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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV400-4FG676I

Name: XCV400-4FG676I
Brand: AMD
SKU: XCV400-4FG676I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV400-4FG676I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 676-BGA

Datasheet:: XCV400-4FG676I.pdf

Description:: IC FPGA 404 I/O 676FCBGA

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Product details

Overview

XCV400-4FG676I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 468,252 system gates, 10,800 logic cells, and 404 user I/O pins in a 676-ball fine-pitch BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 81,920-bit block RAM and LUT-based RAM/shift register), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV400-4FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include its industrial temperature range (–40°C to +100°C), -4 speed grade (max 200 MHz system performance), SelectIO™ interface support across 16 standards, and dual-ported 4k-bit synchronous block RAM configuration capability.

Technical Context

The XCV400-4FG676I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing-enabling high routability and pin-locking for PCB reuse. Its CLB contains two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5-/6-input logic, and configurable storage elements with synchronous/asynchronous set/reset.

Each IOB supports programmable drive strength (up to 24 mA source / 48 mA sink), slew rate control, weak-keeper, and IEEE 1149.1 boundary-scan. I/O banking enforces VCCO and VREF voltage grouping across eight banks, permitting mixed standards only within compatible voltage domains (e.g., 3.3 V: LVTTL, PCI, SSTL3).

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	468,252 - defines logic capacity for ASIC replacement or complex digital system integration
Logic Cells	10,800 - provides granular, place-and-route efficient resources for RTL synthesis
User I/O Pins	404 - enables high-pin-count interfaces including PCI, HSTL, SSTL, and GTL+
Block RAM Bits	81,920 - implemented as twenty 4k-bit dual-ported synchronous RAM blocks for FIFOs or buffer memory
Speed Grade	-4 - guarantees worst-case timing performance up to 200 MHz system clock including I/O paths
Operating Temperature	Industrial (–40°C to +100°C) - qualified for rugged embedded, industrial control, and telecom infrastructure
Supply Voltage	2.5 V core (VCCINT), 3.3 V/2.5 V/1.5 V I/O (VCCO) - supports multi-voltage board design with bank-level I/O standard mixing

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG676) with 676 solder balls, 27 mm × 27 mm body size, 1.0 mm ball pitch, and industrial-grade thermal performance.

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Dedicated global clock inputs	Low-skew entry points for DLL-controlled clock distribution across full device
PROGRAM_B	Active-low configuration initiator	Triggers reconfiguration from external PROM or JTAG controller
INIT_B	Configuration status indicator	Open-drain output signaling successful bitstream loading or error condition
CCLK	Configuration clock input	Drives master serial mode programming; also used for readback and JTAG TCK synchronization
TCK/TMS/TDI/TDO	JTAG boundary-scan interface	Enables IEEE 1149.1-compliant test, debug, and in-system programming
VCCINT	Core logic supply	2.5 V regulated power for CLBs, routing, and internal logic-requires low-noise decoupling
VCCO_0–VCCO_7	I/O bank supply voltages	Independent VCCO per bank enables simultaneous use of LVTTL (3.3 V), SSTL2 (2.5 V), and HSTL (1.5 V)
VREF_0–VREF_7	I/O threshold reference inputs	Required for SSTL/HSTL/GTL input standards; one per bank, internally tied, must be externally sourced

Key Features

Feature	Design Value
Four DLLs	Enables zero hold-time clock domain crossing, phase alignment, and jitter reduction for high-speed I/O interfaces
Configurable LUT RAM	Each 4-LUT can operate as 16×1-bit synchronous RAM, 16×2-bit, 32×1-bit, or 16×1-bit dual-port RAM-eliminating need for external SRAM in small buffers
Dedicated carry chain	Two-bit-per-CLB fast arithmetic path supports pipelined adders, counters, and DSP datapaths without LUT resource penalty
SelectIO™ interface	Hardware-level support for 16 I/O standards-including PCI, HSTL Class IV (200 MHz), and SSTL3-reducing level-shifter count and board area
SRAM-based configuration	Unlimited in-system reprogramming via JTAG, SelectMAP™, or slave serial modes-enabling field-upgradable logic and rapid prototyping

