AMD XCV400E-6BG432C

Overview

XCV400E-6BG432C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 569,952 system gates, 10,800 logic cells, and 404 user I/O pins in a 432-ball BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 163.84 kb of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communication subsystems.

For engineers reviewing the XCV400E-6BG432C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (130 MHz internal performance), 1.8 V core voltage with 3.3 V I/O tolerance, 432-ball fine-pitch BGA mechanical compatibility, and support for source-synchronous data transmission architectures up to 240 MHz system clock rates.

Technical Context

The XCV400E-6BG432C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL-organized across eight I/O banks with bank-specific VCCO and VREF requirements. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×.

Key Specifications

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 1.0 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV400E-6BG432C, the -7 variant improves timing margin without changing footprint or power, while the XCV600E-6BG432C offers significant logic and memory headroom within identical mechanical constraints-making both viable alternatives depending on whether timing closure or functional scalability is the primary constraint.

Availability

XCV400E-6BG432C is available at Aetrix Electronics and suitable for high-speed data acquisition, telecom line card processing, industrial motion control, and medical imaging backend systems requiring stable component supply over extended production lifecycles.

Supply support for XCV400E-6BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density reconfigurable logic in communications infrastructure, test equipment, and industrial automation-emphasizing I/O flexibility, clock management, and memory hierarchy over cost-optimized integration.

FAQ

What is the maximum operating junction temperature for XCV400E-6BG432C?

The XCV400E-6BG432C is rated for commercial temperature range (0°C to +85°C junction). Its die-temperature sensor diode allows real-time thermal monitoring, and thermal design must ensure junction temperature remains within this limit under full static and dynamic loading conditions. The BG432 package's thermal resistance (θ_JA) is 22.5°C/W, requiring appropriate PCB copper area and airflow for sustained 100% utilization.

Does XCV400E-6BG432C support JTAG configuration mode?

Yes, XCV400E-6BG432C supports IEEE 1149.1 JTAG boundary scan and configuration via TCK/TMS/TDI/TDO pins. It enables in-system programming, debug visibility, and configuration bitstream loading without requiring external SPI PROM or SelectMAP interface. JTAG mode is factory-tested and documented in DS022-4 (Pinout Tables) for BG432 package pin assignments.

Can XCV400E-6BG432C interface directly with 5 V logic devices?

No, XCV400E-6BG432C I/O pins are not 5 V tolerant by default. They support 3.3 V, 2.5 V, 1.8 V, and 1.5 V I/O standards. To interface with 5 V devices, an external 100 Ω series resistor is required per I/O line to limit current and prevent damage-though this degrades signal integrity and timing margins. PCI 5 V signaling is explicitly unsupported.

How many DLLs does XCV400E-6BG432C include, and what are their key capabilities?

XCV400E-6BG432C includes eight fully digital Delay-Locked Loops (DLLs). Each supports clock multiply (up to 4×), divide, duty-cycle correction (50% for DDR), and zero-delay conversion of high-speed LVPECL/LVDS inputs to any supported I/O standard. DLL outputs feed global clock networks with sub-100 ps skew, enabling synchronous multi-clock domain designs.

Is XCV400E-6BG432C pin-compatible with other Virtex-E devices in BG432 package?

Yes, XCV400E-6BG432C shares identical pinout with XCV300E-6BG432C and XCV600E-6BG432C per DS022-4 Module 4. All BG432-packaged Virtex-E devices use the same ball map, allowing hardware reuse across density grades. However, unused pins may differ in function (e.g., dedicated clock vs. general I/O), so design review against specific device pin tables is mandatory before migration.