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AMD XCV400-5BG432I

Part No.:
XCV400-5BG432I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
432-LBGA Exposed Pad, Metal
Datasheet:
AetrixXCV400-5BG432I.pdf
Description:
IC FPGA 316 I/O 432MBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,241

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Product details

Overview

XCV400-5BG432I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 468,252 system gates, 10,800 logic cells, and 404 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 81,920 bits of block RAM and LUTs configurable as RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV400-5BG432I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV400-5BG432I implements a hierarchical routing architecture with general-purpose routing matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFTs for internal 3-state bussing.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed signaling standards only when sharing VCCO voltage (e.g., LVTTL and SSTL3 at 3.3 V), while GTL/GTL+ are compatible across all VCCO levels due to open-drain outputs.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 468,252 - defines total combinational logic capacity for gate-equivalent synthesis mapping
Logic Cells 10,800 - CLB count used for place-and-route resource estimation and timing closure
User I/O Pins 404 - maximum routable signals excluding dedicated clocks; constrained by BG432 package pinout
Block RAM Bits 81,920 - distributed across 20 × 4,096-bit dual-ported synchronous RAM blocks for data buffering
Speed Grade -5 - specifies worst-case timing performance: e.g., register-to-register delay ≤ 5.0 ns at 200 MHz system clock
DLL Count 4 - enables advanced clock deskew, phase alignment, and domain crossing between asynchronous clocks
Operating Voltage 2.5 V core / 3.3 V I/O - requires separate VCCINT and VCCO supplies; VCCO per bank determines supported I/O standards

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 35 mm × 35 mm, 1.27 mm pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Dedicated low-skew inputs feeding four primary clock networks; must be driven by clean, low-jitter sources
CCLK Configuration Clock Serial configuration clock input during master serial mode; drives internal bitstream loading sequence
DIN Configuration Data In Serial data input for master serial configuration; synchronized to CCLK edge
INIT_B Configuration Initialization Open-drain active-low signal indicating configuration status; pulled high externally during valid config
PROGRAM_B Configuration Reset Active-low asynchronous reset that clears configuration memory and restarts boot process
VCCINT Core Power Supply 2.5 V ± 3% supply for CLBs, DLLs, and internal logic; decoupling required within 1 cm of each pin
VCCO_0–VCCO_7 I/O Bank Power Bank-specific 3.3 V (or 2.5 V/1.5 V) supply determining output voltage level and compatible I/O standards
VREF_0–VREF_7 I/O Reference Voltage Bank-specific threshold reference for SSTL/HSTL/GTL inputs; must match standard's VREF requirement

Key Features

Feature Design Value
Four DLLs Enables zero hold-time pad-to-pad paths and precise clock phase alignment across multiple domains
Configurable LUT RAM Each 4-input LUT operates as 16×1-bit synchronous RAM, 16×2-bit, 32×1-bit, or 16×1-bit dual-port RAM
Eight I/O Banks Allows concurrent use of multiple voltage-referenced standards (e.g., SSTL3 on Bank 0, HSTL on Bank 2)
Dedicated Carry Chains Two per CLB slice supports high-speed arithmetic (e.g., 32-bit adder in <8 ns) without LUT resource consumption
IEEE 1149.1 Boundary Scan Full JTAG TAP controller integrated for board-level test, debug, and in-system programming

Applications

PCI Bridge Controller High-Speed Data Acquisition

Use Scenario: Implementing a 66-MHz PCI bus master interface between host CPU and custom peripherals.

IC Role / Device Role / Timing Role: FPGA acts as PCI target/master bridge with programmable address decoding, burst transaction control, and timing compliance.

Use Value: Leverages built-in 66-MHz PCI compliance, DLL-controlled clock domain synchronization, and 404 I/O for full 64-bit address/data multiplexing.

Use Scenario: Capturing parallel ADC samples at >100 MSPS with real-time filtering and buffering.

IC Role / Device Role / Timing Role: FPGA serves as high-speed digital front-end with LVDS input receivers, pipeline registers, and block RAM FIFOs.

Use Value: Uses 404 I/O pins for wide parallel interfaces, 81,920-bit block RAM for deep sample buffering, and DLLs to align sampling clocks.

CompactPCI Hot-Swap Controller Protocol Translation Gateway

Use Scenario: Managing power sequencing, insertion detection, and fault isolation in modular backplane systems.

IC Role / Device Role / Timing Role: FPGA implements hot-swap state machine, GPIO monitoring, and I²C/SMBus interface to power controllers.

Use Value: Relies on industrial temperature rating (–40°C to +100°C), die-temperature sensor diode, and robust I/O drive (24 mA sink/source).

Use Scenario: Converting between SPI sensor interface and Ethernet MAC layer in industrial IoT edge node.

