AMD XCV400-6FG676C

Overview

XCV400-6FG676C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 468,252 system gates, 10,800 logic cells, and 404 user I/O pins in a 676-ball fine-pitch BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 81,920-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV400-6FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include its 200 MHz system performance ceiling, dual-port 4k-bit synchronous block RAM configuration, SelectIO™ interface support across 16 standards (e.g., HSTL Class IV, SSTL3), and 0.22 μm 5-layer metal CMOS process for high place-and-route efficiency.

Technical Context

The XCV400-6FG676C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLB array (40×60) integrates dedicated carry logic for arithmetic acceleration and F5/F6 multiplexers enabling up to 19-input logic functions.

Each IOB supports independent input/output flip-flops with programmable polarity, synchronous/asynchronous set/reset, and optional weak-keeper circuits. I/O banking enforces voltage domain isolation: eight banks require shared VCCO per bank (3.3 V / 2.5 V / 1.5 V), and VREF-dependent standards (e.g., HSTL, SSTL) must be grouped within the same bank.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG676) with 676 solder balls, 27 mm × 27 mm body, 1.0 mm ball pitch, and commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV400-6FG676C, XCV400-6BG560C offers identical functionality in a smaller package at the cost of thermal dissipation headroom, while XCV600-6FG676C provides 40% more logic in the same footprint - enabling feature expansion without layout change but requiring updated timing constraints and power delivery.

Availability

XCV400-6FG676C is available at Aetrix Electronics and suitable for high-reliability industrial control, legacy telecom infrastructure, and avionics subsystems requiring stable component supply and long-lifecycle support.

Supply support for XCV400-6FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it delivers adaptive compute platforms for aerospace, defense, communications, and industrial markets.

The Virtex family was designed as high-performance, high-density SRAM-based FPGAs targeting ASIC replacement in systems demanding >100 MHz operation, multi-standard I/O, and embedded memory - with XCV400-6FG676C serving mid-tier bandwidth and gate-count requirements.

FAQ

What is the maximum operating frequency supported by the XCV400-6FG676C?

The XCV400-6FG676C achieves a maximum system clock frequency of 200 MHz under worst-case timing conditions, including I/O paths. This rating is validated using the -6 speed grade and assumes proper use of DLLs for clock deskewing and optimized placement/routing. Internal logic paths in typical designs commonly operate above 100 MHz, with register-to-register delays as low as 5.0 ns for adder functions.

Does the XCV400-6FG676C support JTAG boundary scan and in-system programming?

Yes, the XCV400-6FG676C fully supports IEEE 1149.1 boundary scan for testing and verification, and enables in-system configuration through JTAG, SelectMAP™ parallel mode, slave serial mode, or master serial PROM boot. All four programming modes are functional and factory-tested, allowing flexible deployment and field updates without removing the device from the board.

How many block RAMs does the XCV400-6FG676C contain, and what are their key capabilities?

The XCV400-6FG676C contains twenty 4k-bit block SelectRAMs, totaling 81,920 bits. Each block is a fully synchronous dual-ported RAM with independent clocks (CLKA/CLKB), addresses (ADDRA/ADDRB), and data buses (DIA/DIB). Port widths are configurable from 1 to 16 bits, enabling native bus-width conversion - for example, 8-bit microcontroller interfacing to 16-bit DSP memory spaces.

What I/O standards are supported by the XCV400-6FG676C, and how are they managed electrically?

The XCV400-6FG676C supports 16 SelectIO™ standards including HSTL Class IV (200 MHz), SSTL3, LVTTL, PCI 3.3 V, GTL+, and CTT. I/O banks enforce voltage domain separation: eight banks each require a common VCCO (3.3 V / 2.5 V / 1.5 V) and, where applicable, a shared VREF. Standards like HSTL and SSTL require VREF; LVTTL and PCI 5 V are 5 V tolerant and do not require VREF.

Is the XCV400-6FG676C still in active production, and what lifecycle support does Aetrix provide?

The XCV400-6FG676C is marked obsolete by Xilinx (per DS003-1 v4.0, March 2013), but Aetrix Electronics maintains verified legacy inventory with full traceability and extended lifecycle coordination. We support obsolescence mitigation through cross-reference analysis, last-time-buy planning, and migration path guidance to compatible Virtex-II or Spartan families where technically appropriate.