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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV400E-7BG432C

Name: XCV400E-7BG432C
Brand: AMD
SKU: XCV400E-7BG432C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV400E-7BG432C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 432-LBGA Exposed Pad, Metal

Datasheet:: XCV400E-7BG432C.pdf

Description:: IC FPGA 316 I/O 432MBGA

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Product details

Overview

XCV400E-7BG432C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 569,952 system gates and 10,800 logic cells in a 40 × 60 CLB array. It delivers 130 MHz internal performance (four LUT levels), supports up to 316 user I/O pins in the BG432 package, and operates across commercial temperature range (0 °C to +85 °C). It is used in high-speed communication interfaces requiring LVDS, LVPECL, or PCI-compliant I/O.

For engineers reviewing the XCV400E-7BG432C datasheet, pinout, applications, or equivalent options, key selection criteria include its eight digital Delay-Locked Loops (DLLs), 163.84 kb block RAM, 153.6 kb distributed RAM, 622 Mb/s differential I/O capability, and compatibility with 3.3 V PCI, SSTL, HSTL, and LVCMOS standards.

Technical Context

The XCV400E-7BG432C implements a flexible, regular FPGA architecture comprising configurable logic blocks (CLBs) surrounded by programmable input/output blocks (IOBs), interconnected via a hierarchical routing matrix. Each CLB contains four logic cells with 4-input LUTs, dedicated carry logic, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support SelectI/O+™ technology with 20 interface standards-including LVDS (622 Mb/s), LVPECL, BLVDS, SSTL3/2, HSTL, and PCI-enabled by banked VCCO/VREF supply domains. Eight fully digital DLLs provide zero-delay clock conversion, duty-cycle correction for DDR, and frequency multiplication up to 4×, all operating at 1.8 V core voltage.

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	569,952 - defines total logic capacity for complex digital systems including protocol engines and DSP pipelines.
Logic Cells	10,800 - provides granular, routable resources for implementing synchronous state machines and arithmetic units.
User I/O Pins	316 - enables high-pin-count interfaces such as parallel memory buses, multi-lane SerDes receivers, or video pixel interfaces.
Block RAM	163,840 bits - supports true dual-port operation for FIFOs, frame buffers, or ping-pong memory architectures without external RAM.
Distributed RAM	153,600 bits - delivers low-latency, fine-grained storage for register files, small lookup tables, or pipeline staging.
Max Differential I/O Pairs	183 - allows 366-pin differential signaling for ultra-high-bandwidth links like camera sensor interfaces or backplane data lanes.
DLL Count	8 - enables independent clock domain management for mixed-speed subsystems (e.g., PCIe PHY + DDR controller + CPU bus).
Core Voltage (VCCINT)	1.8 V - reduces dynamic power consumption vs. 2.5 V Virtex devices while maintaining timing closure at 130+ MHz.

Pinout & Package

Package: 432-ball Ball Grid Array (BG432), 1.27 mm pitch, commercial temperature grade (C).

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK7	Global Clock Input	Dedicated low-skew inputs feeding eight DLLs; required for synchronous system timing and DDR clocking.
VCCINT	Core Power Supply	1.8 V supply for CLBs, RAM, and routing; decoupling critical for jitter-sensitive clock domains.
VCCO_0–VCCO_7	I/O Bank Power	Bank-specific 1.5–3.3 V supplies enabling mixed-voltage I/O (e.g., SSTL2 on Bank 2, LVCMOS18 on Bank 4).
VREF_0–VREF_7	Input Threshold Reference	Bank-specific reference voltage for SSTL/HSTL/LVDS input receivers; must be externally sourced and stable ±1%.
TCK/TMS/TDI/TDO	JTAG Boundary Scan	IEEE 1149.1-compliant test interface for configuration verification, in-system programming, and production testing.
PROGRAM_B	Configuration Reset	Active-low asynchronous reset that clears configuration memory and initiates reconfiguration from external PROM.

Key Features

Feature	Design Value
Eight Digital DLLs	Enables zero-delay clock distribution, 50% duty-cycle correction for DDR I/O, and 4× frequency multiplication without external PLLs.
SelectRAM+™ Memory Hierarchy	Combines 163.84 kb block RAM (true dual-port, 250 MHz) with 153.6 kb distributed RAM for hierarchical memory architecture supporting burst-mode data capture and buffering.
SelectI/O+™ Technology	Supports 20 I/O standards including LVDS (622 Mb/s), LVPECL, SSTL3/2, HSTL I/IV, and PCI 33/66 MHz - all within same device via banked VCCO/VREF.
Flexible CLB Architecture	Each CLB contains four logic cells with 4-LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and dual flip-flops with independent CE/SR/BY controls.
SRAM-Based In-System Configuration	Allows unlimited reprogramming via JTAG, SelectMAP, or master serial mode; supports partial reconfiguration for dynamic function switching.

