AMD XCV400-5BG560I

Overview

XCV400-5BG560I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 468,252 system gates, 10,800 logic cells in a 40×60 CLB array, and 404 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 81,920 bits of block SelectRAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV400-5BG560I datasheet, pinout, applications, or equivalent options, key selection considerations include its industrial temperature range (–40°C to +100°C), –5 speed grade (guaranteed 200 MHz system performance), 0.22 μm 5-layer metal CMOS process, IEEE 1149.1 boundary-scan support, and multi-standard SelectIO™ interface compatibility including LVTTL, LVCMOS2, SSTL, HSTL, and GTL.

Technical Context

The XCV400-5BG560I implements a hierarchical routing architecture with a General Routing Matrix (GRM), VersaBlock local interconnect, and VersaRing I/O ring for enhanced pin-locking and routability. Its CLBs contain four logic cells each, with dedicated carry chains per slice, F5/F6 multiplexers enabling up to 19-input functions, and dual-port 4k-bit block RAMs configurable across multiple depth/width ratios.

Each IOB supports independent input/output flip-flops with synchronous/asynchronous set/reset, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), weak-keeper circuitry, and banked VCCO/VREF management across eight I/O banks - enabling mixed-voltage signaling such as 3.3 V LVTTL and 1.5 V HSTL Class IV on separate banks.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (FBGA), 27 mm × 27 mm, 1.27 mm ball pitch, RoHS-compliant. Pinout conforms to Xilinx DS003-4 (v4.0) Module 4 - full pin function tables available for BG560 package including dedicated global clocks (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DOUT), JTAG TDI/TDO/TMS/TCK, and 404 user-configurable I/Os grouped into eight voltage-banked sections.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV400-5BG560I, the –6 variant offers improved timing margin for aggressive clocking, while the XCV600-5BG560I provides scalable logic headroom within identical board space - both retain full pin compatibility and I/O banking structure.

Availability

XCV400-5BG560I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and legacy system modernization requiring stable component supply and long-term obsolescence management.

Supply support for XCV400-5BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family was designed for high-performance, high-density system integration - targeting applications demanding advanced clock management, multi-standard I/O, and scalable logic fabric in mission-critical infrastructure.

FAQ

What is the operating temperature range for XCV400-5BG560I?

The XCV400-5BG560I is rated for industrial temperature operation from –40°C to +100°C. This specification is confirmed in the Virtex ordering information (DS003-1, Figure 1), where the "I" suffix denotes industrial grade. The device includes a die-temperature sensor diode to support thermal monitoring in harsh environments, making XCV400-5BG560I suitable for uncooled industrial enclosures and outdoor telecom equipment.

Does XCV400-5BG560I support 5 V tolerant I/O?

Yes, XCV400-5BG560I supports 5 V tolerant inputs for specific standards: LVTTL, LVCMOS2, and PCI 5 V. This is explicitly documented in Table 1 of DS003-2 (v4.0), which lists "Yes" under the "5 V Tolerant" column for those I/O standards. However, 5 V tolerance applies only to inputs - outputs are referenced to VCCO (1.5 V, 2.5 V, or 3.3 V) and are not 5 V tolerant. The protection mechanism uses a Zener-like structure tied to ground, activating above ~6.5 V.

How many block RAMs does XCV400-5BG560I contain, and what are their configurations?

XCV400-5BG560I contains 20 block SelectRAMs, totaling 81,920 bits. Each block is a fully synchronous, dual-ported 4,096-bit RAM with independent control per port. As specified in Table 4 of DS003-2, configurable port widths include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible bus-width conversion for FIFOs, frame buffers, or lookup tables. These blocks are arranged in two vertical columns along the chip edges.

Is XCV400-5BG560I pin-compatible with other Virtex devices in the BG560 package?

XCV400-5BG560I shares the BG560 package footprint and pinout with XCV300-5BG560I, XCV600-5BG560I, and XCV800-5BG560I, as confirmed in Table 3 of DS003-1. All BG560-packaged Virtex devices have identical 404-user-I/O counts and matching ball assignments for power, ground, clocks, configuration, and JTAG. However, unused I/Os on lower-density parts may be no-connects; full functional compatibility requires verifying logic resource availability per design.

What configuration modes does XCV400-5BG560I support?

XCV400-5BG560I supports four configuration modes: master serial (reads bitstream from external PROM), slave serial (bitstream loaded by external controller), SelectMAP™ (8- or 16-bit parallel interface), and JTAG (boundary-scan programming via TDI/TDO). This is stated in the "SRAM-based in-system configuration" feature list (DS003-1, p.1) and detailed in DS003-3. All modes write to the same internal SRAM configuration memory, enabling flexible deployment across development, production, and field upgrade scenarios.