My Inquiry
My Account
AMD XCV400E-6BG560C0773
- Part No.:
- XCV400E-6BG560C0773
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 560-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV400E-6BG560C0773.pdf
- Description:
- FPGA, 2400 CLBS, 468252 GATES, 2
- Quantity:
- Payment:
- Shipping:
Inventory:143
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCV400E-6BG560C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 129,600 logic cells, 40 × 60 CLB array, and 404 user I/O pins in a 560-ball BGA package. It delivers up to 240 MHz system clock performance, supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital Delay-Locked Loops (DLLs) for precise clock management in high-speed communication interfaces.
For engineers reviewing the XCV400E-6BG560C datasheet, pinout, applications, or equivalent options, this page provides verified technical context, real-world use cases, validated alternatives, and supply-chain support for legacy Virtex-E FPGA integration in industrial control, telecom infrastructure, and test equipment.
Technical Context
The XCV400E-6BG560C implements a flexible architecture built on a 0.18 μm 6-layer metal CMOS process, featuring configurable logic blocks (CLBs) with four LCs per slice, dedicated carry chains for arithmetic, and dual-port block RAM. Its IOBs support 20 I/O standards-including LVTTL, SSTL, HSTL, LVDS, and LVPECL-with banked VCCO/VREF constraints governing voltage domain compatibility.
Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR applications, and frequency multiplication up to 4×. The device uses SRAM-based configuration with JTAG, SelectMAP™, and slave serial modes, and includes IEEE 1149.1 boundary-scan logic and a die-temperature sensor diode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 129,600 - determines maximum combinational and sequential logic capacity for complex state machines or datapaths. |
| System Gates | 569,952 - indicates silicon density suitable for medium-to-large ASIC replacements in embedded systems. |
| User I/O Pins | 404 - enables high-bandwidth interface consolidation (e.g., parallel memory buses + serial links) on a single device. |
| Differential I/O Pairs | 183 - supports >100 Gb/s aggregate bandwidth using LVDS/BLVDS for source-synchronous data capture. |
| Block RAM Bits | 163,840 - provides true dual-port synchronous memory for FIFOs, frame buffers, or protocol engines without external SRAM. |
| Internal Clock Speed | Up to 240 MHz - achievable in synchronous designs with optimized placement/routing and DLL-assisted timing closure. |
| Supply Voltage (VCCINT) | 1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling lower thermal design power in dense PCB layouts. |
Pinout & Package
Package: 560-ball Ball Grid Array (BG560), 1.0 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Input | Dedicated low-skew routing to all DLLs and CLBs; required for synchronous system timing distribution. |
| VCCINT | Core Logic Supply | 1.8 V power for CLBs, RAM, and routing; must be filtered and decoupled per Xilinx layout guidelines. |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific 1.5–3.3 V supplies; each bank requires matching VCCO for compatible output standards. |
| VREF_0–VREF_7 | Input Threshold Reference | User-supplied reference for SSTL/HSTL/LVCMOS inputs; shared across all pins in same I/O bank. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for programming, debugging, and production verification. |
| PROGRAM_B / INIT_B / DONE | Configuration Control | Asynchronous reset, initialization status, and configuration completion signals for master/slave mode startup. |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS (622 Mb/s), BLVDS, and LVPECL-enables direct interfacing with high-speed SerDes, memory, and backplane ICs without level-shifting. |
| SelectRAM+™ Memory Hierarchy | 163.8 kb true dual-port block RAM + 153.6 kb distributed RAM-eliminates need for external FIFOs or buffer memories in packet processing or video pipelines. |
| Digital Delay-Locked Loops (DLLs) | Eight independent DLLs with 4× multiplication and duty-cycle correction-provides deterministic clock deskew and phase alignment for DDR memory controllers and source-synchronous receivers. |
| Flexible CLB Architecture | Each CLB contains four logic cells with carry chains, F5/F6 multiplexers, and BUFTs-enables efficient implementation of wide adders, multipliers, and cascaded logic functions. |
| SRAM-Based In-System Configuration | Unlimited reprogrammability via JTAG or SelectMAP™-supports field-upgradable firmware, dynamic partial reconfiguration, and rapid prototyping iterations. |
Applications
| Telecom Line Card Processing | Industrial Motion Controller |
|---|---|
Use Scenario: Real-time packet classification and header modification in 10/100 Mbps Ethernet line cards. IC Role / Device Role / Timing Role: Configurable datapath accelerator implementing TCAM-like lookup tables and CRC engines with deterministic latency. Use Value: 404 I/O pins enable concurrent Gigabit PHY interface, PCI bus, and local memory access; 240 MHz clocking meets sub-100 ns packet processing deadlines. |
Use Scenario: Closed-loop servo control for multi-axis CNC machines with synchronized PWM generation and encoder feedback. IC Role / Device Role / Timing Role: Real-time motion trajectory generator coordinating 8+ axes using hardware-accelerated interpolation and position comparison logic. Use Value: Dedicated carry logic and 129,600 logic cells support simultaneous 32-bit arithmetic, PID loops, and safety monitoring; DLLs synchronize PWM edges to <100 ps jitter. |
| Automated Test Equipment (ATE) | Medical Imaging Data Acquisition |
Use Scenario: High-speed digital pattern generation and response analysis for semiconductor wafer testing at 200+ MHz. IC Role / Device Role / Timing Role: Pin electronics controller managing 128-channel parallel test vectors with per-pin programmable drive strength and timing calibration. Use Value: LVDS I/O pairs deliver 622 Mb/s vector rates; 163.8 kb block RAM stores stimulus/response patterns on-chip, eliminating external memory bottlenecks. |