IC Role / Device Role / Timing Role: FPGA performs protocol bridging, packet assembly, and clock domain crossing between asynchronous buses.

Use Value: Uses dual-ported block RAM for zero-copy buffer handoff and four DLLs to synchronize 25 MHz SPI and 125 MHz GMII domains.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV400-6BG432I Faster speed grade (–6 vs –5); 0.9 ns lower register-to-register delay; identical pinout and memory resources Better suited for designs requiring >180 MHz system clock or tighter setup/hold margins Select when timing closure fails at –5 grade or when future-proofing for higher-frequency upgrades
XCV600-5BG560 Larger device (661k gates, 512 I/O, 98,304 block RAM bits) in 560-ball BGA; same -5 speed grade and architecture Required for designs exceeding XCV400 logic or I/O capacity; supports larger memory buffers and more complex protocols Choose when migrating upward within Virtex family with PCB redesign allowance for BG560 footprint

Compared with XCV400-5BG432I, the XCV400-6BG432I offers improved timing margin without layout change, while the XCV600-5BG560 provides scalable logic density and I/O count at the cost of larger package and higher power - both retain identical toolchain support and configuration methodology.

Availability

XCV400-5BG432I is available at Aetrix Electronics and suitable for industrial control systems, legacy telecom infrastructure upgrades, aerospace avionics retrofit programs, and medical imaging subsystems requiring stable component supply over extended product lifecycles.

Supply support for XCV400-5BG432I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architecture and development tools for high-performance digital system design.

The Virtex family was designed for high-speed, high-density logic implementation in demanding applications such as wired communications, military systems, and scientific instrumentation - emphasizing place-and-route efficiency, clock management, and I/O flexibility.

FAQ

What is the maximum operating frequency supported by XCV400-5BG432I?

XCV400-5BG432I supports synchronous system clock rates up to 200 MHz including I/O, with worst-case register-to-register timing of 5.0 ns at the –5 speed grade. Actual achievable frequency depends on design complexity, placement, and routing; representative circuits like pipelined multipliers operate at 160–200 MHz under typical conditions per DS003-2 Table 2.

Does XCV400-5BG432I support hot-swap operation in CompactPCI systems?

Yes, XCV400-5BG432I is explicitly designed for hot-swappable CompactPCI applications per DS003-1 features list. Its I/O structure, power sequencing behavior, and industrial temperature rating (–40°C to +100°C) meet the electrical and thermal requirements for safe insertion/removal while the backplane remains powered.

How many block RAMs does XCV400-5BG432I contain, and what configurations are supported?

XCV400-5BG432I contains 20 block SelectRAM units totaling 81,920 bits. Each block is a fully synchronous dual-ported 4,096-bit RAM with independently configurable port widths (1–16 bits) and depths (256–4096), enabling built-in bus-width conversion and flexible FIFO or buffer implementations per DS003-2 Table 3 and Figure 6.

Can XCV400-5BG432I interface directly with 5 V TTL logic?

XCV400-5BG432I supports 5 V-tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards per DS003-2 Table 1, but its outputs are not 5 V capable - they operate at VCCO (typically 3.3 V). Direct connection to 5 V logic requires external level-shifting or clamping circuitry on output lines to avoid damage.

What configuration modes are supported by XCV400-5BG432I?

XCV400-5BG432I supports four configuration modes: master serial (reads bitstream from external PROM), slave serial, SelectMAP™ (parallel data loading), and JTAG (boundary-scan programming). All modes use the same pin set (DIN, CCLK, PROGRAM_B, INIT_B) with mode selected via mode pins M0–M2 per DS003-1 Section "SRAM-based in-system configuration".

XCV400-5BG432I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
432-LBGA Exposed Pad, Metal
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
10800
Total RAM Bits:
81920
Number of I/O:
316
Number of Gates:
468252
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
432-MBGA (40x40)

XCV400-5BG432I FAQ

1.How can I place an order for XCV400-5BG432I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV400-5BG432I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV400-5BG432I reliable?

The price and inventory of XCV400-5BG432I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400-5BG432I is usually 5 days.

3.What payment methods are accepted for XCV400-5BG432I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV400-5BG432I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV400-5BG432I?

XCV400-5BG432I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV400-5BG432I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV400-5BG432I?

For technical support, including XCV400-5BG432I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400-5BG432I requirements.

6.How does Aetrix verify that XCV400-5BG432I is sourced from the original manufacturer or authorized distributors?

All XCV400-5BG432I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400-5BG432I meets industry standards.

7.What is the process for return or replacement of XCV400-5BG432I?

All XCV400-5BG432I units undergo pre-shipment inspection (PSI). If there is an issue with XCV400-5BG432I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV400-5BG432I part is unused and in its original packaging.

Return procedure for XCV400-5BG432I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV400-5BG432I Tags

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