AMD XCV400E-8PQ240C
- Part No.:
- XCV400E-8PQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCV400E-8PQ240C.pdf
- Description:
- IC FPGA 158 I/O 240QFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV400E-8PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 569,952 system gates and 10,800 logic cells in a 40 × 60 CLB array. It delivers up to 240 MHz synchronous system performance, supports LVDS/BLVDS/LVPECL differential I/O at 622 Mb/s, and integrates eight digital Delay-Locked Loops (DLLs) for clock management. It is used in high-speed communication interface design, such as PCI 66-MHz bridge logic and source-synchronous data capture subsystems.
For engineers reviewing the XCV400E-8PQ240C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration options, and package-specific routing limitations - all confirmed against DS022-1 (v2.3) and DS022-4 (Pinout Tables).
Technical Context
The XCV400E-8PQ240C implements a regular array architecture with Configurable Logic Blocks (CLBs), Input/Output Blocks (IOBs), and dedicated Block SelectRAM columns placed every 12 CLB columns. Each CLB contains four logic cells with 4-input LUTs, carry chains, and dual flip-flops per slice, supporting true dual-port 4096-bit RAM blocks and arithmetic-intensive functions like pipelined multipliers.
Its IOBs support 20 I/O standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and LVDS-with banked VCCO/VREF constraints. Eight DLLs provide zero-delay clock conversion, 4× multiplication, and 50% duty-cycle correction for DDR applications. The device uses a 0.18 μm 6-layer metal CMOS process and requires 1.8 V core supply (VCCINT) with 3.3 V tolerant I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 569,952 - defines total logic capacity for gate-equivalent synthesis mapping |
| Logic Cells | 10,800 - base unit for place-and-route resource allocation and timing closure |
| Block RAM Bits | 163,840 - organized as forty 4096-bit true dual-port synchronous RAM blocks |
| Differential I/O Pairs | 183 - enables 366-pin LVDS/BLVDS/LVPECL interfaces with sub-nanosecond skew control |
| User I/O Count | 404 - maximum single-ended I/O pins available in PQ240 package per DS022-1 Table 3 |
| DLL Count | 8 - fully digital delay-locked loops for clock deskew, multiplication, and duty-cycle correction |
| Max System Clock | 240 MHz - achievable synchronous performance with I/O included, verified under worst-case timing |
| Process Technology | 0.18 μm 6-layer metal CMOS - enables lower power and higher density vs. prior Virtex generation |
Pinout & Package
PQ240 refers to a 240-pin Plastic Quad Flat Package (PQFP) with 0.5 mm pitch, 32.5 mm × 32.5 mm body size, and exposed thermal pad. Pin assignment follows Xilinx DS022-4 Module 4, with dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM_B, CCLK), JTAG boundary-scan signals (TCK/TMS/TDI/TDO), and banked VCCO/VREF pins distributed across four I/O banks (Bank 0–3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Low-skew dedicated clock routing paths feeding all DLLs and CLB clock networks |
| PROGRAM_B | Active-Low Configuration Initiate | Asynchronous reset of configuration memory; forces reload from external PROM on rising edge |
| INIT | Configuration Status Output | Open-drain signal indicating successful bitstream loading or configuration error detection |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for in-system verification and debug |
| VCCO_0–VCCO_3 | I/O Bank Power Supply | Separate 3.3 V/2.5 V/1.8 V supplies per bank; determines compatible output standards within each bank |
| VREF_0–VREF_3 | I/O Threshold Reference | Required for SSTL/HSTL/GTL input standards; shared across all pins in same bank |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS (622 Mb/s), LVPECL, and PCI 66-MHz with banked VCCO/VREF isolation |
| SelectRAM+™ Memory Hierarchy | 163,840 bits of true dual-port block RAM + 153,600 bits of distributed RAM for pipelined buffering and FIFO implementation |
| Digital DLL Architecture | Eight independent DLLs enabling zero-delay clock conversion, 4× frequency multiplication, and 50% duty-cycle correction for DDR interfaces |
| Flexible CLB Structure | Each CLB contains four logic cells with 4-LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFT drivers for internal bussing |
| SRAM-Based In-System Configuration | Unlimited reprogrammability via JTAG, SelectMAP, or master serial mode; supports partial reconfiguration in selected designs |
Applications
| PCI 66-MHz Bridge Logic | Source-Synchronous Data Capture |
|---|---|
Use Scenario: Implementing a configurable bridge between a 66-MHz PCI bus and custom ASIC or memory controller. IC Role / Device Role / Timing Role: XCV400E-8PQ240C serves as protocol translator and timing adapter, managing PCI address/data strobes, parity, and arbitration with precise setup/hold compliance. Use Value: Leverages 3.3 V PCI-compliant I/O banks and DLL-controlled clock domain crossing to meet PCI specification tSU/tH requirements without external glue logic. |
Use Scenario: Capturing high-speed parallel data from ADCs or SERDES receivers using source-synchronous clocking (e.g., DDR source-synchronous interfaces). IC Role / Device Role / Timing Role: XCV400E-8PQ240C acts as a deserializer and alignment engine, using DLL-delayed sampling clocks and IOB flip-flops to achieve sub-cycle timing alignment. Use Value: Achieves 622 Mb/s LVDS capture with zero pad-to-pad hold time via programmable IOB delay elements synchronized to DLL outputs. |
| DDR SDRAM Controller | High-Speed Serial Link Interface |
