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AMD XCV400E-7BG560C

Part No.:
XCV400E-7BG560C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
560-LBGA Exposed Pad, Metal
Datasheet:
AetrixXCV400E-7BG560C.pdf
Description:
IC FPGA 404 I/O 560MBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,681

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Product details

Overview

XCV400E-7BG560C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 569,952 system gates, 10,800 logic cells, and 404 user I/O pins in a 560-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 163.84 kb of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V interfaces for high-speed communications infrastructure and test equipment.

For engineers reviewing the XCV400E-7BG560C datasheet, pinout, applications, or equivalent options, key selection criteria include its -7 speed grade (4.3 ns register-to-register delay), 1.8 V core voltage with 3.3 V I/O tolerance, 240 MHz synchronous system clock capability, and support for source-synchronous data transmission architectures.

Technical Context

The XCV400E-7BG560C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected by a General Routing Matrix (GRM) and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS/LVPECL-with banked VCCO and VREF constraints. Eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise timing control across multiple clock domains.

Key Specifications

ParameterValue and Actual Design Meaning
System Gates569,952 - defines total logic capacity for complex digital systems
Logic Cells10,800 - provides fine-grained programmable resources for RTL synthesis
User I/O Pins404 - enables high-bandwidth parallel interfaces and multi-standard I/O banking
Block RAM Bits163,840 - delivers true dual-port memory for FIFOs, buffers, and data coalescing
Speed Grade-7 - guarantees ≤4.3 ns register-to-register delay at worst-case conditions
Core Voltage (VCCINT)1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling higher density at lower thermal load
DLL Count8 - supports independent clock domain management for multi-rate I/O and internal subsystems
Max I/O Data Rate622 Mb/s (LVDS) - enables direct interfacing with high-speed SerDes PHYs and optical modules

Pinout & Package

Package: 560-ball Ball Grid Array (BG560), 1.27 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0°C to +85°C).

Pin/TerminalCircuit RoleDesign Meaning
GCLK0–GCLK7Global Clock InputDedicated low-skew inputs for DLL reference clocks; each connects to one of eight DLLs
VCCINTCore Power Supply1.8 V supply for CLBs, BRAM, and routing; requires local decoupling near power balls
VCCO_0–VCCO_7I/O Bank PowerBank-specific 1.5–3.3 V supplies enabling mixed-voltage I/O standards within separate banks
VREF_0–VREF_7Input Threshold ReferenceBank-specific reference voltage for SSTL/HSTL/LVCMOS input buffers; must be externally sourced
TCK/TMS/TDI/TDOJTAG Boundary ScanIEEE 1149.1-compliant test access port for configuration, debug, and production testing
PROGRAM_BConfiguration ResetActive-low asynchronous reset that clears configuration memory and initiates reconfiguration

Key Features

FeatureDesign Value
SRAM-Based In-System ConfigurationEnables unlimited field reprogramming via JTAG, SelectMAP, or master serial mode without hardware changes
SelectI/O+™ TechnologySupports 20 I/O standards including LVDS, LVPECL, SSTL3, and HSTL IV-enabling direct connection to memory, processors, and high-speed serial links
SelectRAM+™ Memory HierarchyCombines 163.84 kb block RAM (true dual-port, configurable depth/width) with 153.6 kb distributed RAM for hierarchical memory architecture
SelectLink™ DDR InterfaceProvides optimized hardwired DDR link paths between CLBs and block RAM, reducing routing congestion for burst-mode data transfers
Digital Delay-Locked Loops (DLLs)Eight fully digital DLLs deliver jitter-free clock deskew, 50% duty cycle correction, and frequency multiplication-critical for DDR I/O and internal timing closure
Die-Temperature Sensor DiodeOn-die diode enables real-time thermal monitoring via external ADC, supporting dynamic thermal throttling in high-power applications

Applications

Communications Backplane InterfaceHigh-Speed Test Instrumentation

Use Scenario: Interfacing FPGA to 66 MHz PCI bus and 622 Mb/s LVDS serial links in telecom line cards.

IC Role / Device Role / Timing Role: Configurable protocol bridge and packet processing engine with deterministic latency via DLL-controlled clocks.

Use Value: 404 I/O pins allow simultaneous PCI host interface, SERDES lane aggregation, and memory-mapped control registers without external glue logic.

Use Scenario: Real-time waveform generation and acquisition in automated test equipment (ATE) with sub-nanosecond timing resolution.

IC Role / Device Role / Timing Role: High-speed pattern generator and digitizer controller using distributed RAM for deep sample buffering and DLL-synchronized sampling clocks.

Use Value: 8 DLLs enable independent phase alignment of stimulus and capture clocks, achieving <100 ps skew across 32-channel parallel acquisition.

Industrial Motion Control SystemMedical Imaging Data Pipeline

Use Scenario: Closed-loop servo control with encoder feedback, PWM motor drive outputs, and safety interlock monitoring.

IC Role / Device Role / Timing Role: Real-time deterministic logic engine implementing PID loops, pulse-width modulation, and fault response with guaranteed interrupt latency.

Use Value: Dedicated carry logic and fast arithmetic paths achieve 200 kHz PWM update rates with <500 ns jitter, meeting SIL-2 functional safety requirements.

