AMD XCV400E-7BG560C
- Part No.:
- XCV400E-7BG560C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 560-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV400E-7BG560C.pdf
- Description:
- IC FPGA 404 I/O 560MBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,681
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Product details
Overview
XCV400E-7BG560C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 569,952 system gates, 10,800 logic cells, and 404 user I/O pins in a 560-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 163.84 kb of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V interfaces for high-speed communications infrastructure and test equipment.
For engineers reviewing the XCV400E-7BG560C datasheet, pinout, applications, or equivalent options, key selection criteria include its -7 speed grade (4.3 ns register-to-register delay), 1.8 V core voltage with 3.3 V I/O tolerance, 240 MHz synchronous system clock capability, and support for source-synchronous data transmission architectures.
Technical Context
The XCV400E-7BG560C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected by a General Routing Matrix (GRM) and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.
Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS/LVPECL-with banked VCCO and VREF constraints. Eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise timing control across multiple clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 569,952 - defines total logic capacity for complex digital systems |
| Logic Cells | 10,800 - provides fine-grained programmable resources for RTL synthesis |
| User I/O Pins | 404 - enables high-bandwidth parallel interfaces and multi-standard I/O banking |
| Block RAM Bits | 163,840 - delivers true dual-port memory for FIFOs, buffers, and data coalescing |
| Speed Grade | -7 - guarantees ≤4.3 ns register-to-register delay at worst-case conditions |
| Core Voltage (VCCINT) | 1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling higher density at lower thermal load |
| DLL Count | 8 - supports independent clock domain management for multi-rate I/O and internal subsystems |
| Max I/O Data Rate | 622 Mb/s (LVDS) - enables direct interfacing with high-speed SerDes PHYs and optical modules |
Pinout & Package
Package: 560-ball Ball Grid Array (BG560), 1.27 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Input | Dedicated low-skew inputs for DLL reference clocks; each connects to one of eight DLLs |
| VCCINT | Core Power Supply | 1.8 V supply for CLBs, BRAM, and routing; requires local decoupling near power balls |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific 1.5–3.3 V supplies enabling mixed-voltage I/O standards within separate banks |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/LVCMOS input buffers; must be externally sourced |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for configuration, debug, and production testing |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-Based In-System Configuration | Enables unlimited field reprogramming via JTAG, SelectMAP, or master serial mode without hardware changes |
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS, LVPECL, SSTL3, and HSTL IV-enabling direct connection to memory, processors, and high-speed serial links |
| SelectRAM+™ Memory Hierarchy | Combines 163.84 kb block RAM (true dual-port, configurable depth/width) with 153.6 kb distributed RAM for hierarchical memory architecture |
| SelectLink™ DDR Interface | Provides optimized hardwired DDR link paths between CLBs and block RAM, reducing routing congestion for burst-mode data transfers |
| Digital Delay-Locked Loops (DLLs) | Eight fully digital DLLs deliver jitter-free clock deskew, 50% duty cycle correction, and frequency multiplication-critical for DDR I/O and internal timing closure |
| Die-Temperature Sensor Diode | On-die diode enables real-time thermal monitoring via external ADC, supporting dynamic thermal throttling in high-power applications |
Applications
| Communications Backplane Interface | High-Speed Test Instrumentation |
|---|---|
Use Scenario: Interfacing FPGA to 66 MHz PCI bus and 622 Mb/s LVDS serial links in telecom line cards. IC Role / Device Role / Timing Role: Configurable protocol bridge and packet processing engine with deterministic latency via DLL-controlled clocks. Use Value: 404 I/O pins allow simultaneous PCI host interface, SERDES lane aggregation, and memory-mapped control registers without external glue logic. | Use Scenario: Real-time waveform generation and acquisition in automated test equipment (ATE) with sub-nanosecond timing resolution. IC Role / Device Role / Timing Role: High-speed pattern generator and digitizer controller using distributed RAM for deep sample buffering and DLL-synchronized sampling clocks. Use Value: 8 DLLs enable independent phase alignment of stimulus and capture clocks, achieving <100 ps skew across 32-channel parallel acquisition. |
| Industrial Motion Control System | Medical Imaging Data Pipeline |
Use Scenario: Closed-loop servo control with encoder feedback, PWM motor drive outputs, and safety interlock monitoring. IC Role / Device Role / Timing Role: Real-time deterministic logic engine implementing PID loops, pulse-width modulation, and fault response with guaranteed interrupt latency. Use Value: Dedicated carry logic and fast arithmetic paths achieve 200 kHz PWM update rates with <500 ns jitter, meeting SIL-2 functional safety requirements. | Use Scenario: Raw sensor data aggregation from multi-channel CT/MRI detectors before compression and transfer to host CPU. IC Role / Device Role / Timing Role: High-throughput data concentrator with on-chip buffering, pixel alignment, and error detection using block RAM and CRC logic. Use Value: 163.84 kb true dual-port block RAM allows concurrent write (from 16 ADC channels) and read (to PCIe interface) at 200 MB/s sustained bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based programmable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV400E-8BG560C | Faster -8 speed grade (≤3.8 ns register-to-register delay); identical logic density, I/O count, and package | Better suited for designs requiring tighter timing closure at 240 MHz system clock or >622 Mb/s LVDS margins | Select when timing margin is critical and power/thermal budget permits higher VCCINT current draw |
| XCV600E-7BG560C | Higher density (186,624 logic cells, 294.91 kb block RAM); same -7 speed grade and BG560 package footprint | Required for larger state machines, wider datapaths, or additional embedded processor cores beyond XCV400E capacity | Choose when design scales beyond 10,800 logic cells but retains same PCB layout and thermal profile |
Compared with XCV400E-7BG560C, the -8 variant improves maximum operating frequency at the cost of higher static/dynamic power, while the XCV600E-7BG560C extends logic and memory resources without altering pinout or timing behavior-making both viable for migration paths rather than drop-in replacements.
