AMD XCV400E-7BG560I

Overview

XCV400E-7BG560I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 129,600 logic cells, 40 × 60 CLB array, and 404 user I/O pins in a 560-ball BGA package. It delivers 130 MHz internal performance (four LUT levels), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital Delay-Locked Loops (DLLs) for clock management - used in high-speed communications and reconfigurable computing systems.

For engineers reviewing the XCV400E-7BG560I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, SelectRAM+ memory configuration, and industrial-temperature (-40°C to +100°C) operation requirements specific to the -7 speed grade and BG560 package.

Technical Context

The XCV400E-7BG560I implements a flexible, regular FPGA architecture comprising configurable logic blocks (CLBs) surrounded by programmable input/output blocks (IOBs), interconnected via a hierarchical routing matrix. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice - enabling high-speed arithmetic and wide-input logic functions.

Its IOBs support 20 interface standards including LVTTL, LVCMOS2, SSTL3, HSTL, PCI33_3/66_3, LVDS, BLVDS, and LVPECL, with bank-specific VCCO and VREF constraints. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication - all operating at 1.8 V core voltage with 3.3 V I/O tolerance.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.27 mm pitch, RoHS-compliant, industrial temperature range (-40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV400E-7BG560I, the -8 variant improves worst-case timing but increases power slightly; the XCV600E-7 offers headroom for logic growth while maintaining pin compatibility - both require validation of thermal dissipation and power delivery under industrial conditions.

Availability

XCV400E-7BG560I is available at Aetrix Electronics and suitable for high-speed communications infrastructure, industrial control systems, and test & measurement equipment requiring stable component supply across extended lifecycle planning.

Supply support for XCV400E-7BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined solutions for aerospace, defense, communications, and industrial markets.

The Virtex-E family was designed for high-performance, low-power reconfigurable computing - targeting applications demanding >100 MHz system clocks, mixed-signal I/O flexibility, and embedded memory bandwidth exceeding 1 Tb/s.

FAQ

What is the maximum differential I/O capability of the XCV400E-7BG560I?

The XCV400E-7BG560I supports up to 183 differential I/O pairs, enabling 366 single-ended-equivalent signals. This capability is implemented through bank-specific LVDS/BLVDS/LVPECL-compatible IOBs, each pair requiring matched trace lengths and controlled impedance (100 Ω differential) for signal integrity. The BG560 package allocates dedicated differential pin pairs across all eight I/O banks.

Does the XCV400E-7BG560I support true dual-port block RAM?

Yes, the XCV400E-7BG560I includes 40 block SelectRAM units, each providing true dual-port 4096-bit synchronous RAM with independent read/write addresses, enables, and clocks per port. This allows concurrent access for applications like ping-pong buffering or real-time data streaming - confirmed in DS022-2 Table 4 and functional description Module 2.

What are the voltage requirements for I/O banks on the XCV400E-7BG560I?

The XCV400E-7BG560I requires bank-specific VCCO voltages: 1.5 V for HSTL, 1.8 V for LVCMOS18, 2.5 V for SSTL2/LVCMOS2, and 3.3 V for LVTTL/PCI. Input-only standards like GTL/GTL+ do not require VCCO but need VREF. All VCCO pins per bank must be tied to the same voltage; mixing incompatible standards within one bank violates I/O banking rules.

How many Delay-Locked Loops (DLLs) does the XCV400E-7BG560I integrate?

The XCV400E-7BG560I integrates eight fully digital Delay-Locked Loops (DLLs), as specified in DS022-1 Features section and confirmed in Module 2 architectural description. Each DLL supports clock multiply/divide, 50% duty cycle correction for DDR, and zero-delay conversion of LVPECL/LVDS inputs - critical for high-speed memory and SerDes interfaces.

Is the XCV400E-7BG560I pin-compatible with other Virtex-E devices in BG560 packaging?

Yes, the XCV400E-7BG560I shares identical pinout with XCV300E-7BG560I, XCV600E-7BG560I, and XCV1000E-7BG560I per DS022-4 Pinout Tables. However, unused pins may differ: for example, XCV300E has fewer VCCO/VREF pins allocated, while XCV600E enables additional I/O banks - requiring careful review of bank-specific pin assignments before migration.