AMD XCV400-5BG560C

Overview

XCV400-5BG560C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 468,252 system gates, 10,800 logic cells in a 40×60 CLB array, and 404 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 81,920 bits of block SelectRAM and LUT-configurable RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV400-5BG560C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV400-5BG560C implements a hierarchical routing architecture with General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFTs for internal 3-state bussing.

I/O functionality is organized into eight independent banks, each supporting mixed voltage standards (e.g., LVTTL, SSTL3, HSTL Class IV) under shared VCCO and single VREF per bank. Each IOB includes three storage elements configurable as D-flip-flops or latches with independent clock enable, synchronous/asynchronous set/reset, and programmable polarity on all control signals.

Key Specifications

Pinout & Package

The XCV400-5BG560C is housed in a 560-ball Fine-Pitch Ball Grid Array (FBGA) package with 35 × 35 ball array, 1.0 mm pitch, and standard JEDEC MO-207AC mechanical outline. Pin functions are organized across eight I/O banks, four global clock inputs (GCLK0–GCLK3), dedicated configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), JTAG boundary-scan interface (TCK, TMS, TDI, TDO), and VCCINT/VCCO/VREF/ground balls distributed per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV400-5BG560C, the -6 variant improves timing margin for 200 MHz operation but offers no additional logic or I/O; the XCV600-5 provides 44% more logic cells and 20% more I/O in identical packaging, enabling scalable design growth without layout change.

Availability

XCV400-5BG560C is available at Aetrix Electronics and suitable for PCI bridge controllers, high-speed data acquisition systems, CompactPCI hot-swap managers, and protocol aggregation gateways requiring stable component supply throughout extended product lifecycles.

Supply support for XCV400-5BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGA architectures and established industry standards for reconfigurable computing.

The Virtex family was designed as high-performance, high-capacity alternatives to mask-programmed gate arrays, targeting demanding applications in telecommunications infrastructure, military/aerospace systems, and high-end test equipment where flexibility and silicon efficiency are critical.

FAQ

What does the "-5" speed grade mean for XCV400-5BG560C?

The "-5" speed grade for XCV400-5BG560C specifies guaranteed worst-case timing performance meeting 180 MHz system clock operation (including I/O paths) under commercial temperature and voltage conditions. It reflects tested propagation delays across CLBs, routing, and I/O buffers, and is validated against DS003-3 switching characteristics. Designs targeting 200 MHz require the -6 grade.

Is XCV400-5BG560C still in production or obsolete?

XCV400-5BG560C is marked as obsolete per Xilinx documentation DS003-1 (v4.0, March 2013) and XCN10016. However, Aetrix Electronics maintains legacy inventory and offers traceable, tested units with full lot traceability and extended lifecycle support for existing designs requiring last-time buys or long-term maintenance.

Can XCV400-5BG560C support both 3.3 V and 2.5 V I/O standards simultaneously?

Yes - XCV400-5BG560C supports simultaneous 3.3 V and 2.5 V I/O standards by assigning them to separate I/O banks. Each bank has independent VCCO pins; for example, Bank 0 can be powered at 3.3 V for LVTTL/PCI, while Bank 1 uses 2.5 V for SSTL2 or LVCMOS2. Mixing standards within one bank is prohibited unless they share the same VCCO.

Does XCV400-5BG560C include on-chip memory beyond LUT-based RAM?

Yes - XCV400-5BG560C includes 81,920 bits of dedicated block SelectRAM memory organized as 20 × 4,096-bit dual-ported synchronous RAM blocks. Each block supports independent read/write addresses and data widths (e.g., 16×256 or 8×512), distinct from the distributed 16-bit LUT RAM used for shallow buffering or register files.

What configuration modes does XCV400-5BG560C support?

XCV400-5BG560C supports four configuration modes: Master Serial (reads bitstream from external PROM via CCLK/DIN), Slave Serial (bitstream loaded by external controller), SelectMAP (8-bit parallel interface), and JTAG (boundary-scan programming via TCK/TMS/TDI/TDO). All modes use SRAM-based in-system reprogrammability with unlimited write cycles.