AMD XCV400-4FG676C

Overview

XCV400-4FG676C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 468,252 system gates, 10,800 logic cells in a 40×60 CLB array, and 404 user I/O pins in a 676-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), 4 primary global clock nets plus 24 secondary local clock nets, and 81,920 bits of block SelectRAM for high-speed synchronous dual-port memory access. It targets PCI-compliant high-performance embedded control and digital signal processing systems requiring reprogrammable logic with deterministic timing.

For engineers reviewing the XCV400-4FG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, confirmed I/O banking constraints, exact DLL jitter specs, real-world SelectIO™ standard compatibility (including HSTL Class IV at 200 MHz), and validated alternatives for legacy Virtex migration paths.

Technical Context

The XCV400-4FG676C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 single-length lines, 12 buffered Hex lines, and 12 bidirectional Longlines - enabling low-latency interconnect across its 40×60 CLB array. Its IOBs support 16 SelectIO™ standards including LVTTL, SSTL3, HSTL Class IV, and GTL+, with per-bank VCCO and VREF constraints governing mixed-standard I/O placement.

Each CLB contains four logic cells (LCs), two slices, dedicated carry chains, F5/F6 multiplexers for 5–19-input logic, and LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register. Block SelectRAM provides 20 × 4,096-bit dual-ported RAM blocks (81,920 total bits), each supporting independent port widths and asynchronous reset.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG676) with 676 solder balls, 1.0 mm ball pitch, and commercial temperature range (0°C to +85°C). Pinout conforms to Xilinx DS003-4 (v4.0) Module 4 - Pinout Tables, with I/O banks organized per device edge (Bank 0–7), each requiring shared VCCO and single VREF voltage.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XCV400-4FG676C, the -5 speed grade improves worst-case timing margin for high-frequency control loops, while the XCV600-4FG676C offers 41% more logic and 20% more block RAM within identical mechanical and thermal constraints - making both viable for lifecycle extension or performance scaling.

Availability

XCV400-4FG676C is available at Aetrix Electronics and suitable for legacy telecom infrastructure upgrades, industrial PLC reprogramming, and aerospace avionics spares requiring stable component supply amid obsolescence management.

Supply support for XCV400-4FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed the Virtex family as its flagship high-performance FPGA platform.

The Virtex product line was engineered for demanding applications requiring high logic density, deterministic timing, and multi-standard I/O - specifically targeting communications infrastructure, military systems, and high-end test equipment where ASIC flexibility and time-to-market advantages are critical.

FAQ

What is the maximum operating frequency supported by XCV400-4FG676C?

XCV400-4FG676C guarantees synchronous system clock operation up to 200 MHz, including I/O timing, under worst-case commercial temperature and voltage conditions. This rating is validated using representative circuits such as register-to-register paths and pipelined multipliers, and assumes proper PCB layout, power integrity, and DLL usage for clock deskew. Actual achievable frequency depends on design topology and place-and-route results.

Does XCV400-4FG676C support hot-swap functionality for Compact PCI systems?

Yes, XCV400-4FG676C meets PICMG 2.1 hot-swap electrical requirements for Compact PCI. Its IOBs include controlled slew-rate drivers, programmable drive strength (up to 24 mA source / 48 mA sink), and ESD protection structures compatible with live insertion scenarios. Implementation requires adherence to Xilinx's hot-swap design guidelines, including proper sequencing of VCCINT, VCCO, and configuration signals during power ramp.

How many block RAMs does XCV400-4FG676C contain, and what are their key configuration modes?

XCV400-4FG676C contains 20 block SelectRAM units, each providing 4,096 bits of synchronous dual-ported memory. Each block supports independent port widths (1–16 bits) and depths (256–4096), with configurable read/write enable, reset, and clock enables per port. Supported configurations include 4k×1, 2k×2, 1k×4, 512×8, and 256×16 - enabling flexible FIFO, buffer, and lookup table implementations without external memory.

Can XCV400-4FG676C interface directly with 5 V TTL logic?

XCV400-4FG676C supports 5 V-tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, allowing direct connection to 5 V outputs without level shifters. However, its outputs are not 5 V capable - VCCO must be set to 3.3 V for LVTTL compatibility, and all I/O in the same bank must share that VCCO. For true bidirectional 5 V interfacing, external bus switches or level translators are required.

What configuration modes are supported by XCV400-4FG676C?

XCV400-4FG676C supports four configuration modes: Master Serial (reads bitstream from external PROM via CCLK/DIN), Slave Serial (receives bitstream from external controller), SelectMAP™ (8-bit parallel interface with CS_B, RDWR_B, and OE_B controls), and JTAG (IEEE 1149.1 boundary scan for programming and debug). All modes use SRAM-based configuration, enabling unlimited reprogramming and partial reconfiguration capability.