AMD XCV400E-6BG560I

Overview

XCV400E-6BG560I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 129,600 logic cells, 40 × 60 CLB array, and 404 user I/O pins in a 560-ball BGA package. It delivers up to 240 MHz synchronous system performance, supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital Delay-Locked Loops (DLLs) for clock management. It is used in high-speed communication line cards requiring reconfigurable protocol handling and timing-critical data path acceleration.

For engineers reviewing the XCV400E-6BG560I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration options, and industrial-temperature (-40°C to +100°C) operation guidance specific to the BG560 package variant.

Technical Context

The XCV400E-6BG560I implements a regular array of Configurable Logic Blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4× - all without external components.

I/O functionality is organized into eight banks, each supporting mixed standards only when sharing VCCO voltage (e.g., LVTTL and PCI33_3 at 3.3 V); input standards like SSTL3 require externally supplied VREF per bank. Block SelectRAM is arranged in 40 columns of 4096-bit dual-port RAM blocks, enabling true dual-port access with independent width/depth configuration per port.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.0 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV400E-6BG560I, the -7 variant offers tighter timing margins without architectural change, while the XCV600E-6BG560I provides higher logic and memory capacity in pin-compatible form - both enable incremental design evolution without board redesign.

Availability

XCV400E-6BG560I is available at Aetrix Electronics and suitable for optical transport line cards, PCI bridge modules, high-speed automated test equipment, and industrial motion controllers requiring stable component supply across extended product lifecycles.

Supply support for XCV400E-6BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as high-performance programmable logic solutions for communications, aerospace, and industrial markets.

The Virtex-E product line was designed specifically for high-speed, low-power reconfigurable systems requiring integrated clock management, flexible I/O, and scalable logic density - targeting applications where ASIC development cost and time were prohibitive.

FAQ

What is the maximum differential I/O pair count supported by XCV400E-6BG560I?

XCV400E-6BG560I supports up to 183 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This count is fixed for the XCV400E device regardless of package; the BG560 package provides 404 total user I/O pins, allowing flexible allocation between single-ended and differential signaling based on I/O banking constraints and VCCO/VREF availability.

Does XCV400E-6BG560I support PCI-X 133 MHz operation?

No, XCV400E-6BG560I is specified only for PCI 33/66 MHz compliance per DS022-1 Section 1. It supports 3.3 V, 32/64-bit, 33/66-MHz PCI signaling but lacks timing certification or I/O drive strength for PCI-X 133 MHz requirements. Its I/O structure and DLL characteristics are optimized for 66 MHz and lower synchronous protocols.

Can XCV400E-6BG560I be configured via JTAG in-system?

Yes, XCV400E-6BG560I includes full IEEE 1149.1 boundary-scan logic and supports in-system configuration through JTAG mode. The TCK, TMS, TDI, and TDO pins are dedicated and functional across all operating conditions, enabling bitstream loading, debugging, and verification without requiring external configuration PROMs.

What is the purpose of the die-temperature sensor diode in XCV400E-6BG560I?

The die-temperature sensor diode in XCV400E-6BG560I provides an analog voltage output proportional to junction temperature, enabling real-time thermal monitoring. It is accessible via dedicated analog test pins and used in conjunction with external ADC circuitry to implement thermal throttling or fan control in industrial and telecom applications operating at extended temperature ranges.

Is XCV400E-6BG560I pin-compatible with Virtex-II devices?

No, XCV400E-6BG560I is not pin-compatible with any Virtex-II device. The Virtex-E and Virtex-II families use different architectures, I/O structures, and pinout definitions. Even within the same BG560 package, ball functions (e.g., VCCINT, VCCO, GCLK) and their physical locations differ significantly between generations, requiring distinct PCB layouts.