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AMD XCV400E-7BG432I
- Part No.:
- XCV400E-7BG432I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 432-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV400E-7BG432I.pdf
- Description:
- IC FPGA 316 I/O 432MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,380
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Product details
Overview
XCV400E-7BG432I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 569,952 system gates and 10,800 logic cells in a 40 × 60 CLB array. It delivers 130 MHz internal performance (four LUT levels), supports up to 316 user I/O pins in BG432 package, and features eight digital Delay-Locked Loops (DLLs) for clock management. It is used in high-speed communication interface design requiring PCI-compliant 3.3 V I/O and LVDS/LVPECL clock reception.
For engineers reviewing the XCV400E-7BG432I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration options, and industrial temperature-grade (-40°C to +100°C) operation context - all specific to the XCV400E-7BG432I speed-grade -7, BG432 package, and Industrial temperature variant.
Technical Context
The XCV400E-7BG432I implements a regular array of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous/asynchronous set/reset.
Its IOBs support 20 I/O standards including LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL, with bank-specific VCCO and VREF requirements. Eight DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and up to 4× frequency multiplication - all operating at 1.8 V core voltage with 3.3 V tolerant I/O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 569,952 - defines total logic capacity for gate-equivalent synthesis mapping |
| Logic Cells | 10,800 - actual programmable elements, each with LUT + flip-flop + carry logic |
| User I/O Pins | 316 - maximum single-ended I/O count in BG432 package, constrained by I/O banking rules |
| Block RAM Bits | 163,840 - distributed across 40 × 4096-bit true dual-port synchronous RAM blocks |
| DLL Count | 8 - fully digital delay-locked loops enabling precise clock deskew and DDR timing control |
| Core Voltage (VCCINT) | 1.8 V - determines static/dynamic power consumption and thermal profile in industrial operation |
| Speed Grade | -7 - specifies worst-case timing performance: e.g., 4.6 ns 16:1 multiplexer delay, 4.3 ns register-to-register path |
Pinout & Package
Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 1.0 mm pitch, RoHS-compliant, industrial temperature grade (–40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Dedicated low-skew clock inputs routed to all DLLs and CLBs; require LVPECL/LVDS termination for >300 MHz operation |
| VCCINT | Core Power Supply | 1.8 V supply for CLBs, RAM, and DLLs; requires tight regulation and local decoupling near ball grid center |
| VCCO_0–VCCO_7 | I/O Bank Power Supplies | Bank-specific 1.5–3.3 V supplies determining output voltage and input threshold compatibility per bank |
| VREF_0–VREF_7 | Input Reference Voltage | Bank-specific reference for SSTL/HSTL/GTL standards; must be externally sourced and shared across all VREF pins in same bank |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface for configuration, debugging, and in-system verification |
| PROGRAM_B / INIT_B / DONE | Configuration Control | Active-low signals managing master serial SPROM loading, initialization status, and configuration completion handshake |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVTTL, LVDS, LVPECL, SSTL3, HSTL) with bank-isolated VCCO/VREF - enables mixed-voltage board interfaces without level shifters |
| SelectRAM+™ Memory Hierarchy | 163.8 kb block RAM + 153.6 kb distributed RAM - allows true dual-port memory access, bus-width conversion, and embedded FIFO implementation |
| SelectLink™ DDR Interface | Hardened DDR link between FPGA and external memory controllers - reduces timing closure effort for 200 Mb/s DDR SDRAM interfaces |
| Digital DLL Clock Management | Eight independent DLLs with 4× multiplication and duty-cycle correction - eliminates external clock synthesizers for DDR and source-synchronous designs |
| Die Temperature Sensor Diode | On-die diode for thermal monitoring - enables closed-loop thermal management in industrial enclosures without external sensors |
Applications
| High-Speed Communication Interface | PCI Bus Controller Acceleration |
|---|---|
Use Scenario: Implementing 66 MHz 32-bit PCI bus mastering logic with DMA arbitration and burst-mode data transfer. IC Role / Device Role / Timing Role: XCV400E-7BG432I serves as the protocol engine and glue logic, handling PCI command decoding, address/data multiplexing, and timing compliance per PCI specification Rev 2.2. Use Value: Leverages 3.3 V PCI-compliant I/O banks and DLL-controlled setup/hold margins to meet tSU/tH requirements without external buffers or timing compensation circuits. |
Use Scenario: Offloading packet classification and header parsing in telecom line cards using parallel pattern matching engines. IC Role / Device Role / Timing Role: XCV400E-7BG432I implements deep pipelined CAM-like logic with distributed RAM-based lookup tables and parallel compare units. Use Value: Uses 10,800 logic cells and 153.6 kb distributed RAM to achieve >100 million pattern matches/sec at 133 MHz internal clock, reducing ASIC dependency. |
| LVDS-Based SerDes Front-End | Industrial Motion Control PLC Core |
Use Scenario: Receiving 622 Mb/s source-synchronous LVDS data streams from high-resolution imaging sensors. IC Role / Device Role / Timing Role: XCV400E-7BG432I acts as the deserializer and frame buffer controller, using DLL-aligned sampling clocks and block RAM for line buffering. Use Value: Achieves sub-100 ps clock-to-data alignment via LVDS input DLL locking and on-chip delay-matched capture paths - eliminating external CDR ICs. |