Applications

High-Speed Communications Backplane	Industrial Motion Control System
Use Scenario: Implementing protocol bridging and packet buffering between multiple 66-MHz PCI slots in a modular telecom chassis. IC Role / Device Role / Timing Role: FPGA acts as a reconfigurable PCI-to-PCI bridge with on-die 81,920-bit block RAM for packet buffering and DLL-synchronized timing for 66-MHz bus handshaking. Use Value: Eliminates discrete bridge ICs and external SRAM; reduces latency via dedicated carry logic for address decoding and F6 multiplexer for 8:1 data multiplexing.	Use Scenario: Real-time closed-loop servo control with synchronized analog I/O sampling, PWM generation, and EtherCAT slave interface. IC Role / Device Role / Timing Role: FPGA serves as deterministic real-time engine-running PID algorithms in CLBs, generating jitter-free PWM via DLL-aligned clocks, and managing EtherCAT frame parsing in LUT RAM. Use Value: Achieves sub-microsecond I/O response using local routing and VersaBlock feedback; supports industrial temperature range without derating.
Medical Imaging Data Acquisition	Ruggedized Test Equipment Controller
Use Scenario: High-throughput digitization and preprocessing of multi-channel ultrasound echo data at >100 MSPS. IC Role / Device Role / Timing Role: FPGA performs parallel time-gain compensation (TGC), beamforming summation, and lossless compression-leveraging LUT shift registers for burst-mode capture and block RAM for line buffers. Use Value: 200 MHz system clock enables real-time 16-bit pixel processing; SelectIO™ supports direct connection to LVDS ADCs and DDR SDRAM without level shifters.	Use Scenario: Embedded controller for automated test equipment requiring hot-swap capability, deterministic trigger sequencing, and legacy GPIB/IEEE-488 interface emulation. IC Role / Device Role / Timing Role: FPGA implements hot-swap state machine, precision timestamping with DLL-stabilized clocks, and bit-banged GPIB protocol with cycle-accurate timing. Use Value: Built-in boundary-scan simplifies board-level test; industrial temp rating ensures reliability in uncooled rack environments; 404 I/O supports parallel bus + serial control expansion.

High-Speed Communications Backplane

Industrial Motion Control System

Use Scenario: Implementing protocol bridging and packet buffering between multiple 66-MHz PCI slots in a modular telecom chassis.

IC Role / Device Role / Timing Role: FPGA acts as a reconfigurable PCI-to-PCI bridge with on-die 81,920-bit block RAM for packet buffering and DLL-synchronized timing for 66-MHz bus handshaking.

Use Value: Eliminates discrete bridge ICs and external SRAM; reduces latency via dedicated carry logic for address decoding and F6 multiplexer for 8:1 data multiplexing.

Use Scenario: Real-time closed-loop servo control with synchronized analog I/O sampling, PWM generation, and EtherCAT slave interface.

IC Role / Device Role / Timing Role: FPGA serves as deterministic real-time engine-running PID algorithms in CLBs, generating jitter-free PWM via DLL-aligned clocks, and managing EtherCAT frame parsing in LUT RAM.

Use Value: Achieves sub-microsecond I/O response using local routing and VersaBlock feedback; supports industrial temperature range without derating.

Medical Imaging Data Acquisition

Ruggedized Test Equipment Controller

Use Scenario: High-throughput digitization and preprocessing of multi-channel ultrasound echo data at >100 MSPS.

IC Role / Device Role / Timing Role: FPGA performs parallel time-gain compensation (TGC), beamforming summation, and lossless compression-leveraging LUT shift registers for burst-mode capture and block RAM for line buffers.

Use Value: 200 MHz system clock enables real-time 16-bit pixel processing; SelectIO™ supports direct connection to LVDS ADCs and DDR SDRAM without level shifters.

Use Scenario: Embedded controller for automated test equipment requiring hot-swap capability, deterministic trigger sequencing, and legacy GPIB/IEEE-488 interface emulation.

IC Role / Device Role / Timing Role: FPGA implements hot-swap state machine, precision timestamping with DLL-stabilized clocks, and bit-banged GPIB protocol with cycle-accurate timing.