Applications

High-Speed Communication Interface	PCI Express Endpoint Logic
Use Scenario: Implementing a 4-lane, 2.5 Gbps SerDes receiver with elastic buffer and link training state machine. IC Role / Device Role / Timing Role: Configurable logic fabric hosting physical layer adaptation, 8b/10b decoding, and transaction layer arbitration. Use Value: Leverages 622 Mb/s LVDS I/O and eight DLLs to recover embedded clocks and align data across multiple lanes without external clock cleaners.	Use Scenario: Building a PCI-to-AXI bridge for legacy add-in cards in industrial control systems. IC Role / Device Role / Timing Role: Protocol translator managing address decoding, burst splitting, and parity generation for 33/66 MHz 32-bit PCI bus. Use Value: Uses 316 user I/O pins and PCI-compliant LVTTL I/O to directly interface with standard PCI slots while maintaining signal integrity at 66 MHz.
Video Frame Processing Pipeline	DDR SDRAM Memory Controller
Use Scenario: Real-time 1080p60 video scaling and color-space conversion in broadcast equipment. IC Role / Device Role / Timing Role: Parallel processing engine executing pixel-level operations using distributed RAM for line buffers and block RAM for frame stores. Use Value: Achieves >200 MHz pixel clock rates using dedicated carry logic for arithmetic and internal 3-state bussing for multi-channel data routing.	Use Scenario: Controlling two banks of 200 MHz DDR SDRAM in a network packet processor. IC Role / Device Role / Timing Role: High-bandwidth memory controller with write leveling, read deskew, and refresh scheduling logic. Use Value: Uses true dual-port block RAM for command queueing and DLL-synchronized outputs to meet tAC/tDQSS timing requirements of DDR chips.

High-Speed Communication Interface

PCI Express Endpoint Logic

Use Scenario: Implementing a 4-lane, 2.5 Gbps SerDes receiver with elastic buffer and link training state machine.

IC Role / Device Role / Timing Role: Configurable logic fabric hosting physical layer adaptation, 8b/10b decoding, and transaction layer arbitration.

Use Value: Leverages 622 Mb/s LVDS I/O and eight DLLs to recover embedded clocks and align data across multiple lanes without external clock cleaners.

Use Scenario: Building a PCI-to-AXI bridge for legacy add-in cards in industrial control systems.

IC Role / Device Role / Timing Role: Protocol translator managing address decoding, burst splitting, and parity generation for 33/66 MHz 32-bit PCI bus.

Use Value: Uses 316 user I/O pins and PCI-compliant LVTTL I/O to directly interface with standard PCI slots while maintaining signal integrity at 66 MHz.

Video Frame Processing Pipeline

DDR SDRAM Memory Controller

Use Scenario: Real-time 1080p60 video scaling and color-space conversion in broadcast equipment.

IC Role / Device Role / Timing Role: Parallel processing engine executing pixel-level operations using distributed RAM for line buffers and block RAM for frame stores.

Use Value: Achieves >200 MHz pixel clock rates using dedicated carry logic for arithmetic and internal 3-state bussing for multi-channel data routing.

Use Scenario: Controlling two banks of 200 MHz DDR SDRAM in a network packet processor.

IC Role / Device Role / Timing Role: High-bandwidth memory controller with write leveling, read deskew, and refresh scheduling logic.

Use Value: Uses true dual-port block RAM for command queueing and DLL-synchronized outputs to meet tAC/tDQSS timing requirements of DDR chips.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV400E-8BG432C	Higher speed grade (-8 vs. -7); 0.3 ns faster register-to-register delay (4.0 ns vs. 4.3 ns) and improved setup/hold margins.	Better suited for designs targeting >133 MHz internal clocks or tighter I/O timing budgets (e.g., 200 MHz DDR interfaces).	Select XCV400E-8BG432C when timing closure requires margin beyond -7 grade; otherwise, -7 offers cost advantage with identical pinout and features.
XCV600E-7BG432C	Higher density (186,624 logic cells vs. 10,800), larger block RAM (294.9 kb vs. 163.8 kb), and 512 user I/O pins - but same BG432 package footprint.	Enables more complex systems (e.g., multi-core SoC prototyping or full PCI Express root complex) where logic resource headroom is critical.	Choose XCV600E-7BG432C only if design exceeds XCV400E-7BG432C capacity; note that higher gate count increases static power and compilation time.

