AMD XCV400-4HQ240C0729
- Part No.:
- XCV400-4HQ240C0729
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP Exposed Pad
- Datasheet:
-
XCV400-4HQ240C0729.pdf
- Description:
- FPGA, 2400 CLBS, 468252 GATES, 2
- Quantity:
- Payment:

- Shipping:

Inventory:3,229
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Product details
Overview
XCV400-4HQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 569,952 system gates and 10,800 logic cells in a 40 × 60 CLB array. It features eight digital Delay-Locked Loops (DLLs), up to 404 user I/O pins in HQ240 package, and supports LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz interfaces for high-speed data acquisition and telecom line-card applications.
For engineers reviewing the XCV400-4HQ240C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration options, and real-world FPGA integration considerations for legacy Virtex-E system upgrades.
Technical Context
The XCV400-4HQ240C implements a regular array architecture with configurable logic blocks (CLBs) and input/output blocks (IOBs) interconnected via a general routing matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice.
Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×. I/O banks enforce strict VCCO/VREF grouping: LVTTL/LVCMOS inputs are powered by VCCO (not VCCINT), and differential standards like LVDS require 2.5 V VCCO with no VREF.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 569,952 - defines total logic capacity for gate-equivalent synthesis targeting. |
| Logic Cells | 10,800 - actual programmable elements supporting LUT+flip-flop+carry per cell. |
| User I/O Pins | 404 - maximum single-ended I/O count in HQ240 package; banked for mixed-voltage operation. |
| Block RAM Bits | 163,840 - organized as forty 4096-bit true dual-port synchronous RAM blocks. |
| DLL Count | 8 - independent digital delay-locked loops for clock domain bridging and jitter reduction. |
| Max I/O Speed | 622 Mb/s - achievable with LVDS signaling; requires matched trace lengths and proper termination. |
| VCCINT | 1.8 V ± 0.1 V - core logic supply; lower voltage enables reduced dynamic power vs. 2.5 V Virtex. |
Pinout & Package
The XCV400-4HQ240C uses a 240-pin High Heat Dissipation (HQ) plastic quad flat pack (PQFP) package with 0.5 mm pitch and exposed thermal pad. Pinout follows Xilinx DS022-4 Module 4, with dedicated global clocks (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, DONE), JTAG boundary-scan (TCK/TMS/TDI/TDO), and 404 user I/O grouped into eight banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Low-skew primary clock inputs routed directly to all DLLs and CLBs; must be LVPECL/LVDS for >300 MHz operation. |
| INIT_B | Configuration Status | Open-drain active-low signal indicating configuration memory readiness; drives external pull-up during startup. |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts loading sequence. |
| DONE | Configuration Completion | Open-drain output confirming successful bitstream load; used to enable downstream logic after FPGA initialization. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface for in-system programming and interconnect verification. |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-Based In-System Reconfiguration | Unlimited reprogramming cycles without hardware replacement; supports field-upgradable protocols and partial reconfiguration workflows. |
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS, LVPECL, SSTL, HSTL, and PCI; each bank enforces VCCO/VREF co-location rules. |
| SelectRAM+™ Memory Hierarchy | Combines 163,840 bits of true dual-port block RAM with distributed CLB-based RAM for pipelined buffering and FIFO implementation. |
| SelectLink™ DDR Interface | Proprietary high-speed link enabling double-data-rate communication between Virtex-E devices; requires HDL generation via Web-based tools. |
| Digital DLL Clock Management | Eight DLLs provide deterministic clock deskew, 50% duty cycle correction, and integer frequency multiplication without external PLL components. |
Applications
| Telecom Line Card | Industrial Motion Control |
|---|---|
Use Scenario: High-density packet processing and framer synchronization in OC-48/STM-16 line cards requiring deterministic latency and multi-protocol support. IC Role / Device Role / Timing Role: FPGA fabric implements SERDES interface logic, HDLC framing, and time-division multiplexing; DLLs lock to recovered 155.52 MHz line clock. Use Value: 622 Mb/s LVDS I/O enables direct connection to TI TSB12LV01 or similar PHYs; 8 DLLs allow independent clock domains for SONET, Ethernet, and backplane buses. | Use Scenario: Real-time closed-loop servo control in CNC machines using analog feedback, encoder inputs, and PWM motor drivers. IC Role / Device Role / Timing Role: Configurable logic executes PID algorithms, generates synchronized PWM waveforms, and manages quadrature encoder counting at >10 MHz rates. Use Value: Dedicated carry chains accelerate arithmetic; 10,800 logic cells accommodate multiple concurrent motion profiles; 1.8 V VCCINT reduces thermal load in enclosed enclosures. |
| Medical Imaging Data Acquisition | Military Radar Signal Processing |
