AMD XCV400E-6FG676C

Overview

XCV400E-6FG676C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) delivering 569,952 system gates and 10,800 logic cells in a 40 × 60 CLB array. It features eight digital Delay-Locked Loops (DLLs), 163.84 kb of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications infrastructure and reconfigurable signal processing systems.

For engineers reviewing the XCV400E-6FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (133 MHz internal register-to-register timing), FG676 fine-pitch BGA package with 404 user I/Os, dual-port block RAM architecture, and 1.8 V core voltage enabling low-power high-density logic implementation.

Technical Context

The XCV400E-6FG676C implements a regular FPGA architecture with configurable logic blocks (CLBs) containing four logic cells each, dedicated carry chains for arithmetic, and F5/F6 multiplexers supporting up to 19-input functions. Its IOBs support 20 I/O standards including LVTTL, SSTL, HSTL, LVDS, and LVPECL via per-bank VCCO/VREF configuration.

It integrates eight fully digital DLLs for zero-delay clock conversion, duty-cycle correction for DDR applications, and frequency multiplication (up to 4×). Block RAM is organized in 40 columns of 4096-bit dual-port memory, while distributed RAM resides within LUTs - both accessible at 250 MHz with true dual-port capability and independent port width configuration.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG676) with 676 balls, 1.0 mm pitch, and 27 mm × 27 mm body size. Thermal pad option available. Complies with JEDEC MO-205 standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV400E-6FG676C, the -7 variant offers improved timing margin without changing logic utilization or I/O allocation, while the XCV600E-6FG676C delivers significantly more logic and memory within identical mechanical and thermal constraints - enabling scalable architecture without layout revision.

Availability

XCV400E-6FG676C is available at Aetrix Electronics and suitable for high-speed communications backplanes, reconfigurable DSP accelerators, PCI Express co-processors, and industrial machine vision systems requiring stable component supply across extended production lifecycles.

Supply support for XCV400E-6FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools for high-performance digital system design.

The Virtex-E family was engineered to deliver evolutionary improvements over the original Virtex series - targeting high-speed communications, signal processing, and embedded computing with enhanced I/O flexibility, lower power, and higher density per unit area.

FAQ

What is the maximum operating frequency of the XCV400E-6FG676C?

The XCV400E-6FG676C has a -6 speed grade specifying worst-case register-to-register delay of 4.6 ns, enabling synchronous system clock rates up to 133 MHz. Internal performance reaches 130 MHz for four-LUT-level logic, and I/O can operate at 240 MHz using source-synchronous architectures. Actual frequency depends on design topology and placement, but the -6 grade guarantees timing closure under specified voltage and temperature conditions.

Does the XCV400E-6FG676C support LVDS I/O standards?

Yes, the XCV400E-6FG676C supports LVDS (622 Mb/s), BLVDS, and LVPECL differential signaling standards. Its SelectI/O+ technology allows LVDS inputs and outputs on any user I/O pin configured within compatible I/O banks powered by 2.5 V VCCO. Differential pairs require adjacent pins assigned to the same bank and share common VREF if needed for termination.

How many block RAMs does the XCV400E-6FG676C contain?

The XCV400E-6FG676C contains 40 block RAM modules, each 4096 bits in size, totaling 163,840 bits (20.48 kB) of synchronous block memory. Each block supports true dual-port operation with independent read/write addresses and widths, and is integrated into the routing matrix for low-latency access by CLBs or other block RAMs.

Is the XCV400E-6FG676C pin-compatible with other Virtex-E devices in FG676 packaging?

Yes, the XCV400E-6FG676C shares identical pinout with other Virtex-E devices in the FG676 package, including XCV300E-6FG676C and XCV600E-6FG676C. All use the same 27 mm × 27 mm footprint and ball map. However, unused pins may differ, and I/O bank voltage assignments must be verified per device density to ensure VCCO/VREF compatibility.

What configuration modes are supported by the XCV400E-6FG676C?

The XCV400E-6FG676C supports multiple configuration modes: Master Serial (via external PROM), Slave Serial, SelectMAP (8- or 16-bit parallel), and JTAG boundary-scan. Configuration data loads into internal SRAM on power-up or reset; JTAG mode enables in-system programming, debugging, and partial reconfiguration without interrupting system operation.