AMD XCV400-5BG432C

Overview

XCV400-5BG432C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 468,252 system gates, 10,800 logic cells, and 404 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 81,920-bit block RAM and LUT-based RAM/shift registers), and supports 66-MHz PCI compliance and hot-swap operation for Compact PCI systems.

For engineers reviewing the XCV400-5BG432C datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (guaranteed 200 MHz system performance), BG432 package I/O count and thermal profile, SelectIO™ interface standard compatibility (LVTTL, HSTL, SSTL), and dual-port block RAM configuration capability for high-speed data buffering.

Technical Context

The XCV400-5BG432C implements a hierarchical routing architecture with general-purpose routing matrix (GRM), local VersaBlock interconnect, and dedicated resources including four DLLs for clock deskew and four global low-skew clock nets plus 24 secondary local clock nets. Its CLB structure contains two slices, each with four 4-input LUTs, carry chains, and configurable storage elements supporting synchronous/asynchronous set/reset.

It integrates 20 block SelectRAM™ modules (each 4k-bit, dual-ported, configurable depth/width), supports multi-standard I/O banking with per-bank VCCO and VREF constraints, and enables in-system reconfiguration via master serial, slave serial, SelectMAP™, or JTAG modes - all verified for commercial temperature range (0°C to +85°C).

Key Specifications

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 35 mm × 35 mm, 1.27 mm pitch, RoHS-compliant, commercial-grade thermal profile.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV400-5BG432C, the XCV400-6BG432C offers higher timing margin without layout change, while the XCV600-5BG560C delivers greater logic and I/O capacity at the cost of mechanical and thermal redesign - making the XCV400-5BG432C optimal for cost-sensitive, volume-commercial applications with fixed I/O and performance requirements.

Availability

XCV400-5BG432C is available at Aetrix Electronics and suitable for high-reliability communications infrastructure, industrial control systems, and medical imaging equipment requiring stable component supply and long-term obsolescence management.

Supply support for XCV400-5BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures and EDA toolchains for high-performance digital system design.

The Virtex family, including XCV400-5BG432C, was engineered for high-speed, high-density applications demanding advanced clock management, multi-standard I/O, and scalable embedded logic - targeting communications, test equipment, and compute-accelerated systems.

FAQ

What is the maximum guaranteed operating frequency of the XCV400-5BG432C?

The XCV400-5BG432C has a -5 speed grade, guaranteeing synchronous system clock operation up to 200 MHz under worst-case commercial conditions (0°C to +85°C, 2.5 V ±3%). This includes I/O timing and is validated using Xilinx's timing analysis tools with default constraints. Actual achievable frequency depends on design topology, placement, and routing - but the -5 grade ensures timing closure for most 200 MHz logic and interface implementations.

Does the XCV400-5BG432C support hot-swap functionality for CompactPCI systems?

Yes, the XCV400-5BG432C is explicitly designed to meet CompactPCI hot-swap requirements. Its I/O architecture supports controlled power sequencing, bus-hold states during insertion/removal, and robust ESD protection. The device's 5 V-tolerant inputs and programmable weak-keeper circuits maintain valid logic levels on shared backplane lines during transition phases - a key requirement verified in Xilinx DS003 documentation for CompactPCI compliance.

How many block RAM resources does the XCV400-5BG432C provide, and what configurations are supported?

The XCV400-5BG432C integrates 20 block SelectRAM™ modules, totaling 81,920 bits of dedicated memory. Each 4,096-bit block is fully synchronous and dual-ported, supporting independent read/write operations on two ports. Configurable aspect ratios include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible data buffering, FIFOs, coefficient storage, and bus-width conversion without consuming LUT-based distributed RAM resources.

What I/O standards are supported by the XCV400-5BG432C, and how are they managed across I/O banks?

The XCV400-5BG432C supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI 3.3 V/5 V, SSTL2/I/II, HSTL I/III/IV, GTL+, and CTT. These are managed across eight I/O banks (two per side), each with dedicated VCCO and VREF pins. Output standards sharing the same VCCO (e.g., LVTTL and SSTL3 at 3.3 V) can coexist in one bank; input standards requiring VREF must use the same VREF voltage within a bank - enforced by physical pin grouping and configuration bitstream validation.

Is the XCV400-5BG432C still in active production, and what obsolescence support does Aetrix Electronics provide?

No - the XCV400-5BG432C is officially obsolete per Xilinx documentation (DS003 v4.0, March 2013). However, Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle availability coordination, including last-time-buy planning, cross-reference engineering support, and migration path guidance to compatible Virtex-II or Spartan families where technically feasible - ensuring continuity for existing industrial and medical designs still in production.