Use Scenario: Raw sensor data aggregation from multi-channel CT/MRI detectors before compression and transfer to host CPU.

IC Role / Device Role / Timing Role: High-throughput data concentrator with on-chip buffering, pixel alignment, and error detection using block RAM and CRC logic.

Use Value: 163.84 kb true dual-port block RAM allows concurrent write (from 16 ADC channels) and read (to PCIe interface) at 200 MB/s sustained bandwidth.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCV400E-8BG560CFaster -8 speed grade (≤3.8 ns register-to-register delay); identical logic density, I/O count, and packageBetter suited for designs requiring tighter timing closure at 240 MHz system clock or >622 Mb/s LVDS marginsSelect when timing margin is critical and power/thermal budget permits higher VCCINT current draw
XCV600E-7BG560CHigher density (186,624 logic cells, 294.91 kb block RAM); same -7 speed grade and BG560 package footprintRequired for larger state machines, wider datapaths, or additional embedded processor cores beyond XCV400E capacityChoose when design scales beyond 10,800 logic cells but retains same PCB layout and thermal profile

Compared with XCV400E-7BG560C, the -8 variant improves maximum operating frequency at the cost of higher static/dynamic power, while the XCV600E-7BG560C extends logic and memory resources without altering pinout or timing behavior-making both viable for migration paths rather than drop-in replacements.

Availability

XCV400E-7BG560C is available at Aetrix Electronics and suitable for communications infrastructure, industrial motion control, high-speed test instrumentation, and medical imaging data pipeline applications requiring stable component supply and long-term obsolescence management.

Supply support for XCV400E-7BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-E family was designed for high-speed, high-density applications demanding advanced I/O flexibility, integrated memory, and precise clock management-targeting telecom, test & measurement, and industrial automation markets.

FAQ

What is the maximum supported I/O standard data rate for XCV400E-7BG560C?

XCV400E-7BG560C supports LVDS signaling at up to 622 Mb/s, LVPECL clock inputs at over 300 MHz, and single-ended I/O performance up to 240 MHz using source-synchronous architectures. These rates are validated under worst-case timing conditions for the -7 speed grade and require proper PCB layout, termination, and VCCO/VREF compliance per I/O banking rules.

Does XCV400E-7BG560C support JTAG boundary scan and in-system configuration?

Yes, XCV400E-7BG560C includes full IEEE 1149.1 boundary scan logic and supports in-system configuration via JTAG, SelectMAP, slave serial, and master serial modes. The TCK/TMS/TDI/TDO pins provide standardized access for programming, debugging, and production testing without requiring external configuration PROMs.

How many DLLs does XCV400E-7BG560C integrate, and what functions do they perform?

XCV400E-7BG560C integrates eight fully digital Delay-Locked Loops (DLLs). Each DLL performs clock deskew, 50% duty cycle correction for DDR applications, frequency multiplication (up to 4×), and zero-delay conversion of high-speed LVPECL/LVDS clocks to any supported I/O standard-enabling precise multi-domain clock management.

What is the block RAM capacity and architecture of XCV400E-7BG560C?

XCV400E-7BG560C provides 40 block SelectRAM units totaling 163,840 bits of true dual-port synchronous RAM. Each block is 4096 bits with independently configurable port widths (1–36 bits) and depths (128–4096), supporting simultaneous read/write operations essential for FIFOs, frame buffers, and data coalescing pipelines.

Is XCV400E-7BG560C pin-compatible with other Virtex-E devices in the BG560 package?

XCV400E-7BG560C is pin-compatible with other Virtex-E devices offered in the BG560 package-including XCV300E-7BG560C and XCV600E-7BG560C-as confirmed in DS022-4 Pinout Tables. However, I/O banking assignments, VCCO/VREF pin allocations, and dedicated function pin usage (e.g., GCLK locations) vary by device density and must be verified per design.

XCV400E-7BG560C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
560-LBGA Exposed Pad, Metal
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
10800
Total RAM Bits:
163840
Number of I/O:
404
Number of Gates:
569952
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
560-MBGA (42.5x42.5)

XCV400E-7BG560C FAQ

1.How can I place an order for XCV400E-7BG560C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV400E-7BG560C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV400E-7BG560C reliable?

The price and inventory of XCV400E-7BG560C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400E-7BG560C is usually 5 days.

3.What payment methods are accepted for XCV400E-7BG560C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV400E-7BG560C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV400E-7BG560C?

XCV400E-7BG560C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV400E-7BG560C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV400E-7BG560C?

For technical support, including XCV400E-7BG560C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400E-7BG560C requirements.

6.How does Aetrix verify that XCV400E-7BG560C is sourced from the original manufacturer or authorized distributors?

All XCV400E-7BG560C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400E-7BG560C meets industry standards.

7.What is the process for return or replacement of XCV400E-7BG560C?

All XCV400E-7BG560C units undergo pre-shipment inspection (PSI). If there is an issue with XCV400E-7BG560C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV400E-7BG560C part is unused and in its original packaging.

Return procedure for XCV400E-7BG560C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV400E-7BG560C Tags

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