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AMD XCV400-5BG560C

Part No.:
XCV400-5BG560C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
560-LBGA Exposed Pad, Metal
Datasheet:
AetrixXCV400-5BG560C.pdf
Description:
IC FPGA 404 I/O 560MBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,200

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Product details

Overview

XCV400-5BG560C from AMD is a Virtex-E FPGA device intended for configurable logic, embedded digital processing support, and interface concentration in legacy embedded and communications systems. This orderable option combines the Virtex-E architecture with the 560-LBGA Exposed Pad, Metal package used by this orderable option, allowing the design team to keep board-specific logic, buffering, and connectivity functions inside one programmable device rather than scattering them across multiple fixed-function parts.

Virtex-E devices provide an older high-performance FPGA platform for legacy communications, embedded digital systems, and board-level programmable logic designs that still depend on established Xilinx high-density footprints. For engineers reviewing the XCV400-5BG560C datasheet, XCV400-5BG560C pinout, XCV400-5BG560C application, or XCV400-5BG560C equivalent, this device is widely used in legacy industrial control hardware, communications boards, programmable interface bridges, sustaining-production embedded systems, and board-level digital consolidation designs.

Technical Context

In real hardware, XCV400-5BG560C is used as an FPGA platform rather than a fixed-function controller. The selected Virtex-E density and speed grade 5 orderable option. matter because logic capacity, I/O reach, and package escape constraints all influence whether the device can absorb the intended control, buffering, and subsystem interface workload.

The exact orderable code is important here: 560-LBGA Exposed Pad, Metal affects legacy PCB compatibility and escape routing, speed grade 5 orderable option. affects timing margin, and the commercial temperature option indicated by the suffix. determines whether the part can remain aligned with the target deployment range or sustaining-production qualification need.

Virtex-E density point for sustaining-production programmable logic and high-I/O legacy board integration. In practice, this means XCV400-5BG560C is typically chosen when a program must preserve an established FPGA footprint while still keeping board-specific digital control, interface adaptation, and subsystem glue logic inside one programmable device.

Key Specifications

Parameter Value and Actual Design Meaning
Device Type Virtex-E FPGA.
Series Virtex-E
Package 560-LBGA Exposed Pad, Metal package with bulk packing.
Speed Grade Speed grade 5 orderable option.
Operating Range Commercial temperature option indicated by the suffix.
Architecture Role Legacy field-programmable logic device for configurable digital processing, interface adaptation, and subsystem integration.
Integration Focus Used where board-specific programmable logic, interface glue, and sustaining-production digital control need to be consolidated.
Programming Model Configuration-based FPGA platform within the referenced AMD/Xilinx legacy family.

Pinout & Package

The XCV400-5BG560C pinout includes configurable user I/O, power rails, configuration and JTAG connections, and package-specific escape resources within 560-LBGA Exposed Pad, Metal package.

For PCB design, the main concerns are footprint continuity, power integrity, configuration access, and escape routing that preserves compatibility with the established board architecture.

Pin / Function PCB Design and Circuit Role
User I/O Pins Configurable pins used for subsystem interfaces, address/data paths, timing signals, and board-specific digital connectivity.
Clock / Timing Pins Used to support synchronous logic behavior and timing distribution inside the programmable fabric.
Configuration / JTAG Pins Support device programming, configuration control, and board-level debug access.
Power Rails Support the core and I/O voltage domains required by the selected legacy FPGA family.
Ground Pins Provide return paths needed for stable digital operation and noise control.

Key Features

  • Configurable FPGA fabric supports board-specific logic, control, and interface integration.
  • Legacy package options help preserve established PCB footprints and routing strategies.
  • Orderable speed grades help align the device with validated board timing margins.
  • Suitable for sustaining-production digital control and interface-consolidation functions.
  • Supports long-life hardware programs that still depend on older programmable logic platforms.
  • Field-programmable behavior preserves updateability across maintenance revisions.

Applications

Legacy Industrial Control Sustaining Communications Boards

Use Scenario: Used in older control hardware that still depends on established programmable logic footprints.

IC Role: Acts as the board-specific digital control and interface layer.

Use Value: Helps preserve validated hardware while keeping logic configurable.

Use Scenario: Used in older communications equipment that still relies on FPGA-based framing, routing, or glue logic.

IC Role: Implements board-specific protocol and control behavior.

Use Value: Supports long-life maintenance without a full digital redesign.

Interface Bridge Logic Embedded Board Consolidation

Use Scenario: Used where multiple peripheral or subsystem interfaces need to be coordinated inside one programmable device.

IC Role: Centralizes digital adaptation and routing functions.

Use Value: Reduces the need for multiple fixed-function logic devices.

Use Scenario: Used to absorb discrete timing, state-machine, and digital support logic in sustaining-production embedded systems.

