AMD XCV400E-8FG676C

Overview

XCV400E-8FG676C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) delivering 569,952 system gates and 10,800 logic cells in a 676-pin Fine-Pitch Ball Grid Array (FG676) package. It features eight digital Delay-Locked Loops (DLLs), up to 404 user I/O pins (including support for LVDS, LVPECL, and HSTL), and 163,840 bits of true dual-port block RAM. It targets high-speed communication infrastructure and embedded processing applications requiring PCI-compliant 33/66 MHz interfaces and source-synchronous data transfer up to 622 Mb/s.

For engineers reviewing the XCV400E-8FG676C datasheet, pinout, applications, or equivalent options, this page provides verified technical context on its 0.18 μm 6-layer metal architecture, DLL-based clock management, SelectI/O+™ interface flexibility, and compatibility with Xilinx Foundation™ and Alliance Series™ design tools - all critical for timing-critical FPGA integration and migration from Virtex family devices.

Technical Context

The XCV400E-8FG676C implements a regular array architecture with configurable logic blocks (CLBs) containing four logic cells each, supported by dedicated carry logic, F5/F6 multiplexers for wide-input functions, and dual BUFTs per CLB for internal bus driving. Its IOBs support independent input/output flip-flops with programmable polarity, synchronous/asynchronous set/reset, and optional delay elements eliminating pad-to-pad hold time.

It integrates 40 block SelectRAM™ modules (163,840 bits total), each configured as true dual-port 4096-bit RAM with independent port widths and control signals, plus distributed RAM resources within CLBs. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4× - all operating without external analog components.

Key Specifications

Pinout & Package

The XCV400E-8FG676C is housed in a 27 × 27 mm Fine-Pitch Ball Grid Array (FG676) package with 676 solder balls arranged in a 27 × 27 array (excluding corner dummy balls). It features eight dedicated global clock inputs (GCLK0–GCLK7), multiple VCCINT (1.8 V), VCCO (configurable per I/O bank), and VREF pins distributed across eight I/O banks. Power delivery includes 48 VCCINT pins and 40 VCCO pins (bank-specific).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV400E-7FG676C, the XCV400E-8FG676C delivers guaranteed timing margin for high-speed interfaces; compared with XCV600E-8FG676C, it offers optimal balance of logic capacity, I/O count, and power efficiency for mid-scale communication and control applications.

Availability

XCV400E-8FG676C is available at Aetrix Electronics and suitable for high-speed communication backplanes, PCI interface acceleration, DDR SDRAM memory controllers, and video frame buffer applications requiring stable component supply across extended product lifecycles.

Supply support for XCV400E-8FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and development tool ecosystems for reconfigurable computing.

The XCV400E-8FG676C belongs to the Virtex-E 1.8 V FPGA family, designed for high-performance, high-density logic implementation in communications, networking, and embedded systems where speed, I/O flexibility, and memory integration are critical.

FAQ

What is the maximum supported I/O standard speed for XCV400E-8FG676C?

The XCV400E-8FG676C supports LVDS signaling at up to 622 Mb/s and LVPECL clock inputs exceeding 300 MHz. These speeds are achievable using source-synchronous architectures and require proper PCB layout with controlled impedance and termination. The -8 speed grade ensures timing closure for these rates under worst-case conditions specified in DS022-3.

Does XCV400E-8FG676C support JTAG boundary scan?

Yes, the XCV400E-8FG676C includes full IEEE 1149.1-compliant boundary scan logic. Pins TCK, TMS, TDI, and TDO are dedicated for test access, enabling in-system programming, interconnect testing, and debug visibility without requiring additional test circuitry. This capability is factory-verified and documented in Module 4 of DS022.

How many DLLs does XCV400E-8FG676C contain, and what are their key functions?

The XCV400E-8FG676C contains eight fully digital Delay-Locked Loops (DLLs). Each provides zero-delay clock conversion, 50% duty cycle correction for DDR applications, and frequency multiplication up to 4×. They operate independently per clock domain and require no external analog components, simplifying clock tree design for multi-rate systems.

Is XCV400E-8FG676C pin-compatible with earlier Virtex family devices?

The XCV400E-8FG676C is pin-compatible with equivalent Virtex devices in the same FG676 package, with minor exceptions documented in the DS022 pinout section. However, it is not bitstream-compatible due to architectural differences in CLB structure, DLL implementation, and I/O banking rules - requiring full recompilation of source HDL.

What power supply requirements does XCV400E-8FG676C have?

The XCV400E-8FG676C requires two primary supplies: VCCINT = 1.8 V ± 3% for core logic and DLLs, and bank-specific VCCO (1.5 V to 3.3 V) for I/O drivers. It also needs VREF for certain input standards. Total VCCINT current depends on logic utilization and switching activity, with typical active current ranging from 1.2 A to 2.8 A at 100 MHz operation.