and optional pull-up/down resistors.

Key Specifications

Pinout & Package

The XCV400-4BG560C is housed in a 560-ball Fine-Pitch Ball Grid Array (FBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-207AC footprint. Pin assignments follow Xilinx DS003-4 Module 4 (v4.0), with dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), JTAG boundary-scan interface (TCK/TMS/TDI/TDO), and eight I/O banks (Bank 0–7) arranged around the die perimeter.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV400-4BG560C, the -5 variant delivers measurable timing margin improvement without layout changes, while the XCV600-4BG560C offers headroom for logic growth but requires validation of thermal and power delivery under increased resource utilization.

Availability

XCV400-4BG560C is available at Aetrix Electronics and suitable for industrial motion control, telecommunications infrastructure, avionics legacy replacement, and reconfigurable DSP applications requiring stable component supply amid long product lifecycles.

Supply support for XCV400-4BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures and design toolchains widely adopted in aerospace, defense, and high-performance computing.

The Virtex family-including XCV400-4BG560C-was engineered for high-speed, high-density reconfigurable logic in systems demanding PCI compliance, deterministic I/O timing, and scalable memory-rich architectures.

FAQ

What is the operating temperature range for XCV400-4BG560C?

The XCV400-4BG560C is rated for commercial temperature operation (0°C to +85°C junction temperature). This is indicated by the "C" suffix in the part number per Xilinx ordering conventions. The device incorporates a die-temperature sensor diode, enabling real-time thermal monitoring in deployed systems. Thermal derating guidelines and power dissipation curves are specified in DS003-3 Module 3.

Does XCV400-4BG560C support JTAG boundary scan?

Yes, XCV400-4BG560C fully implements IEEE 1149.1 boundary-scan logic with TCK, TMS, TDI, and TDO pins. It supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions, enabling PCB interconnect testing and in-system programming. The boundary-scan chain includes all user I/O and internal configuration logic, validated per DS003-2 Section "Input/Output Block".

Can XCV400-4BG560C be configured via slave serial mode?

Yes, XCV400-4BG560C supports slave serial configuration using the DIN pin synchronized to an external CCLK signal. In this mode, configuration data is shifted in LSB-first; the DONE pin asserts after successful CRC verification. This method is commonly used with microcontrollers or CPLDs acting as configuration masters, and is documented in DS003-1 Module 1 Section "Configuration Modes".

What I/O standards are 5 V tolerant on XCV400-4BG560C?

XCV400-4BG560C supports 5 V tolerance on LVTTL, LVCMOS2, and PCI 5 V I/O standards only. This capability relies on integrated Zener-like clamping structures referenced to ground. Standards such as HSTL, SSTL, GTL, and PCI 3.3 V are not 5 V tolerant and require strict adherence to their specified VCCO voltages to avoid damage.

Is XCV400-4BG560C still in production?

No, XCV400-4BG560C is obsolete per Xilinx Notice XCN10016 (March 2013). DS003-1 v4.0 explicitly states "The products listed in this data sheet are obsolete." Aetrix Electronics provides last-time-buy support, extended logistics, and migration advisory services for legacy Virtex-1 designs transitioning to Spartan-6, Artix-7, or Kintex-7 platforms.