Compared with XCV400E-7BG432C, the -8 variant improves timing margin without changing layout, while the XCV600E-7BG432C offers scalable logic density in identical packaging - both retain full toolchain compatibility with Xilinx Foundation and Alliance Series software.

Availability

XCV400E-7BG432C is available at Aetrix Electronics and suitable for high-speed communication interfaces, PCI-compliant peripheral controllers, video processing pipelines, and DDR memory subsystems requiring stable component supply and long-term obsolescence management.

Supply support for XCV400E-7BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and EDA tools for high-performance digital system design.

The Virtex-E family was designed for high-speed, high-density applications demanding advanced I/O flexibility, integrated memory, and precise clock management - targeting communications infrastructure, test equipment, and imaging systems.

FAQ

What is the maximum differential I/O bandwidth supported by XCV400E-7BG432C?

XCV400E-7BG432C supports up to 183 differential I/O pairs, enabling aggregate differential bandwidth exceeding 100 Gb/s when operating at 622 Mb/s per LVDS lane. This bandwidth is realized through banked I/O architecture with independent VCCO/VREF domains, allowing concurrent use of multiple high-speed standards like LVDS and LVPECL without signal integrity degradation.

Does XCV400E-7BG432C support true dual-port block RAM operation?

Yes, XCV400E-7BG432C includes 40 block RAM modules totaling 163,840 bits, each configured as true dual-port synchronous RAM with independent read/write addresses, clocks, and enables per port. This enables simultaneous access for applications such as FIFOs, video frame buffers, or ping-pong memory controllers without external arbitration logic.

How many digital Delay-Locked Loops (DLLs) does XCV400E-7BG432C integrate?

XCV400E-7BG432C integrates eight fully digital Delay-Locked Loops (DLLs), each capable of zero-delay clock conversion, 50% duty-cycle correction for DDR applications, and frequency multiplication up to 4×. These DLLs operate independently and support LVPECL/LVDS clock inputs up to 300+ MHz, eliminating need for external clock synthesizers in multi-domain systems.

Is XCV400E-7BG432C pin-compatible with other Virtex-E devices in BG432 packaging?

XCV400E-7BG432C shares the same BG432 ball grid array footprint with XCV300E-7BG432C and XCV600E-7BG432C, but pin assignments differ due to varying I/O counts and block RAM column placements. While mechanical mounting is identical, PCB layout must match the specific pinout table for XCV400E-7BG432C - no direct pin-to-pin replacement exists across densities.

What I/O standards are supported by XCV400E-7BG432C for PCI compliance?

XCV400E-7BG432C supports full 3.3 V PCI compliance for both 33 MHz and 66 MHz operation using its LVTTL I/O standard with 16 mA drive strength and fast slew rate control. It meets PCI specification requirements for voltage levels, timing, and noise immunity - verified by factory testing and documented in DS022-3 DC and switching characteristics.

XCV400E-7BG432C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®-E

Package/Case:: 432-LBGA Exposed Pad, Metal

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 2400

Number of Logic Elements/Cells:: 10800

Total RAM Bits:: 163840

Number of I/O:: 316

Number of Gates:: 569952

Voltage - Supply:: 1.71V ~ 1.89V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 432-MBGA (40x40)

XCV400E-7BG432C FAQ

1.How can I place an order for XCV400E-7BG432C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV400E-7BG432C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV400E-7BG432C reliable?

The price and inventory of XCV400E-7BG432C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400E-7BG432C is usually 5 days.

3.What payment methods are accepted for XCV400E-7BG432C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV400E-7BG432C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV400E-7BG432C?

XCV400E-7BG432C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV400E-7BG432C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV400E-7BG432C?

For technical support, including XCV400E-7BG432C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400E-7BG432C requirements.

6.How does Aetrix verify that XCV400E-7BG432C is sourced from the original manufacturer or authorized distributors?

All XCV400E-7BG432C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400E-7BG432C meets industry standards.

7.What is the process for return or replacement of XCV400E-7BG432C?

All XCV400E-7BG432C units undergo pre-shipment inspection (PSI). If there is an issue with XCV400E-7BG432C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV400E-7BG432C part is unused and in its original packaging.

Return procedure for XCV400E-7BG432C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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