AMD XCV400-4BG560I

Overview

XCV400-4BG560I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 468,252 system gates, 10,800 logic cells, and 404 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 81,920-bit block RAM and LUT-based RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV400-4BG560I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB structure, SelectIO™ interface compatibility, and obsolescence-aware selection guidance for legacy high-density FPGA integration.

Technical Context

The XCV400-4BG560I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock™ interconnect, and peripheral VersaRing™ I/O routing - enabling efficient place-and-route for large synchronous designs. Its CLB contains two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input logic, and dual flip-flops with independent clock enable, set/reset, and polarity control.

I/O functionality is organized into eight banks, each supporting mixed voltage standards (e.g., LVTTL, SSTL3, HSTL Class IV) under shared VCCO and single VREF per bank. Each IOB includes configurable input/output flip-flops, programmable delays, weak-keeper circuits, and IEEE 1149.1 boundary-scan logic - all operating at up to 200 MHz system performance with 5 V-tolerant inputs on select standards.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 27 × 27 mm body, 1.27 mm ball pitch, RoHS-compliant lead-free finish. Thermal pad on underside for enhanced heat dissipation in industrial environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV400-4BG560I, the -5 variant offers timing margin for aggressive clocking, while the XCV600-4BG560I provides headroom for logic expansion - both retain identical I/O banking, DLL count, and SelectIO™ standard support, making them viable alternatives when resource or timing constraints evolve.

Availability

XCV400-4BG560I is available at Aetrix Electronics and suitable for industrial control systems, legacy telecommunications infrastructure, and high-reliability data acquisition platforms requiring stable component supply amid long product lifecycles.

Supply support for XCV400-4BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGA architecture and established industry standards for programmable logic design tools, IP cores, and silicon scalability.

The Virtex family was engineered for high-performance, high-capacity digital systems - targeting applications demanding ASIC-like density with FPGA flexibility, including wired/wireless infrastructure, defense avionics, and scientific instrumentation.

FAQ

Is XCV400-4BG560I still in production?

No - XCV400-4BG560I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, and new production should consider migration paths. Aetrix Electronics maintains limited legacy inventory with full traceability and extended support for existing designs dependent on XCV400-4BG560I.

What development tools support XCV400-4BG560I?

XCV400-4BG560I is supported exclusively by legacy Xilinx Foundation™ and Alliance Series™ software (v3.x–v5.x). Modern Vivado® does not support Virtex devices. Bitstream generation, simulation, and place-and-route require archived tool versions compatible with Windows NT/2000 or Solaris - Aetrix provides verified toolchain references for XCV400-4BG560I projects.

Can XCV400-4BG560I operate at 3.3 V I/O while using 2.5 V core?

Yes - XCV400-4BG560I supports mixed-voltage I/O: VCCINT = 2.5 V for core logic, while individual I/O banks (VCCO_0 through VCCO_7) can be set to 3.3 V, 2.5 V, or 1.5 V. This enables direct interfacing with LVTTL (3.3 V), SSTL2 (2.5 V), or HSTL (1.5 V) components without level shifters - subject to per-bank VREF and signaling standard compatibility.

Does XCV400-4BG560I support JTAG programming?

Yes - XCV400-4BG560I includes full IEEE 1149.1 boundary-scan logic with dedicated TCK, TMS, TDI, and TDO pins. It supports JTAG configuration mode for in-system programming, debug visibility, and production testing. The JTAG chain can include multiple XCV400-4BG560I devices or mix with other Xilinx FPGAs sharing compatible instruction sets.

What is the maximum operating temperature for XCV400-4BG560I?

XCV400-4BG560I is rated for industrial temperature range: junction temperature (TJ) from –40°C to +100°C. This rating applies to the "I" suffix in the part number and is validated across all speed grades and package types. Thermal design must ensure sustained TJ ≤ 100°C under worst-case power dissipation, especially with high I/O toggle rates and active DLLs.