Availability
XCV400E-7BG560C is available at Aetrix Electronics and suitable for communications infrastructure, industrial motion control, high-speed test instrumentation, and medical imaging data pipeline applications requiring stable component supply and long-term obsolescence management.
Supply support for XCV400E-7BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.
The Virtex-E family was designed for high-speed, high-density applications demanding advanced I/O flexibility, integrated memory, and precise clock management-targeting telecom, test & measurement, and industrial automation markets.
FAQ
What is the maximum supported I/O standard data rate for XCV400E-7BG560C?
XCV400E-7BG560C supports LVDS signaling at up to 622 Mb/s, LVPECL clock inputs at over 300 MHz, and single-ended I/O performance up to 240 MHz using source-synchronous architectures. These rates are validated under worst-case timing conditions for the -7 speed grade and require proper PCB layout, termination, and VCCO/VREF compliance per I/O banking rules.
Does XCV400E-7BG560C support JTAG boundary scan and in-system configuration?
Yes, XCV400E-7BG560C includes full IEEE 1149.1 boundary scan logic and supports in-system configuration via JTAG, SelectMAP, slave serial, and master serial modes. The TCK/TMS/TDI/TDO pins provide standardized access for programming, debugging, and production testing without requiring external configuration PROMs.
How many DLLs does XCV400E-7BG560C integrate, and what functions do they perform?
XCV400E-7BG560C integrates eight fully digital Delay-Locked Loops (DLLs). Each DLL performs clock deskew, 50% duty cycle correction for DDR applications, frequency multiplication (up to 4×), and zero-delay conversion of high-speed LVPECL/LVDS clocks to any supported I/O standard-enabling precise multi-domain clock management.
What is the block RAM capacity and architecture of XCV400E-7BG560C?
XCV400E-7BG560C provides 40 block SelectRAM units totaling 163,840 bits of true dual-port synchronous RAM. Each block is 4096 bits with independently configurable port widths (1–36 bits) and depths (128–4096), supporting simultaneous read/write operations essential for FIFOs, frame buffers, and data coalescing pipelines.
Is XCV400E-7BG560C pin-compatible with other Virtex-E devices in the BG560 package?
XCV400E-7BG560C is pin-compatible with other Virtex-E devices offered in the BG560 package-including XCV300E-7BG560C and XCV600E-7BG560C-as confirmed in DS022-4 Pinout Tables. However, I/O banking assignments, VCCO/VREF pin allocations, and dedicated function pin usage (e.g., GCLK locations) vary by device density and must be verified per design.
XCV400E-7BG560C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 560-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 10800
- Total RAM Bits:
- 163840
- Number of I/O:
- 404
- Number of Gates:
- 569952
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 560-MBGA (42.5x42.5)
XCV400E-7BG560C FAQ
1.How can I place an order for XCV400E-7BG560C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV400E-7BG560C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV400E-7BG560C reliable?
The price and inventory of XCV400E-7BG560C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400E-7BG560C is usually 5 days.
3.What payment methods are accepted for XCV400E-7BG560C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV400E-7BG560C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV400E-7BG560C?
XCV400E-7BG560C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV400E-7BG560C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV400E-7BG560C?
For technical support, including XCV400E-7BG560C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400E-7BG560C requirements.
6.How does Aetrix verify that XCV400E-7BG560C is sourced from the original manufacturer or authorized distributors?
All XCV400E-7BG560C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400E-7BG560C meets industry standards.
7.What is the process for return or replacement of XCV400E-7BG560C?
All XCV400E-7BG560C units undergo pre-shipment inspection (PSI). If there is an issue with XCV400E-7BG560C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV400E-7BG560C part is unused and in its original packaging.
Return procedure for XCV400E-7BG560C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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