IC Role: Provides one configurable logic block for board-level digital functions.

Use Value: Keeps older designs maintainable while preserving layout continuity.

Equivalent & Alternatives

When evaluating a XCV400-5BG560C equivalent, engineers should compare family generation, package footprint, speed grade, operating range, and whether the replacement preserves legacy board compatibility.

Alternative Part Technical Difference Application Difference Selection Advice
XCV400E-6BG432C Closely related orderable option in the same or adjacent family density with a different package, speed, or qualification emphasis. Used when the board stays in the same general FPGA family but requires a different orderable fit. Compare package, speed grade, suffix, and validated system margins before substitution.
XCV600E-7BG432C Alternative programmable logic option that can serve a similar board-level role with a different density or family emphasis. Used in comparable sustaining-production or legacy interface-heavy applications when the design tradeoff shifts. Choose according to footprint compatibility, logic capacity, and platform continuity.

Compared with XCV400E-6BG432C, XCV400-5BG560C selection depends on exact package, speed grade, suffix, and board-compatibility fit. XCV400-5BG560C vs XCV600E-7BG432C selection depends on whether the design should remain in the same legacy FPGA path or shift to another density with different integration tradeoffs.

Quality

XCV400-5BG560C should be sourced as original AMD/Xilinx programmable logic inventory through traceable supply channels. Quality checks may include package inspection, top-mark validation, configuration access checks, and board-level bring-up verification.

Production validation should include power-sequencing review, configuration reliability, timing-margin confirmation, and signal-integrity checks around legacy high-activity I/O paths.

Availability

XCV400-5BG560C is suitable for sustaining-production programmable logic, subsystem integration, and legacy FPGA-based control or interface functions in embedded, industrial, and communications hardware.

Supply support may include volume procurement planning, scheduled delivery arrangements, traceable sourcing management, and long-term supply support for OEM, industrial electronics, automotive electronics, and embedded product programs. Sample and NPI supply support, as well as urgent in-stock supply support, can also be arranged for prototype builds, pilot runs, and time-critical production needs.

For production builds, confirming package option, speed grade, operating-range suffix, lifecycle status, and sourcing continuity helps reduce procurement risk for older programmable logic families.

Manufacturer

AMD is a semiconductor manufacturer whose adaptive computing and programmable logic portfolio includes FPGA devices, CPLDs, configuration solutions, embedded processing platforms, and related development technologies for industrial, communication, computing, automotive, and embedded electronic systems.

Virtex-E devices provide an older high-performance FPGA platform for legacy communications, embedded digital systems, and board-level programmable logic designs that still depend on established Xilinx high-density footprints. Virtex-E density point for sustaining-production programmable logic and high-I/O legacy board integration.

FAQ

What is XCV400-5BG560C used for?

XCV400-5BG560C is used for legacy configurable logic, interface concentration, and board-level digital control in older FPGA-based hardware.

Where can I find the XCV400-5BG560C datasheet download?

The XCV400-5BG560C datasheet can be accessed from the confirmed legacy family source used for this repair pass.

What should be considered in XCV400-5BG560C pinout design?

Designers should account for legacy footprint continuity, power domains, configuration access, and package-driven routing around board-specific digital signals.

Is XCV400-5BG560C a modern FPGA?

No. It belongs to an older Xilinx programmable logic generation that is typically used in sustaining-production or legacy embedded hardware.

What are common XCV400-5BG560C equivalent solutions?

Common candidates include XCV400E-6BG432C and XCV600E-7BG432C depending on package, family architecture, logic density, and system-level compatibility needs.

XCV400-5BG560C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
560-LBGA Exposed Pad, Metal
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
10800
Total RAM Bits:
81920
Number of I/O:
404
Number of Gates:
468252
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
560-MBGA (42.5x42.5)

XCV400-5BG560C FAQ

1.How can I place an order for XCV400-5BG560C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV400-5BG560C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV400-5BG560C reliable?

The price and inventory of XCV400-5BG560C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400-5BG560C is usually 5 days.

3.What payment methods are accepted for XCV400-5BG560C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV400-5BG560C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV400-5BG560C?

XCV400-5BG560C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV400-5BG560C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV400-5BG560C?

For technical support, including XCV400-5BG560C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400-5BG560C requirements.

6.How does Aetrix verify that XCV400-5BG560C is sourced from the original manufacturer or authorized distributors?

All XCV400-5BG560C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400-5BG560C meets industry standards.

7.What is the process for return or replacement of XCV400-5BG560C?

All XCV400-5BG560C units undergo pre-shipment inspection (PSI). If there is an issue with XCV400-5BG560C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV400-5BG560C part is unused and in its original packaging.

Return procedure for XCV400-5BG560C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV400-5BG560C Tags

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