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AMD XCV400-4HQ240C0729

Part No.:
XCV400-4HQ240C0729
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP Exposed Pad
Datasheet:
AetrixXCV400-4HQ240C0729.pdf
Description:
FPGA, 2400 CLBS, 468252 GATES, 2
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,229

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Product details

Overview

XCV400-4HQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 569,952 system gates and 10,800 logic cells in a 40 × 60 CLB array. It features eight digital Delay-Locked Loops (DLLs), up to 404 user I/O pins in HQ240 package, and supports LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz interfaces for high-speed data acquisition and telecom line-card applications.

For engineers reviewing the XCV400-4HQ240C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration options, and real-world FPGA integration considerations for legacy Virtex-E system upgrades.

Technical Context

The XCV400-4HQ240C implements a regular array architecture with configurable logic blocks (CLBs) and input/output blocks (IOBs) interconnected via a general routing matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice.

Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×. I/O banks enforce strict VCCO/VREF grouping: LVTTL/LVCMOS inputs are powered by VCCO (not VCCINT), and differential standards like LVDS require 2.5 V VCCO with no VREF.

Key Specifications

ParameterValue and Actual Design Meaning
System Gates569,952 - defines total logic capacity for gate-equivalent synthesis targeting.
Logic Cells10,800 - actual programmable elements supporting LUT+flip-flop+carry per cell.
User I/O Pins404 - maximum single-ended I/O count in HQ240 package; banked for mixed-voltage operation.
Block RAM Bits163,840 - organized as forty 4096-bit true dual-port synchronous RAM blocks.
DLL Count8 - independent digital delay-locked loops for clock domain bridging and jitter reduction.
Max I/O Speed622 Mb/s - achievable with LVDS signaling; requires matched trace lengths and proper termination.
VCCINT1.8 V ± 0.1 V - core logic supply; lower voltage enables reduced dynamic power vs. 2.5 V Virtex.

Pinout & Package

The XCV400-4HQ240C uses a 240-pin High Heat Dissipation (HQ) plastic quad flat pack (PQFP) package with 0.5 mm pitch and exposed thermal pad. Pinout follows Xilinx DS022-4 Module 4, with dedicated global clocks (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, DONE), JTAG boundary-scan (TCK/TMS/TDI/TDO), and 404 user I/O grouped into eight banks.

Pin/TerminalCircuit RoleDesign Meaning
GCLK0–GCLK3Global Clock InputLow-skew primary clock inputs routed directly to all DLLs and CLBs; must be LVPECL/LVDS for >300 MHz operation.
INIT_BConfiguration StatusOpen-drain active-low signal indicating configuration memory readiness; drives external pull-up during startup.
PROGRAM_BConfiguration ResetActive-low asynchronous reset that clears configuration memory and restarts loading sequence.
DONEConfiguration CompletionOpen-drain output confirming successful bitstream load; used to enable downstream logic after FPGA initialization.
TCK/TMS/TDI/TDOJTAG Boundary ScanIEEE 1149.1-compliant test interface for in-system programming and interconnect verification.

Key Features

FeatureDesign Value
SRAM-Based In-System ReconfigurationUnlimited reprogramming cycles without hardware replacement; supports field-upgradable protocols and partial reconfiguration workflows.
SelectI/O+™ TechnologySupports 20 I/O standards including LVDS, LVPECL, SSTL, HSTL, and PCI; each bank enforces VCCO/VREF co-location rules.
SelectRAM+™ Memory HierarchyCombines 163,840 bits of true dual-port block RAM with distributed CLB-based RAM for pipelined buffering and FIFO implementation.
SelectLink™ DDR InterfaceProprietary high-speed link enabling double-data-rate communication between Virtex-E devices; requires HDL generation via Web-based tools.
Digital DLL Clock ManagementEight DLLs provide deterministic clock deskew, 50% duty cycle correction, and integer frequency multiplication without external PLL components.

Applications

Telecom Line CardIndustrial Motion Control

Use Scenario: High-density packet processing and framer synchronization in OC-48/STM-16 line cards requiring deterministic latency and multi-protocol support.

IC Role / Device Role / Timing Role: FPGA fabric implements SERDES interface logic, HDLC framing, and time-division multiplexing; DLLs lock to recovered 155.52 MHz line clock.

Use Value: 622 Mb/s LVDS I/O enables direct connection to TI TSB12LV01 or similar PHYs; 8 DLLs allow independent clock domains for SONET, Ethernet, and backplane buses.

Use Scenario: Real-time closed-loop servo control in CNC machines using analog feedback, encoder inputs, and PWM motor drivers.

IC Role / Device Role / Timing Role: Configurable logic executes PID algorithms, generates synchronized PWM waveforms, and manages quadrature encoder counting at >10 MHz rates.

Use Value: Dedicated carry chains accelerate arithmetic; 10,800 logic cells accommodate multiple concurrent motion profiles; 1.8 V VCCINT reduces thermal load in enclosed enclosures.

Medical Imaging Data AcquisitionMilitary Radar Signal Processing

Use Scenario: Digitizing and preprocessing ultrasound echo streams from 128-channel transducer arrays with sub-10 ns timing precision.

