AMD XCV400E-8BG432C
- Part No.:
- XCV400E-8BG432C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 432-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV400E-8BG432C.pdf
- Description:
- IC FPGA 316 I/O 432MBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,856
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Product details
Overview
XCV400E-8BG432C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 569,952 system gates and 10,800 logic cells in a 40 × 60 CLB array. It delivers 130 MHz internal performance (four LUT levels), supports up to 404 user I/O pins in BG432 package, and integrates eight digital Delay-Locked Loops (DLLs) for clock management. It is used in high-speed communication interfaces requiring PCI-compliant 33/66 MHz operation and LVDS/LVPECL signaling.
For engineers reviewing the XCV400E-8BG432C datasheet, pinout, applications, or equivalent options, this page provides verified technical context, confirmed I/O banking rules, real-world timing performance data (e.g., 4.6 ns 16:1 multiplexer delay), exact block RAM configuration (40 × 4096-bit blocks = 163,840 bits), and validated alternatives for migration from Virtex-E family designs.
Technical Context
The XCV400E-8BG432C implements a regular FPGA architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), and a general routing matrix (GRM). Each CLB contains four logic cells (LCs), each with a 4-input LUT, carry logic, and a D-flip-flop; two slices per CLB support F5/F6 multiplexing for 5–6 input functions and arithmetic chains.
Its IOBs support 20 interface standards including LVTTL, LVCMOS2, SSTL3, HSTL, PCI33_3/PCI66_3, LVDS, BLVDS, and LVPECL - with I/O banks requiring shared VCCO (e.g., 3.3 V for PCI/LVTTL) and optional VREF (e.g., 1.5 V for SSTL3). Eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 569,952 - defines total logic capacity for gate-equivalent synthesis mapping |
| Logic Cells | 10,800 - actual programmable units, each with LUT + flip-flop + carry logic |
| User I/O Pins | 404 - maximum single-ended I/O count in BG432 package, constrained by bank voltage rules |
| Block RAM | 163,840 bits (40 × 4096-bit blocks) - true dual-port synchronous memory for FIFOs or buffering |
| DLL Count | 8 - fully digital delay-locked loops enabling precise clock deskew and DDR timing control |
| Internal Performance | 130 MHz (4-LUT level) - worst-case synchronous register-to-register speed under -8 speed grade |
| VCCINT | 1.8 V - core logic supply enabling lower power vs. 2.5 V Virtex family |
Pinout & Package
Package: 432-ball Ball Grid Array (BG432), 1.27 mm pitch, commercial temperature range (0°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Input | Dedicated low-skew clock inputs routed to all DLLs and CLBs; require LVPECL/LVDS termination for >300 MHz use |
| VCCINT | Core Logic Supply | 1.8 V power for CLBs, RAM, and routing; must be decoupled locally per Xilinx layout guidelines |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific 1.5–3.3 V supplies determining compatible I/O standards (e.g., VCCO=3.3 V enables PCI/LVTTL) |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/GTL inputs; must be externally supplied and stable ±1% |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface for programming and in-system verification |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVDS, LVPECL, SSTL3, HSTL, PCI) with bank-level VCCO/VREF control |
| SelectRAM+™ Memory | 163,840-bit block RAM + 153,600-bit distributed RAM - enables on-chip FIFOs, buffers, and dual-port memory without external chips |
| SelectLink™ DDR Interface | Hardened DDR link capability via dedicated routing and DLL-synchronized I/O for ZBT SRAM/DDR SDRAM interfacing |
| Digital DLLs | Eight independent DLLs with 4× multiplication, duty-cycle correction, and zero-delay clock conversion for source-synchronous interfaces |
| Arithmetic Optimization | Dedicated carry chain and AND gate per slice - reduces adder/multiplier latency and improves DSP resource efficiency |
Applications
| High-Speed Communication Backplane | PCI Express Gen1 Edge Device |
|---|---|
Use Scenario: Line card in telecom infrastructure handling 622 Mb/s SONET/SDH framing with source-synchronous data capture. IC Role / Device Role / Timing Role: FPGA acts as protocol mapper and serializer/deserializer; uses LVDS I/O and DLLs for jitter-tolerant clock recovery. Use Value: 622 Mb/s LVDS I/O and 8 DLLs enable deterministic timing alignment across 404 pins without external clock clean-up ICs. |
Use Scenario: Add-in card implementing PCIe endpoint logic with 33/66 MHz PCI compatibility for legacy host bridging. IC Role / Device Role / Timing Role: Configurable logic handles transaction layer, data link layer, and physical layer handshaking; uses PCI33_3/PCI66_3 I/O banks. Use Value: Native 3.3 V PCI compliance and 404 I/O pins allow full 64-bit/66 MHz bus implementation with no level-shifting components. |
| Medical Imaging Data Acquisition | Industrial Motion Control Hub |
Use Scenario: Real-time image preprocessing in MRI systems using parallel ADC streams at 200 MSPS. IC Role / Device Role / Timing Role: FPGA serves as high-bandwidth data concentrator and FIR filter engine; leverages distributed RAM for coefficient storage and block RAM for frame buffering. Use Value: 153,600-bit distributed RAM + 163,840-bit block RAM enables simultaneous 16-channel 12-bit sample buffering and 256-tap filtering without external memory. |
Use Scenario: Central controller synchronizing 12-axis servo drives via synchronized PWM and encoder feedback in CNC machinery. IC Role / Device Role / Timing Role: FPGA implements deterministic real-time scheduler, PWM generators, and quadrature decoder logic with sub-10 ns jitter. Use Value: Dedicated carry logic and 130 MHz internal performance ensure <4.6 ns 16:1 multiplexer delay for cycle-accurate axis coordination. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV400E-6BG432C | Slower -6 speed grade (110 MHz internal vs. 130 MHz); identical logic density, I/O count, and package | Suitable for cost-sensitive designs where 130 MHz timing margin is unnecessary | Select when design meets timing closure at -6 grade to reduce BOM cost and power consumption |
| XCV600E-8BG432C | Higher density (186,624 logic cells vs. 10,800); same BG432 package but 512 I/O pins and 294,912-bit block RAM | Required for designs needing >10K logic cells or >163k block RAM while retaining same footprint | Choose for future-proofing or incremental logic growth without PCB redesign |
Compared with XCV400E-8BG432C, the -6 variant trades speed for lower cost and power, while the XCV600E-8BG432C offers scalable logic and memory headroom within identical mechanical constraints - both preserve pin-compatible migration paths defined in DS022-4 pinout tables.