Use Value: Built-in boundary-scan simplifies board-level test; industrial temp rating ensures reliability in uncooled rack environments; 404 I/O supports parallel bus + serial control expansion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV400-5FG676I	Same density and package, but -5 speed grade (faster timing, 225 MHz max system clock)	Required where worst-case setup/hold margins exceed -4 grade limits-e.g., 100+ MHz DDR I/O or deep pipeline designs	Select only if timing closure fails with XCV400-4FG676I; higher cost and power consumption
XCV600-4FG676I	Higher density (661,111 gates, 15,552 logic cells), same -4 speed grade and FG676 package	Suitable when design growth exceeds XCV400 capacity but PCB footprint and thermal envelope must remain identical	Drop-in migration path with no layout change; verify power delivery and thermal margin for increased CLB count

Compared with XCV400-4FG676I, the -5 variant improves maximum clock frequency at the cost of higher static power and tighter voltage regulation requirements, while the XCV600-4FG676I offers 41% more logic capacity within identical mechanical and thermal constraints-making it ideal for scalable product families.

Availability

XCV400-4FG676I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging data acquisition, and ruggedized test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCV400-4FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures and EDA tools for high-performance digital system design.

The Virtex family was engineered for high-speed, high-density applications demanding ASIC-like performance with FPGA flexibility-targeting communications infrastructure, industrial automation, and scientific instrumentation where reconfigurability and deterministic timing are critical.

FAQ

Is XCV400-4FG676I still in production or considered obsolete?

XCV400-4FG676I is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). However, Aetrix Electronics maintains verified legacy inventory with full traceability and extended lifecycle support-including obsolescence monitoring, cross-reference assistance, and last-time-buy coordination for ongoing production needs of XCV400-4FG676I.

What configuration modes does XCV400-4FG676I support?

XCV400-4FG676I supports four configuration modes: master serial (reads bitstream from external PROM), slave serial (bitstream loaded via dedicated pins), SelectMAP™ (parallel programming via 8- or 16-bit bus), and JTAG (boundary-scan programming and debugging). All modes retain full access to IEEE 1149.1 test features and allow in-system reconfiguration of XCV400-4FG676I without power cycle.

Can XCV400-4FG676I interface directly with 3.3 V PCI buses?

Yes, XCV400-4FG676I is fully 66-MHz PCI compliant and supports 3.3 V PCI signaling natively through its SelectIO™ I/O blocks. Its IOBs provide 5 V-tolerant inputs for legacy PCI 5 V operation and meet PCI electrical specifications for setup/hold, skew, and drive strength-enabling direct connection to PCI slots without external transceivers or level shifters in XCV400-4FG676I-based designs.

Does XCV400-4FG676I include on-chip memory beyond LUT-based RAM?

Yes, XCV400-4FG676I integrates twenty 4k-bit block SelectRAM modules totaling 81,920 bits of dedicated synchronous dual-ported RAM. Each block supports independent read/write widths (e.g., 16×256 or 8×512), built-in bus-width conversion, and dedicated routing to CLBs-providing deterministic latency and higher density than distributed LUT RAM for FIFOs, frame buffers, or lookup tables in XCV400-4FG676I implementations.

What thermal and power considerations apply to XCV400-4FG676I in industrial environments?

XCV400-4FG676I is rated for industrial temperature (–40°C to +100°C) and requires careful thermal design: typical power dissipation ranges from 1.8 W (static) to 5.2 W (active, depending on toggle rate and I/O loading). Adequate PCB copper pour, thermal vias under the FG676 package, and airflow management are essential. Power supplies must deliver clean 2.5 V (VCCINT) and bank-specific VCCO with ±3% tolerance-critical for stable DLL operation and signal integrity in XCV400-4FG676I deployments.

XCV400-4FG676I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®

Package/Case:: 676-BGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 2400

Number of Logic Elements/Cells:: 10800

Total RAM Bits:: 81920

Number of I/O:: 404

Number of Gates:: 468252

Voltage - Supply:: 2.375V ~ 2.625V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 676-FBGA (27x27)

XCV400-4FG676I FAQ

1.How can I place an order for XCV400-4FG676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV400-4FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV400-4FG676I reliable?

The price and inventory of XCV400-4FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400-4FG676I is usually 5 days.

3.What payment methods are accepted for XCV400-4FG676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV400-4FG676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV400-4FG676I?

XCV400-4FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV400-4FG676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV400-4FG676I?

For technical support, including XCV400-4FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400-4FG676I requirements.

6.How does Aetrix verify that XCV400-4FG676I is sourced from the original manufacturer or authorized distributors?

All XCV400-4FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400-4FG676I meets industry standards.

7.What is the process for return or replacement of XCV400-4FG676I?

All XCV400-4FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XCV400-4FG676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV400-4FG676I part is unused and in its original packaging.

Return procedure for XCV400-4FG676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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