AMD XCV400E-6BG560C

Overview

XCV400E-6BG560C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 569,952 system gates, 10,800 logic cells, and 404 user I/O pins in a 560-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 163.84 kb of synchronous block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V interfaces for high-speed communication subsystems in telecom infrastructure.

For engineers reviewing the XCV400E-6BG560C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (130 MHz internal performance), 1.8 V core voltage, 404-user-I/O count in BG560, dual-port block RAM capability, and support for source-synchronous data transmission up to 622 Mb/s.

Technical Context

The XCV400E-6BG560C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL, HSTL, LVDS, and LVPECL-with banked VCCO and VREF management. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise timing control for high-speed I/O and internal logic domains.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.27 mm pitch, RoHS-compliant, commercial temperature range (0 °C to +85 °C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV400E-6BG560C, the -7 variant improves timing margin without altering I/O count or power profile, while the XCV600E-6BG560C offers headroom in logic and memory-both retain pin compatibility and require no PCB redesign.

Availability

XCV400E-6BG560C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, high-speed test equipment, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XCV400E-6BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools for high-performance digital system design.

The Virtex-E family was designed for high-speed, high-density system-on-chip integration in communications and computing applications, emphasizing I/O flexibility, clock management, and memory hierarchy for demanding real-time workloads.

FAQ

What is the maximum supported I/O standard speed for XCV400E-6BG560C?

XCV400E-6BG560C supports LVDS and LVPECL signaling up to 622 Mb/s, verified under source-synchronous data transmission architectures. Its DLLs enable zero-delay clock conversion for these standards, and the device meets PCI 3.3 V, 32/64-bit, 33/66-MHz compliance. Performance is validated per DS022-3 switching characteristics for the -6 speed grade.

Does XCV400E-6BG560C support true dual-port block RAM?

Yes, XCV400E-6BG560C includes 40 block RAM units totaling 163,840 bits, each configurable as true dual-port synchronous RAM with independent read/write addresses, clocks, and enables per port. This enables simultaneous read and write operations at different addresses-essential for FIFOs, buffer management, and memory-mapped peripherals in real-time systems.

What is the core supply voltage requirement for XCV400E-6BG560C?

XCV400E-6BG560C requires a regulated 1.8 V ±3% supply on VCCINT pins for internal logic and memory operation. This lower voltage versus earlier Virtex families reduces dynamic power consumption and thermal output while maintaining performance. Decoupling capacitors must be placed near each VCCINT ball per Xilinx layout guidelines.

How many Delay-Locked Loops (DLLs) does XCV400E-6BG560C integrate?

XCV400E-6BG560C integrates eight fully digital Delay-Locked Loops (DLLs), each supporting clock multiply (up to 4×), divide, duty-cycle correction, and zero-delay conversion of high-speed LVPECL/LVDS inputs to any I/O standard. These DLLs are independently configurable and essential for DDR, source-synchronous, and multi-domain clocking in high-performance designs.

Is XCV400E-6BG560C pin-compatible with other Virtex-E devices in BG560 packaging?

Yes, XCV400E-6BG560C shares identical BG560 pinout with XCV200E-6BG560C, XCV300E-6BG560C, and XCV600E-6BG560C per DS022-4 Pinout Tables. All use the same 560-ball mechanical footprint and signal assignment, enabling hardware reuse across density tiers-though I/O bank voltage and VREF assignments must be verified per device's specific resource map.