Availability
XCV400E-8BG432C is available at Aetrix Electronics and suitable for high-speed communication backplanes, PCI-compliant edge devices, medical imaging acquisition systems, and industrial motion control hubs requiring stable component supply across extended production lifecycles.
Supply support for XCV400E-8BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA and adaptive SoC solutions since 1984.
The Virtex-E family was designed for high-performance, high-density system integration in communications, computing, and industrial applications - emphasizing speed, I/O flexibility, and embedded memory hierarchy over earlier Virtex generations.
FAQ
What is the maximum differential I/O pair count supported by XCV400E-8BG432C?
XCV400E-8BG432C supports up to 183 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This value is fixed for the XCV400E device regardless of package; the BG432 variant realizes 404 total user I/O pins, with differential pairing constrained by bank layout and VCCO/VREF allocation per DS022-4 pinout documentation.
Does XCV400E-8BG432C support 5 V tolerant I/O?
No, XCV400E-8BG432C does not support native 5 V tolerant I/O. Its I/O pins are 3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin, as specified in DS022-1 Section "Virtex-E Compared to Virtex Devices". PCI 5 V operation is explicitly unsupported.
How many DLLs are integrated into XCV400E-8BG432C and what are their key capabilities?
XCV400E-8BG432C integrates eight fully digital Delay-Locked Loops (DLLs), as stated in DS022-1 Features section and confirmed in Module 2 architectural description. Each DLL supports clock multiply/divide, 50% duty cycle synthesis for DDR, zero-delay conversion of LVPECL/LVDS clocks, and easier clock mirroring versus Virtex-family DLLs.
Is XCV400E-8BG432C pin-compatible with other Virtex-E devices in BG432 package?
Yes, XCV400E-8BG432C is pin-compatible with other Virtex-E devices offered in BG432 package (e.g., XCV300E-8BG432C, XCV600E-8BG432C), as noted in DS022-1 "Virtex-E Compared to Virtex Devices" section. Minor exceptions exist and are documented in DS022-4 Pinout Tables, but mechanical and electrical pin mapping remains consistent across the BG432 footprint.
What is the block RAM configuration of XCV400E-8BG432C and how is it structured?
XCV400E-8BG432C contains 40 block SelectRAM units, each 4096 bits, totaling 163,840 bits, as listed in Table 4 of DS022-2. Each block is true dual-port synchronous RAM with independent address/data/control per port, organized in columns adjacent to CLB arrays per Table 3 column location mapping.
XCV400E-8BG432C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 432-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 10800
- Total RAM Bits:
- 163840
- Number of I/O:
- 316
- Number of Gates:
- 569952
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 432-MBGA (40x40)
XCV400E-8BG432C FAQ
1.How can I place an order for XCV400E-8BG432C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV400E-8BG432C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV400E-8BG432C reliable?
The price and inventory of XCV400E-8BG432C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400E-8BG432C is usually 5 days.
3.What payment methods are accepted for XCV400E-8BG432C?
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4.How is shipping managed for XCV400E-8BG432C?
XCV400E-8BG432C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV400E-8BG432C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV400E-8BG432C?
For technical support, including XCV400E-8BG432C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400E-8BG432C requirements.
6.How does Aetrix verify that XCV400E-8BG432C is sourced from the original manufacturer or authorized distributors?
All XCV400E-8BG432C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400E-8BG432C meets industry standards.
7.What is the process for return or replacement of XCV400E-8BG432C?
All XCV400E-8BG432C units undergo pre-shipment inspection (PSI). If there is an issue with XCV400E-8BG432C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV400E-8BG432C part is unused and in its original packaging.
Return procedure for XCV400E-8BG432C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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