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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV400-6BG432C

Name: XCV400-6BG432C
Brand: AMD
SKU: XCV400-6BG432C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV400-6BG432C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 432-LBGA Exposed Pad, Metal

Datasheet:: XCV400-6BG432C.pdf

Description:: IC FPGA 316 I/O 432MBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

XCV400-6BG432C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 468,252 system gates, 10,800 logic cells in a 40×60 CLB array, and 404 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 81,920 bits of block SelectRAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV400-6BG432C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (guaranteed 200 MHz system performance), BG432 package I/O count and thermal profile, dual-port block RAM configuration flexibility, and SelectIO™ interface compatibility with LVTTL, HSTL, SSTL, and GTL standards.

Technical Context

The XCV400-6BG432C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLBs contain four logic cells each-each with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and configurable storage elements supporting synchronous/asynchronous set/reset.

Each IOB supports independent input/output flip-flops with programmable polarity, weak-keeper circuits, and selectable pull-up/pull-down resistors. I/O banking enforces voltage domain separation: eight banks require shared VCCO per bank (3.3 V, 2.5 V, or 1.5 V), and VREF-dependent standards (e.g., HSTL, SSTL) must be grouped within the same bank.

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	468,252 - defines total combinational logic capacity for gate-equivalent synthesis targeting.
Logic Cells	10,800 - provides discrete, placeable-and-routable units each containing LUT, carry, and flip-flop resources.
User I/O Pins	404 - maximum number of bidirectional user-configurable signals in BG432 package.
Block RAM Bits	81,920 - distributed across 20 dual-ported 4k-bit blocks, enabling synchronous bus-width conversion (e.g., 16×256 to 256×1).
Speed Grade	-6 - guarantees worst-case timing performance up to 200 MHz system clock rate including I/O paths.
DLL Count	4 - enables advanced clock deskew, phase alignment, and domain bridging without external PLLs.
I/O Standards	LVTTL, LVCMOS2, PCI 3.3 V/5 V, HSTL Class I/III/IV, SSTL3/2, GTL/GTL+, CTT, AGP - supports mixed-voltage board interfaces with bank-level VCCO/VREF isolation.

Pinout & Package

The XCV400-6BG432C is housed in a 432-ball fine-pitch Ball Grid Array (BG432) package with 36 rows × 36 columns (excluding corner balls), 1.27 mm pitch, and thermal pad-compatible footprint. Pin functions follow Xilinx Virtex family conventions with dedicated global clocks (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), JTAG boundary-scan (TCK/TMS/TDI/TDO), and banked I/O groups.

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Input	Four dedicated low-skew inputs feeding primary clock distribution networks; required for DLL reference or direct clocking of high-fanout logic.
INIT, PROGRAM, CCLK, DIN, DONE	Configuration Interface	Master serial mode control: INIT asserts during power-up reset; PROGRAM initiates reconfiguration; CCLK clocks data; DIN loads bitstream; DONE signals completion.
TCK/TMS/TDI/TDO	JTAG Boundary Scan	IEEE 1149.1-compliant test access port enabling in-system programming, debug, and interconnect verification without custom test fixtures.
VCCINT, VCCO_0–VCCO_7	Power Supply	VCCINT = 2.5 V core supply; VCCO_x = bank-specific I/O output voltage (3.3 V / 2.5 V / 1.5 V), defining drive strength and signaling standard compliance.
VREF_0–VREF_7	Input Threshold Reference	Bank-specific reference voltage for HSTL/SSTL/GTL input buffers; must be externally supplied and stable within ±2% for valid sampling.

Key Features

Feature	Design Value
SRAM-based in-system reprogramming	Enables unlimited field updates via JTAG or serial PROM; supports partial reconfiguration only in later Virtex families - not supported in XCV400.
Dual-ported 4k-bit block RAM	20 independent blocks, each configurable as 1×4096, 2×2048, 4×1024, 8×512, or 16×256 - allows simultaneous read/write on different address/data widths for FIFOs and frame buffers.
SelectIO™ interface flexibility	Supports 16 I/O standards with per-bank VCCO/VREF control - permits heterogeneous signaling (e.g., HSTL DDR + LVTTL control) on single device without level shifters.
Dedicated carry chain & arithmetic logic	Two-bit-per-CLB carry height with XOR/AND gates - delivers deterministic 32-bit adder latency ≤ 6.0 ns and efficient pipelined multiplier implementation.
Configurable LUT RAM/Shift Register	Each 4-input LUT can act as 16×1-bit synchronous RAM or 16-bit shift register - enables compact datapath registers, pattern generators, or serializer/deserializer staging.