IC Role / Device Role / Timing Role: FPGA captures parallel ADC outputs, applies beamforming coefficients, and buffers data before PCIe transfer; DLLs align sampling clocks across channels.

Use Value: 404 I/O pins support full-width parallel ADC bus; block RAM provides 163,840-bit ping-pong buffering for continuous streaming without CPU intervention.

Use Scenario: Pulse-Doppler radar front-end implementing digital down-conversion, CFAR detection, and pulse compression on airborne platforms.

IC Role / Device Role / Timing Role: FPGA performs real-time FFTs, matched filtering, and thresholding; LVPECL clock inputs synchronize with 300+ MHz radar IF sources.

Use Value: Eight DLLs enable simultaneous 100 MHz baseband and 300 MHz IF clock domains; true dual-port RAM allows concurrent read/write for sliding-window FFTs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system logic applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCV400E-6HQ240CHigher speed grade (-6 vs. -4); 133 MHz register-to-register timing vs. 125 MHz.Suitable for designs requiring tighter setup/hold margins or higher clock frequencies.Select when target system clock exceeds 125 MHz or when worst-case timing closure fails with -4 grade.
XCV600E-4HQ240CHigher density (985,882 gates, 15,552 logic cells); same package and speed grade.Enables larger state machines, deeper pipelines, or additional protocol stacks without PCB change.Choose for design scalability where future feature expansion is anticipated within same footprint.

Compared with XCV400-4HQ240C, the XCV400E-6HQ240C offers faster timing closure at cost of higher power consumption, while the XCV600E-4HQ240C provides headroom for logic growth but requires re-synthesis and may increase static power due to larger die area.

Availability

XCV400-4HQ240C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and defense electronics requiring stable component supply for long-lifecycle programs.

Supply support for XCV400-4HQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic solutions for demanding compute and interface applications.

The Virtex-E product line was engineered for high-speed, low-power system integration in telecom, test equipment, and military systems-emphasizing I/O flexibility, clock management, and memory hierarchy over raw gate count.

FAQ

What is the maximum operating junction temperature for XCV400-4HQ240C?

The XCV400-4HQ240C is rated for commercial temperature range (0 °C to +85 °C junction). Its C suffix confirms compliance with this specification. Thermal design must ensure junction temperature remains within this limit under worst-case power dissipation, especially when using all 8 DLLs and high I/O toggle rates.

Does XCV400-4HQ240C support JTAG boundary scan testing?

Yes, XCV400-4HQ240C includes full IEEE 1149.1-compliant boundary scan logic. Pins TCK, TMS, TDI, and TDO are dedicated for this function and support device-level interconnect testing, in-system programming, and configuration verification without requiring external test fixtures.

Can XCV400-4HQ240C be configured via slave serial mode?

Yes, XCV400-4HQ240C supports slave serial configuration using the DIN pin synchronized to an external clock on CCLK. This mode allows microcontroller-driven configuration and is commonly used in embedded systems where host processor controls FPGA initialization sequence and bitstream selection.

How many differential I/O pairs does XCV400-4HQ240C support?

XCV400-4HQ240C supports up to 183 differential I/O pairs, as specified in Table 1 of DS022-1. This count assumes use of LVDS or LVPECL standards and accounts for pin pairing constraints within I/O banks; actual usable pairs depend on bank voltage assignments and routing resources.

Is XCV400-4HQ240C pin-compatible with other Virtex-E devices in HQ240 package?

XCV400-4HQ240C shares the same HQ240 pinout with XCV300E-4HQ240C and XCV600E-4HQ240C per DS022-4 Module 4, but functional compatibility requires verifying I/O bank assignments, VCCO requirements, and DLL usage. Unused pins may differ across densities, affecting PCB reuse.

XCV400-4HQ240C0729 Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
240-BFQFP Exposed Pad
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
10800
Total RAM Bits:
81920
Number of I/O:
166
Number of Gates:
468252
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV400-4HQ240C0729 FAQ

1.How can I place an order for XCV400-4HQ240C0729 through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV400-4HQ240C0729 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV400-4HQ240C0729 reliable?

The price and inventory of XCV400-4HQ240C0729 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400-4HQ240C0729 is usually 5 days.

3.What payment methods are accepted for XCV400-4HQ240C0729?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV400-4HQ240C0729 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV400-4HQ240C0729?

XCV400-4HQ240C0729 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV400-4HQ240C0729 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV400-4HQ240C0729?

For technical support, including XCV400-4HQ240C0729 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400-4HQ240C0729 requirements.

6.How does Aetrix verify that XCV400-4HQ240C0729 is sourced from the original manufacturer or authorized distributors?

All XCV400-4HQ240C0729 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400-4HQ240C0729 meets industry standards.

7.What is the process for return or replacement of XCV400-4HQ240C0729?

All XCV400-4HQ240C0729 units undergo pre-shipment inspection (PSI). If there is an issue with XCV400-4HQ240C0729, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV400-4HQ240C0729 part is unused and in its original packaging.

Return procedure for XCV400-4HQ240C0729:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV400-4HQ240C0729 Tags

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