AMD XCV400-5FG676C

Overview

XCV400-5FG676C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 468,252 system gates, 10,800 logic cells in a 40×60 CLB array, and 404 user I/O pins in a 676-ball fine-pitch BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 81,920 bits of block SelectRAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV400-5FG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex-1 generation devices - all critical for legacy system sustainment and reconfiguration-aware board design.

Technical Context

The XCV400-5FG676C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFTs for internal 3-state bus driving.

I/O functionality is organized into eight independent banks, each supporting mixed voltage standards (e.g., LVTTL, SSTL3, HSTL Class IV) under shared VCCO and single VREF constraints. Each IOB includes three independently configurable storage elements with synchronous/asynchronous set/reset, programmable delays, weak-keeper circuits, and IEEE 1149.1 boundary-scan compliance.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG676) with 676 solder balls, 1.0 mm pitch, 27 mm × 27 mm body size, and 8 I/O banks (Bank 0–7) arranged per device edge. VCCO and VREF pins are bank-specific and must be externally decoupled per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV400-5FG676C, the -6 variant trades higher static power for guaranteed 200 MHz operation, while the XCV600-5FG676C retains pin compatibility but increases logic and memory resources - both require revalidation of timing closure and power delivery, but avoid mechanical redesign.

Availability

XCV400-5FG676C is available at Aetrix Electronics and suitable for legacy system sustainment, industrial control retrofitting, and test equipment requalification requiring stable component supply and long-term obsolescence management.

Supply support for XCV400-5FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; its FPGA architectures enable customizable digital logic for aerospace, communications, and industrial markets.

The Virtex family - including XCV400-5FG676C - was engineered for high-performance, high-density reconfigurable computing in applications demanding deterministic timing, mixed-signal interfacing, and field-upgradable functionality without ASIC-level NRE costs.

FAQ

Is XCV400-5FG676C still in production or supported by Xilinx?

No - XCV400-5FG676C is officially obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). Xilinx discontinued the Virtex family in favor of Spartan and Virtex-II generations. Aetrix Electronics maintains limited legacy inventory with full traceability and offers engineering support for sustainment programs, but no new silicon is being manufactured.

What configuration modes does XCV400-5FG676C support?

XCV400-5FG676C supports four configuration modes: Master Serial (loads bitstream from external PROM), Slave Serial (controlled by external processor), SelectMAP™ (8-bit parallel interface), and JTAG (boundary-scan programming). All modes use SRAM-based configuration, requiring reinitialization at power-up.

Can XCV400-5FG676C interface directly with 3.3 V PCI slots?

Yes - XCV400-5FG676C is 66-MHz PCI compliant and supports LVTTL 3.3 V I/O standards with 24 mA drive strength. Its IOBs include 5 V-tolerant inputs and meet PCI signaling requirements for setup/hold, skew, and voltage thresholds when configured with proper VCCO = 3.3 V and termination.

How many DLLs does XCV400-5FG676C include, and what are their key uses?

XCV400-5FG676C integrates four dedicated delay-locked loops (DLLs). These provide clock deskew across large die areas, generate phase-shifted clocks for source-synchronous interfaces, compensate for PVT variation in I/O timing, and enable zero-hold-time capture in high-speed data receivers - all critical for reliable 66 MHz PCI and DDR-like operation.

What is the maximum operating temperature range for XCV400-5FG676C?

The "C" suffix in XCV400-5FG676C denotes Commercial temperature range: junction temperature (TJ) from 0°C to +85°C. This rating applies to all DC and switching characteristics in the DS003-3 specification. Industrial variants (e.g., XCV400-5FG676I) support –40°C to +100°C but are not interchangeable without thermal and timing revalidation.