Applications

High-Speed Data Acquisition	PCI-Based Industrial Controller
Use Scenario: Real-time digitization of analog sensor streams at ≥100 MSPS with on-chip buffering and preprocessing before host transfer. IC Role / Device Role / Timing Role: XCV400-6BG432C acts as a real-time front-end processor: captures parallel ADC outputs via LVTTL/HSTL inputs, applies FIR filtering in CLBs, stores bursts in block RAM, and streams results over 66-MHz PCI. Use Value: 404 I/O and 81,920 block RAM bits enable 16-channel × 512-sample deep buffering; -6 speed grade ensures sub-5 ns register-to-register timing for filter pipelines.	Use Scenario: Embedded motion control system using PCI bus for command upload and status reporting in CNC machinery. IC Role / Device Role / Timing Role: XCV400-6BG432C serves as PCI target interface and real-time I/O manager: handles PCI protocol layer, generates PWM waveforms, monitors limit switches, and executes safety logic. Use Value: Native 66-MHz PCI compliance eliminates external bridge IC; 10,800 logic cells accommodate full PCI state machine plus custom servo algorithms; DLLs synchronize internal clocks to PCI clock domain.
Telecom Line Card Interface	Legacy System Emulation
Use Scenario: Aggregation of multiple T1/E1 framer interfaces onto a common backplane bus in access concentrators. IC Role / Device Role / Timing Role: XCV400-6BG432C implements multi-channel HDLC framing, CRC generation/checking, and time-slot assignment using distributed LUT RAM and carry chains. Use Value: SelectIO™ support for both 3.3 V LVTTL (framer I/O) and 1.5 V HSTL (backplane) enables direct connection; 24 secondary clock nets allow independent domain timing for each T1 channel.	Use Scenario: Replacement of obsolete ASICs in avionics test equipment requiring pin-compatible logic replication and long-term obsolescence mitigation. IC Role / Device Role / Timing Role: XCV400-6BG432C replicates gate-level functionality of legacy mask-ROM PLDs with identical timing behavior and I/O mapping. Use Value: 100% factory-tested reliability and 0.22 μm process ensure matching setup/hold margins; BG432 package footprint matches PQ240/PQ208 adapters used in existing PCBs.

High-Speed Data Acquisition

PCI-Based Industrial Controller

Use Scenario: Real-time digitization of analog sensor streams at ≥100 MSPS with on-chip buffering and preprocessing before host transfer.

IC Role / Device Role / Timing Role: XCV400-6BG432C acts as a real-time front-end processor: captures parallel ADC outputs via LVTTL/HSTL inputs, applies FIR filtering in CLBs, stores bursts in block RAM, and streams results over 66-MHz PCI.

Use Value: 404 I/O and 81,920 block RAM bits enable 16-channel × 512-sample deep buffering; -6 speed grade ensures sub-5 ns register-to-register timing for filter pipelines.

Use Scenario: Embedded motion control system using PCI bus for command upload and status reporting in CNC machinery.

IC Role / Device Role / Timing Role: XCV400-6BG432C serves as PCI target interface and real-time I/O manager: handles PCI protocol layer, generates PWM waveforms, monitors limit switches, and executes safety logic.

Use Value: Native 66-MHz PCI compliance eliminates external bridge IC; 10,800 logic cells accommodate full PCI state machine plus custom servo algorithms; DLLs synchronize internal clocks to PCI clock domain.

Telecom Line Card Interface

Legacy System Emulation

Use Scenario: Aggregation of multiple T1/E1 framer interfaces onto a common backplane bus in access concentrators.

IC Role / Device Role / Timing Role: XCV400-6BG432C implements multi-channel HDLC framing, CRC generation/checking, and time-slot assignment using distributed LUT RAM and carry chains.

Use Value: SelectIO™ support for both 3.3 V LVTTL (framer I/O) and 1.5 V HSTL (backplane) enables direct connection; 24 secondary clock nets allow independent domain timing for each T1 channel.

Use Scenario: Replacement of obsolete ASICs in avionics test equipment requiring pin-compatible logic replication and long-term obsolescence mitigation.

IC Role / Device Role / Timing Role: XCV400-6BG432C replicates gate-level functionality of legacy mask-ROM PLDs with identical timing behavior and I/O mapping.