Use Scenario: Real-time deterministic execution of motion trajectory interpolation and servo loop control in CNC machines. IC Role / Device Role / Timing Role: XCV400E-7BG432I hosts dual-core soft processor (MicroBlaze) plus hardware-accelerated PID and S-curve generators. Use Value: Delivers <1 µs jitter on 20 kHz PWM outputs using dedicated carry chains and synchronous reset flip-flops - meeting IEC 61800-3 functional safety timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV400E-8BG432I | Higher speed grade (-8): 0.3–0.5 ns faster register-to-register and adder delays; identical pinout, package, and temperature rating | Required only when design fails timing closure at -7 grade; no change to I/O banking or memory configuration | Select XCV400E-8BG432I if post-place-and-route static timing analysis shows >0.2 ns negative slack on critical paths. |
| XCV600E-7BG432I | Higher density: 186,624 logic cells (+73%), 294.9 kb block RAM (+80%), same BG432 package and -7 speed grade | Enables larger state machines and deeper pipeline stages; requires updated floorplan and increased power delivery headroom | Choose XCV600E-7BG432I when design exceeds 90% CLB utilization or requires >200 kb block RAM for video frame buffering. |
Compared with XCV400E-7BG432I, the -8 variant offers tighter timing margins without layout changes, while the XCV600E-7BG432I provides scalable logic and memory headroom - both retain identical I/O banking structure and industrial temperature support, enabling drop-in migration within the same PCB footprint.
Availability
XCV400E-7BG432I is available at Aetrix Electronics and suitable for high-reliability industrial automation, telecom infrastructure, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XCV400E-7BG432I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute solutions since 1984.
The Virtex-E family was designed for high-performance, high-density logic implementation in communications and computing systems where 1.8 V core efficiency, multi-standard I/O flexibility, and integrated clock management reduce system-level complexity.
FAQ
What is the maximum differential I/O pair count supported by XCV400E-7BG432I?
XCV400E-7BG432I supports up to 183 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This count is fixed for the XCV400E device regardless of package; the BG432 package realizes 316 single-ended I/Os, which maps to 183 differential pairs when configured for LVDS or LVPECL signaling with proper bank assignment.
Does XCV400E-7BG432I support 5 V-tolerant I/O?
No, XCV400E-7BG432I does not support native 5 V-tolerant I/O. Its I/O pins are 3.3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin - but PCI 5 V operation is explicitly unsupported per DS022-1 Section "Virtex-E Compared to Virtex Devices".
Can XCV400E-7BG432I be configured via JTAG in-system?
Yes, XCV400E-7BG432I supports IEEE 1149.1 boundary-scan configuration through TCK/TMS/TDI/TDO pins. JTAG mode enables in-system programming, debugging, and verification without requiring external configuration PROMs - confirmed in DS022-1 Module 1 and DS022-2 Section "Input/Output Block".
What is the block RAM depth/width configuration flexibility of XCV400E-7BG432I?
XCV400E-7BG432I's 40 block RAMs (163,840 bits total) support true dual-port operation with independently configurable port widths. Per DS022-2 Table 5, valid configurations include 4096×1, 2048×2, 1024×4, 512×8, and 256×16 - enabling seamless integration with 8-, 16-, or 32-bit external memory buses without glue logic.
Is XCV400E-7BG432I pin-compatible with earlier Virtex devices?
XCV400E-7BG432I is not bitstream-compatible with Virtex devices, but shares pin compatibility with equivalent Virtex devices in the same BG432 package - with minor exceptions documented in DS022-1 Module 1. Migration requires recompilation but no PCB redesign, provided banking constraints and VCCO/VREF assignments are preserved.
XCV400E-7BG432I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 432-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 10800
- Total RAM Bits:
- 163840
- Number of I/O:
- 316
- Number of Gates:
- 569952
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 432-MBGA (40x40)
XCV400E-7BG432I FAQ
1.How can I place an order for XCV400E-7BG432I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV400E-7BG432I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV400E-7BG432I reliable?
The price and inventory of XCV400E-7BG432I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400E-7BG432I is usually 5 days.
3.What payment methods are accepted for XCV400E-7BG432I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV400E-7BG432I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV400E-7BG432I?
XCV400E-7BG432I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV400E-7BG432I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV400E-7BG432I?
For technical support, including XCV400E-7BG432I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400E-7BG432I requirements.
6.How does Aetrix verify that XCV400E-7BG432I is sourced from the original manufacturer or authorized distributors?
All XCV400E-7BG432I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400E-7BG432I meets industry standards.
7.What is the process for return or replacement of XCV400E-7BG432I?
All XCV400E-7BG432I units undergo pre-shipment inspection (PSI). If there is an issue with XCV400E-7BG432I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV400E-7BG432I part is unused and in its original packaging.
Return procedure for XCV400E-7BG432I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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