Use Scenario: Managing burst-mode read/write operations to 200 Mb/s DDR SDRAM modules in embedded video processing systems. IC Role / Device Role / Timing Role: XCV400E-8PQ240C implements command decoder, address multiplexer, and DQS-aligned data path with DLL-synchronized write leveling. Use Value: Uses built-in DLLs and true dual-port block RAM to buffer commands and data while meeting DDR tAC, tDQSCK, and tDQSS timing windows. |
Use Scenario: Interfacing to optical transceivers or backplane PHYs requiring LVPECL or BLVDS signaling at >300 MHz clock rates. IC Role / Device Role / Timing Role: XCV400E-8PQ240C provides clock recovery, elastic buffering, and channel bonding logic for multi-lane serial links. Use Value: Supports LVPECL clock inputs up to 300+ MHz and differential I/O pairs with matched trace routing for deterministic jitter performance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV400E-7PQ240C | Slower speed grade (-7 vs. -8); 133 MHz register-to-register timing vs. 125 MHz worst-case | Suitable for non-critical timing paths where 240 MHz system clock not required | Select when cost sensitivity outweighs need for maximum timing margin in PCI or DDR interfaces |
| XCV600E-8PQ240C | Higher density (186,624 logic cells vs. 10,800); 512 Kb block RAM vs. 163,840 bits; same PQ240 package footprint | Enables larger state machines, deeper FIFOs, and multi-channel processing in identical PCB layout | Choose when design scalability or future-proofing for increased logic/memory demand is prioritized |
Compared with XCV400E-7PQ240C, the XCV400E-8PQ240C provides tighter timing margins for 240 MHz operation and LVDS capture; compared with XCV600E-8PQ240C, it offers lower power and cost at the expense of logic capacity and block RAM - making it optimal for mid-complexity interface consolidation.
Availability
XCV400E-8PQ240C is available at Aetrix Electronics and suitable for PCI bridge logic, DDR SDRAM controller design, source-synchronous data acquisition, and LVDS/LVPECL interface consolidation requiring stable component supply and long-term industrial lifecycle support.
Supply support for XCV400E-8PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and toolchain development for high-performance digital system design.
The Virtex-E family was designed for high-speed, high-density programmable logic applications demanding advanced I/O flexibility, integrated clock management, and scalable memory resources - targeting communications infrastructure, test equipment, and industrial control systems.
FAQ
What is the maximum differential I/O pair count supported by XCV400E-8PQ240C?
XCV400E-8PQ240C supports up to 183 differential I/O pairs, as specified in Table 1 of DS022-1 (v2.3). This count is fixed for the XCV400E device regardless of package; however, only 404 total user I/O pins are accessible in the PQ240 package, limiting simultaneous differential use due to pin-sharing constraints and I/O banking rules.
Does XCV400E-8PQ240C support LVPECL clock inputs?
Yes, XCV400E-8PQ240C supports LVPECL clock inputs up to 300+ MHz, as stated in the "Differential Signalling Support" section of DS022-1. LVPECL-compatible clock inputs must be routed to dedicated differential-capable pins in banks configured with 3.3 V VCCO, and require external termination to 2.0 V.
How many DLLs does XCV400E-8PQ240C include, and what are their key capabilities?
XCV400E-8PQ240C includes eight fully digital Delay-Locked Loops (DLLs). Each supports clock multiply (up to 4×), divide, zero-delay conversion of LVPECL/LVDS inputs to any I/O standard, and digitally synthesized 50% duty cycle for DDR applications - all confirmed in DS022-1 Section "High-Performance Built-In Clock Management Circuitry".
Is XCV400E-8PQ240C pin-compatible with other Virtex-E devices in the PQ240 package?
XCV400E-8PQ240C is pin-compatible with XCV50E, XCV100E, XCV200E, and XCV300E in the PQ240 package per DS022-1 Section "Virtex-E Compared to Virtex Devices". However, I/O bank assignments, VREF pin usage, and dedicated function pin mappings (e.g., GCLK locations) differ across densities and must be verified per device-specific pinout tables in DS022-4.
What block RAM configuration options does XCV400E-8PQ240C offer?
XCV400E-8PQ240C provides 40 block SelectRAM units totaling 163,840 bits, each configurable as true dual-port 4096-bit RAM with independent width/depth settings per port. Supported configurations include 4096×1, 2048×2, 1024×4, 512×8, and 256×16 - documented in DS022-2 Table 5 and Figure 6.
XCV400E-8PQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2400
- Number of Logic Elements/Cells:
- 10800
- Total RAM Bits:
- 163840
- Number of I/O:
- 158
- Number of Gates:
- 569952
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV400E-8PQ240C FAQ
1.How can I place an order for XCV400E-8PQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV400E-8PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV400E-8PQ240C reliable?
The price and inventory of XCV400E-8PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV400E-8PQ240C is usually 5 days.
3.What payment methods are accepted for XCV400E-8PQ240C?
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Once your XCV400E-8PQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV400E-8PQ240C?
For technical support, including XCV400E-8PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV400E-8PQ240C requirements.
6.How does Aetrix verify that XCV400E-8PQ240C is sourced from the original manufacturer or authorized distributors?
All XCV400E-8PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV400E-8PQ240C meets industry standards.
7.What is the process for return or replacement of XCV400E-8PQ240C?
All XCV400E-8PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV400E-8PQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV400E-8PQ240C part is unused and in its original packaging.
Return procedure for XCV400E-8PQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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