Use Value: 100% factory-tested reliability and 0.22 μm process ensure matching setup/hold margins; BG432 package footprint matches PQ240/PQ208 adapters used in existing PCBs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV400-7BG432C	Higher speed grade (-7 vs. -6); guarantees 225 MHz max system frequency and tighter hold times.	Suitable where worst-case timing closure requires >200 MHz clock domains or ultra-low-latency control loops.	Select XCV400-7BG432C only if timing analysis shows marginal slack on critical paths; otherwise, -6 offers cost and power advantage.
XCV600-6BG560C	Larger device (661k gates, 512 I/O, BG560 package); same -6 speed grade and architecture generation.	Required when design exceeds XCV400 resource limits - e.g., >10,800 logic cells or >404 I/O - but retains identical toolchain and IP compatibility.	Choose XCV600-6BG560C for scalable designs needing headroom; note larger package increases PCB area and thermal management complexity.

Compared with XCV400-6BG432C, the -7 variant improves timing margin without changing logic density or I/O count, while the XCV600-6BG560C expands capacity at the cost of footprint and power - neither is pin-compatible, and both require layout revision and re-validation.

Availability

XCV400-6BG432C is available at Aetrix Electronics and suitable for high-reliability industrial control, telecom infrastructure, and legacy system replacement requiring stable component supply and long-term lifecycle support despite its obsolete status.

Supply support for XCV400-6BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as its flagship high-performance FPGA platform.

The Virtex family was designed for demanding applications requiring high logic density, fast I/O, and flexible clock management - particularly in communications infrastructure, military/aerospace systems, and high-end computing where ASIC economics were prohibitive.

FAQ

Is XCV400-6BG432C still in production?

No. XCV400-6BG432C is officially obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). Aetrix Electronics provides last-time-buy and consignment inventory with full traceability, but no new manufacturing is occurring. Customers should plan migration paths for new designs.

What development tools support XCV400-6BG432C?

XCV400-6BG432C is supported exclusively by legacy Xilinx Foundation Series and Alliance Series software (v3.x–v5.x). Modern Vivado does not recognize this device. Bitstream generation, place-and-route, and simulation require original CDs or archived binaries compatible with Windows NT/2000 or Solaris.

Does XCV400-6BG432C support JTAG programming?

Yes. XCV400-6BG432C includes full IEEE 1149.1 boundary-scan logic with TCK/TMS/TDI/TDO pins. It supports JTAG configuration mode for in-system programming and debugging, though configuration files must be generated using legacy Xilinx tools.

Can XCV400-6BG432C operate at 3.3 V I/O with 2.5 V core?

Yes. XCV400-6BG432C uses separate VCCINT (2.5 V) and banked VCCO supplies. Setting VCCO = 3.3 V enables LVTTL, PCI, and SSTL3 I/O standards while maintaining 2.5 V core logic - confirmed in DS003-2 Table 1 and I/O banking rules.

What is the maximum operating junction temperature for XCV400-6BG432C?

The 'C' suffix denotes Commercial temperature range: TJ = 0°C to +85°C. This is specified in Figure 1 of DS003-1 and applies to all Virtex devices with 'C' ordering code. Thermal design must ensure junction stays within this limit under worst-case power dissipation.

XCV400-6BG432C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®

Package/Case:: 432-LBGA Exposed Pad, Metal

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 2400

Number of Logic Elements/Cells:: 10800

Total RAM Bits:: 81920

Number of I/O:: 316

Number of Gates:: 468252

Voltage - Supply:: 2.375V ~ 2.625V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 432-MBGA (40x40)

XCV400-6BG432C FAQ

1.How can I place an order for XCV400-6BG432C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV400-6BG432C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV400-6BG432C reliable?

The price and inventory of XCV400-6BG432C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400-6BG432C is usually 5 days.

3.What payment methods are accepted for XCV400-6BG432C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV400-6BG432C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV400-6BG432C?

XCV400-6BG432C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV400-6BG432C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV400-6BG432C?

For technical support, including XCV400-6BG432C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400-6BG432C requirements.

6.How does Aetrix verify that XCV400-6BG432C is sourced from the original manufacturer or authorized distributors?

All XCV400-6BG432C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400-6BG432C meets industry standards.

7.What is the process for return or replacement of XCV400-6BG432C?

All XCV400-6BG432C units undergo pre-shipment inspection (PSI). If there is an issue with XCV400-6BG432C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV400-6BG432C part is unused and in its original packaging.

Return procedure for XCV400-6BG432C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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