AMD XCV400-6BG560C

Overview

XCV400-6BG560C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 468,252 system gates, 10,800 logic cells, and 404 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 81,920 bits of block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV400-6BG560C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility (LVTTL, HSTL Class IV, SSTL3), and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV400-6BG560C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice structures with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input logic, and BUFTs for internal 3-state bus driving.

I/O functionality is organized into eight independent banks, each supporting mixed voltage standards under shared VCCO and single VREF constraints. Supported SelectIO™ standards include LVTTL (5 V tolerant), HSTL Class IV (200 MHz), SSTL3, and GTL+, with programmable drive strength (up to 24 mA source / 48 mA sink) and slew control per output.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 27 × 27 mm body, 1.27 mm pitch, RoHS-compliant. Pinout follows Xilinx DS003-4 (v4.0) Module 4, with eight I/O banks (Bank 0–7), four dedicated global clock inputs (GCLK0–GCLK3), and dual-purpose configuration pins (e.g., INIT, PROGRAM, CCLK, DONE).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV400-6BG560C, XCV400-6HQ240C trades I/O count and high-speed interface capability for assembly simplicity, while XCV600-6BG560C extends logic capacity and memory within identical mechanical and thermal constraints - enabling scalable architecture without PCB redesign.

Availability

XCV400-6BG560C is available at Aetrix Electronics and suitable for industrial motion control, telecom line card interfaces, PCI bridge controllers, and high-speed data acquisition systems requiring stable component supply amid end-of-life transitions.

Supply support for XCV400-6BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA toolchains for high-performance digital system design.

The Virtex family - including XCV400-6BG560C - was engineered for high-speed, high-density logic implementation in communications infrastructure, test equipment, and embedded computing, emphasizing place-and-route efficiency and silicon utilization via 0.22 μm 5-layer-metal CMOS.

FAQ

Is XCV400-6BG560C still in production?

No - XCV400-6BG560C is obsolete per Xilinx documentation DS003-1 (v4.0, March 2013) and XCN10016. Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle management support, including cross-reference guidance to Virtex-II or Spartan-6 alternatives where functionally appropriate.

What configuration modes does XCV400-6BG560C support?

XCV400-6BG560C supports four configuration modes: master serial (auto-reads bitstream from external PROM), slave serial, SelectMAP™ (8-bit parallel slave mode), and IEEE 1149.1 JTAG boundary-scan. All modes use the same dedicated pins (DIN, DOUT, CCLK, PROG, INIT, DONE), with mode selection determined by M[2:0] strap pins at power-up.

Can XCV400-6BG560C interface directly with DDR SDRAM?

Yes - XCV400-6BG560C supports SSTL2 Class I/II (1.25 V) and SSTL3 Class I/II (1.5 V) I/O standards via its SelectIO™ interface, enabling direct connection to DDR and DDR2 SDRAM chips. Proper I/O banking, VCCO/VREF assignment, and board-level termination matching are required per DS003-2 Section "I/O Banking".

Does XCV400-6BG560C include on-die temperature sensing?

Yes - XCV400-6BG560C integrates a calibrated die-temperature sensor diode, accessible via external circuitry per Xilinx Application Note XAPP127. This enables real-time thermal monitoring for fan control, throttling, or safety shutdown in industrial and telecom applications using the XCV400-6BG560C device.

What is the maximum operating frequency of internal logic in XCV400-6BG560C?

XCV400-6BG560C achieves up to 200 MHz system clock rates for synchronous logic, verified using worst-case timing parameters in Table 2 of DS003-1. Critical paths - such as register-to-register, pipelined multiplier, and address decoder - measure 5.0–6.9 ns propagation delay, confirming full-speed operation at 200 MHz under commercial conditions.