AMD XCV400E-6FG676I

Overview

XCV400E-6FG676I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 569,952 system gates, 10,800 logic cells, and 404 user I/O pins in a 676-ball Fine-Pitch Ball Grid Array (FG676) package. It features eight digital Delay-Locked Loops (DLLs), up to 163.84 kb of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communications infrastructure.

For engineers reviewing the XCV400E-6FG676I datasheet, pinout, applications, or equivalent options, this device is selected for high-density, high-performance reconfigurable logic in telecom line cards, protocol accelerators, and embedded vision preprocessing where deterministic clock management and multi-standard I/O are critical.

Technical Context

The XCV400E-6FG676I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and flip-flops with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS/LVPECL-with per-bank VCCO and VREF constraints. Eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise timing control across multiple voltage domains.

Key Specifications

Pinout & Package

Package: Fine-Pitch Ball Grid Array (FG676) with 0.8 mm pitch, 27 × 27 array, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV400E-6FG676I, the -7 variant delivers marginally improved timing performance without changing footprint or power profile, while the XCV600E-6FG676I offers substantial logic and I/O headroom at identical speed and package-making it ideal for scalable platform designs.

Availability

XCV400E-6FG676I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, embedded vision, and high-speed networking applications requiring stable component supply and long-term obsolescence management.

Supply support for XCV400E-6FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density reconfigurable logic in wireline communications, military/aerospace systems, and industrial automation-emphasizing speed, I/O flexibility, and deterministic timing over cost-optimized integration.

FAQ

What is the maximum operating junction temperature for XCV400E-6FG676I?

The XCV400E-6FG676I is rated for industrial temperature operation with a maximum junction temperature of +100°C. This specification is validated under continuous operation with proper thermal management, including recommended PCB copper pour and airflow per Xilinx DS022-1 Section 7. The 'I' suffix explicitly denotes this extended thermal range, distinguishing it from commercial-grade variants.

Does XCV400E-6FG676I support JTAG boundary scan for in-system programming?

Yes, XCV400E-6FG676I includes full IEEE 1149.1-compliant boundary scan logic with dedicated TCK, TMS, TDI, and TDO pins. This enables in-system configuration, debugging, and interconnect testing without requiring external programming hardware beyond standard JTAG adapters. The boundary scan chain covers all user I/O and internal logic elements per DS022-2 Module 2.

Can XCV400E-6FG676I interface directly with 200 MHz DDR SDRAM?

Yes, XCV400E-6FG676I supports 200 Mb/s DDR SDRAM interfaces using its SelectRAM+™ hierarchy and DLL-controlled clocking. The device's LVDCI-compatible I/O banks and programmable slew rate controls meet DDR timing requirements, and Xilinx provides synthesizable reference designs for DDR controller implementation in the Alliance Series tools.

How many differential I/O pairs does XCV400E-6FG676I support?

XCV400E-6FG676I supports up to 183 differential I/O pairs, as confirmed in Table 1 of DS022-1. This capability is realized through its SelectI/O+™ technology and applies specifically to LVDS, BLVDS, and LVPECL signaling standards. Each pair consumes two adjacent pins within the same I/O bank and requires matched trace lengths on the PCB.

Is XCV400E-6FG676I pin-compatible with other Virtex-E devices in FG676 packaging?

XCV400E-6FG676I shares the FG676 package footprint with XCV300E-6FG676I and XCV600E-6FG676I, but pin assignments differ across devices due to varying I/O counts and block RAM column placements. Pin compatibility is not guaranteed; designers must consult the specific pinout tables in DS022-4 Module 4 for each device before board reuse.