Use Scenario: Real-time preprocessing of raw CT/MRI sensor data before transmission to host processor. IC Role / Device Role / Timing Role: Pipeline accelerator performing windowing, FFT, and noise reduction using distributed RAM and dedicated multipliers. Use Value: 153.6 kb distributed RAM implements deep pipeline registers; 0.18 μm process ensures stable operation under medical-grade thermal constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV400E-7BG560C | Higher speed grade (-7 vs. -6): 133 MHz register-to-register path vs. 125 MHz; identical pinout, package, and feature set. | Suitable for designs requiring tighter timing margins or higher clock frequencies without layout changes. | Select when targeting >200 MHz system clocks or needing additional timing slack for complex routing. |
| XCV600E-6BG560C | Higher density: 186,624 logic cells, 512 user I/O, 294.9 kb block RAM; same BG560 package but larger die area and higher power. | Required for designs scaling beyond 129,600 logic cells or needing >404 I/Os while retaining footprint compatibility. | Choose for future-proofing or incremental design upgrades where board space allows increased thermal dissipation. |
Compared with XCV400E-6BG560C, the -7 variant offers marginally improved timing performance within identical packaging, while the XCV600E-6BG560C provides significantly greater logic and I/O resources at the cost of higher static/dynamic power-making it appropriate only when the original device's capacity is saturated.
Availability
XCV400E-6BG560C is available at Aetrix Electronics and suitable for industrial control, telecom infrastructure, and automated test equipment requiring stable component supply despite its obsolete status per XCN09001/XCN12026.
Supply support for XCV400E-6BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic solutions for demanding compute and signal-processing applications.
The Virtex-E product line was engineered for high-speed, high-density logic implementation in telecom, military, and industrial systems-emphasizing I/O flexibility, clock management, and memory hierarchy to replace ASICs with field-upgradable silicon.
FAQ
Is XCV400E-6BG560C still in production?
No, XCV400E-6BG560C is obsolete per Xilinx Notices XCN09001 and XCN12026 (March 2014). However, Aetrix Electronics maintains verified legacy inventory with full traceability and extended lifecycle support for ongoing production programs that depend on this specific Virtex-E device.
What is the maximum differential I/O speed supported by XCV400E-6BG560C?
XCV400E-6BG560C supports LVDS signaling at up to 622 Mb/s, BLVDS at equivalent rates, and LVPECL clock inputs exceeding 300 MHz. These speeds are achievable using source-synchronous architectures and require proper PCB layout with controlled impedance and termination.
Can XCV400E-6BG560C be configured via JTAG in-system?
Yes, XCV400E-6BG560C supports IEEE 1149.1 JTAG configuration in all standard modes (boundary scan, programming, and debugging). The TCK/TMS/TDI/TDO pins are dedicated and fully compliant, enabling in-circuit programming without removing the device from the board.
Does XCV400E-6BG560C support true dual-port block RAM?
Yes, XCV400E-6BG560C includes 40 block RAM units totaling 163,840 bits, each implemented as true dual-port synchronous RAM with independent read/write addresses, clocks, and enables-enabling concurrent access for applications like ping-pong buffering or memory-mapped peripherals.
What are the key thermal considerations for XCV400E-6BG560C in commercial applications?
XCV400E-6BG560C operates in the commercial temperature range (0°C to +85°C) and includes an on-die temperature sensor diode. Thermal design must account for 1.8 V core power and I/O bank currents; Xilinx recommends ≥4 thermal vias under the BG560 package and copper pour on inner layers for heat dissipation.
XCV400E-6BG560C0773 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 560-LBGA Exposed Pad, Metal
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 10800
- Total RAM Bits:
- 163840
- Number of I/O:
- 404
- Number of Gates:
- 569952
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 560-MBGA (42.5x42.5)
XCV400E-6BG560C0773 FAQ
1.How can I place an order for XCV400E-6BG560C0773 through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV400E-6BG560C0773 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV400E-6BG560C0773 reliable?
The price and inventory of XCV400E-6BG560C0773 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400E-6BG560C0773 is usually 5 days.
3.What payment methods are accepted for XCV400E-6BG560C0773?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV400E-6BG560C0773 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV400E-6BG560C0773?
XCV400E-6BG560C0773 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV400E-6BG560C0773 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV400E-6BG560C0773?
For technical support, including XCV400E-6BG560C0773 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400E-6BG560C0773 requirements.
6.How does Aetrix verify that XCV400E-6BG560C0773 is sourced from the original manufacturer or authorized distributors?
All XCV400E-6BG560C0773 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400E-6BG560C0773 meets industry standards.
7.What is the process for return or replacement of XCV400E-6BG560C0773?
All XCV400E-6BG560C0773 units undergo pre-shipment inspection (PSI). If there is an issue with XCV400E-6BG560C0773, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV400E-6BG560C0773 part is unused and in its original packaging.
Return procedure for XCV400E-6BG560C0773:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCV400E-6BG560C0773 Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
