AMD XCV400E-7FG676C

Overview

XCV400E-7FG676C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 129,600 logic cells, 40 × 60 CLB array, and 404 user I/O pins in a 676-ball Fine-Pitch BGA package. It delivers 130 MHz internal performance (four LUT levels), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital Delay-Locked Loops for clock management in high-speed communication and signal processing systems.

For engineers reviewing the XCV400E-7FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include its -7 speed grade (4.3 ns register-to-register delay), 163.84 kb block RAM, 153.6 kb distributed RAM, PCI-compliant 3.3 V I/O, and 1.8 V core voltage for low-power high-density logic implementation.

Technical Context

The XCV400E-7FG676C implements a flexible, regular FPGA architecture built around configurable logic blocks (CLBs) and programmable input/output blocks (IOBs), interconnected via a hierarchical routing matrix. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice-enabling high-speed arithmetic and wide-input logic functions.

Its IOBs support 20 interface standards including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS/BLVDS/LVPECL, with banked VCCO and VREF domains. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication-critical for synchronous system clocks up to 240 MHz and source-synchronous data transmission.

Key Specifications

Pinout & Package

The XCV400E-7FG676C is housed in a 676-ball Fine-Pitch Ball Grid Array (FG676) package with 1.0 mm ball pitch, designed for high I/O count and thermal performance in compact PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV400E-7FG676C, the -6 variant trades 7% speed margin for lower cost and power, while the XCV600E-7FG676C extends logic and memory headroom within the same package-making both viable alternatives depending on whether timing budget or resource ceiling is the primary constraint.

Availability

XCV400E-7FG676C is available at Aetrix Electronics and suitable for high-speed communications backplanes, medical imaging acquisition systems, defense radar processors, and industrial PCI bridging applications requiring stable component supply across extended product lifecycles.

Supply support for XCV400E-7FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and ACAPs for high-performance computing and embedded systems.

The Virtex-E family was engineered for high-speed, high-density logic implementation in communications infrastructure and signal processing-delivering 1.8 V core efficiency, advanced I/O flexibility, and integrated clock management to replace ASICs in evolving standards-based systems.

FAQ

What is the maximum operating junction temperature for XCV400E-7FG676C?

The XCV400E-7FG676C is rated for commercial temperature range (0 °C to +85 °C junction temperature). This specification is defined in the DS022-1 Production Product Specification and applies to all -7 speed grade devices in FG676 packaging. Thermal design must ensure die temperature remains within this limit under full static and dynamic loading conditions.

Does XCV400E-7FG676C support JTAG boundary scan for in-circuit testing?

Yes, XCV400E-7FG676C includes IEEE 1149.1-compliant boundary scan logic across all user I/Os and configuration pins. The TCK, TMS, TDI, and TDO signals are dedicated pins in the FG676 package, enabling full visibility into I/O states and configuration memory during production test and field diagnostics.

Can XCV400E-7FG676C interface directly with 5 V TTL logic?

No, XCV400E-7FG676C I/O pins are not 5 V tolerant by default. They support 3.3 V LVTTL and PCI but require external 100 Ω series resistors to safely interface with 5 V signals. Direct connection risks damage; proper level-shifting or bus-interface ICs are recommended for sustained 5 V signal integrity.

How many DLLs does XCV400E-7FG676C contain, and what are their key capabilities?

XCV400E-7FG676C contains eight fully digital Delay-Locked Loops. Each supports clock multiply/divide, zero-delay conversion of LVPECL/LVDS inputs to any I/O standard, 50% duty cycle synthesis for DDR applications, and easier clock mirroring than prior Virtex generations-enabling precise skew control across high-speed interfaces.

Is XCV400E-7FG676C pin-compatible with other Virtex-E devices in the FG676 package?

Yes, XCV400E-7FG676C shares identical FG676 pinout with XCV300E-7FG676C and XCV600E-7FG676C per DS022-4 Pinout Tables. However, I/O bank assignments and VCCO/VREF pin allocations differ across densities-requiring careful review of bank-specific voltage and standard compatibility before migration.