Use Scenario: Digitizing and preprocessing ultrasound echo streams from 128-channel transducer arrays with sub-10 ns timing precision. IC Role / Device Role / Timing Role: FPGA captures parallel ADC outputs, applies beamforming coefficients, and buffers data before PCIe transfer; DLLs align sampling clocks across channels. Use Value: 404 I/O pins support full-width parallel ADC bus; block RAM provides 163,840-bit ping-pong buffering for continuous streaming without CPU intervention. | Use Scenario: Pulse-Doppler radar front-end implementing digital down-conversion, CFAR detection, and pulse compression on airborne platforms. IC Role / Device Role / Timing Role: FPGA performs real-time FFTs, matched filtering, and thresholding; LVPECL clock inputs synchronize with 300+ MHz radar IF sources. Use Value: Eight DLLs enable simultaneous 100 MHz baseband and 300 MHz IF clock domains; true dual-port RAM allows concurrent read/write for sliding-window FFTs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV400E-6HQ240C | Higher speed grade (-6 vs. -4); 133 MHz register-to-register timing vs. 125 MHz. | Suitable for designs requiring tighter setup/hold margins or higher clock frequencies. | Select when target system clock exceeds 125 MHz or when worst-case timing closure fails with -4 grade. |
| XCV600E-4HQ240C | Higher density (985,882 gates, 15,552 logic cells); same package and speed grade. | Enables larger state machines, deeper pipelines, or additional protocol stacks without PCB change. | Choose for design scalability where future feature expansion is anticipated within same footprint. |
Compared with XCV400-4HQ240C, the XCV400E-6HQ240C offers faster timing closure at cost of higher power consumption, while the XCV600E-4HQ240C provides headroom for logic growth but requires re-synthesis and may increase static power due to larger die area.
Availability
XCV400-4HQ240C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and defense electronics requiring stable component supply for long-lifecycle programs.
Supply support for XCV400-4HQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic solutions for demanding compute and interface applications.
The Virtex-E product line was engineered for high-speed, low-power system integration in telecom, test equipment, and military systems-emphasizing I/O flexibility, clock management, and memory hierarchy over raw gate count.
FAQ
What is the maximum operating junction temperature for XCV400-4HQ240C?
The XCV400-4HQ240C is rated for commercial temperature range (0 °C to +85 °C junction). Its C suffix confirms compliance with this specification. Thermal design must ensure junction temperature remains within this limit under worst-case power dissipation, especially when using all 8 DLLs and high I/O toggle rates.
Does XCV400-4HQ240C support JTAG boundary scan testing?
Yes, XCV400-4HQ240C includes full IEEE 1149.1-compliant boundary scan logic. Pins TCK, TMS, TDI, and TDO are dedicated for this function and support device-level interconnect testing, in-system programming, and configuration verification without requiring external test fixtures.
Can XCV400-4HQ240C be configured via slave serial mode?
Yes, XCV400-4HQ240C supports slave serial configuration using the DIN pin synchronized to an external clock on CCLK. This mode allows microcontroller-driven configuration and is commonly used in embedded systems where host processor controls FPGA initialization sequence and bitstream selection.
How many differential I/O pairs does XCV400-4HQ240C support?
XCV400-4HQ240C supports up to 183 differential I/O pairs, as specified in Table 1 of DS022-1. This count assumes use of LVDS or LVPECL standards and accounts for pin pairing constraints within I/O banks; actual usable pairs depend on bank voltage assignments and routing resources.
Is XCV400-4HQ240C pin-compatible with other Virtex-E devices in HQ240 package?
XCV400-4HQ240C shares the same HQ240 pinout with XCV300E-4HQ240C and XCV600E-4HQ240C per DS022-4 Module 4, but functional compatibility requires verifying I/O bank assignments, VCCO requirements, and DLL usage. Unused pins may differ across densities, affecting PCB reuse.
XCV400-4HQ240C0729 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 240-BFQFP Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 10800
- Total RAM Bits:
- 81920
- Number of I/O:
- 166
- Number of Gates:
- 468252
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV400-4HQ240C0729 FAQ
1.How can I place an order for XCV400-4HQ240C0729 through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV400-4HQ240C0729 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV400-4HQ240C0729 reliable?
The price and inventory of XCV400-4HQ240C0729 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400-4HQ240C0729 is usually 5 days.
3.What payment methods are accepted for XCV400-4HQ240C0729?
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XCV400-4HQ240C0729 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV400-4HQ240C0729 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV400-4HQ240C0729?
For technical support, including XCV400-4HQ240C0729 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400-4HQ240C0729 requirements.
6.How does Aetrix verify that XCV400-4HQ240C0729 is sourced from the original manufacturer or authorized distributors?
All XCV400-4HQ240C0729 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400-4HQ240C0729 meets industry standards.
7.What is the process for return or replacement of XCV400-4HQ240C0729?
All XCV400-4HQ240C0729 units undergo pre-shipment inspection (PSI). If there is an issue with XCV400-4HQ240C0729, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV400-4HQ240C0729 part is unused and in its original packaging.
Return procedure for XCV400-4HQ240C0729:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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