Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XCV50-4BG256C

Part No.:
XCV50-4BG256C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BBGA
Datasheet:
AetrixXCV50-4BG256C.pdf
Description:
IC FPGA 180 I/O 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,242

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XCV50-4BG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells, 180 user I/O pins, and four dedicated delay-locked loops (DLLs) for advanced clock control. It supports 66-MHz PCI compliance, hot-swappable operation in Compact PCI systems, and hierarchical memory configuration including LUTs usable as 16-bit RAM or shift registers.

For engineers reviewing the XCV50-4BG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ interface compatibility, and migration guidance from Virtex-1 generation design constraints.

Technical Context

The XCV50-4BG256C implements a regular array of Configurable Logic Blocks (CLBs), each containing two slices with four logic cells (LCs), carry chains, F5/F6 multiplexers for wide-input logic, and dual-port block RAMs. Its routing hierarchy includes General Routing Matrix (GRM), VersaRing™ I/O interconnect, and dedicated horizontal bus lines per CLB row.

It features eight I/O banks with independent VCCO and VREF supply domains, supporting mixed-voltage signaling standards such as LVTTL (3.3 V), LVCMOS2 (2.5 V), HSTL Class IV (1.5 V), and SSTL3 (3.3 V) - subject to bank-level voltage co-location rules. All IOBs include IEEE 1149.1 boundary-scan logic and configurable weak-keeper circuits.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 57,906 - defines logic capacity for ASIC replacement sizing and place-and-route resource estimation
Logic Cells 1,728 - base unit for synthesis mapping; each LC contains 4-input LUT, carry logic, and D-flip-flop
User I/O Pins 180 - maximum routable signals in BG256 package; constrained by eight I/O banks and VCCO/VREF pin allocation
Block RAM Bits 32,768 - provided by eight 4k-bit synchronous dual-ported RAM blocks, enabling on-chip FIFOs or buffer memory
Speed Grade -4 - specifies worst-case internal timing performance; supports up to 200 MHz system clock rates with DLL compensation
Supply Voltage 2.5 V core (VCCINT), 3.3/2.5/1.5 V I/O (VCCO) - requires separate power domains and decoupling per bank
Configuration Mode Master Serial, Slave Serial, SelectMAP™, JTAG - determines boot source, programming interface, and security options

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (BG256), 1.27 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Four dedicated low-skew inputs feeding DLLs; must connect to external clock sources with controlled impedance
CCLK Configuration Clock Drives master serial configuration; output during slave modes; requires stable 0–50 MHz clock during bitstream load
DIN / DOUT Serial Configuration Data DIN receives bitstream in master serial mode; DOUT outputs readback data in JTAG or SelectMAP™ verify operations
PROGRAM_B Active-Low Reset Asynchronous global reset that clears configuration memory and forces re-initialization on next CCLK edge
TCK / TMS / TDI / TDO JTAG Boundary-Scan Interface IEEE 1149.1 compliant test access port; enables in-system programming, debug, and structural verification
VCCINT Core Power Supply 2.5 V ±5% supply for CLB and routing logic; requires local 0.1 µF + 10 µF decoupling per power ball group
VCCO_0–VCCO_7 I/O Bank Power Eight independent VCCO supplies - one per I/O bank - set output voltage level and drive strength per bank
VREF_0–VREF_7 I/O Threshold Reference Eight bank-specific reference voltages for SSTL/HSTL/GTL input receivers; must be externally sourced and filtered

Key Features

Feature Design Value
Dedicated DLLs Four delay-locked loops eliminate clock skew across large designs and enable phase-aligned clock domain crossing
SelectIO™ Interface Supports 16 I/O standards including LVTTL, SSTL3, HSTL Class IV, and GTL+ - with per-bank VCCO/VREF assignment
LUT-as-RAM Each 4-input LUT configurable as 16×1-bit synchronous RAM, 16×2-bit dual-port RAM, or 16-bit shift register for burst capture
Carry Chain Arithmetic Dedicated 2-bit-per-CLB carry chain enables high-speed adders, counters, and accumulators without LUT resource consumption
Boundary Scan Full IEEE 1149.1 implementation with instruction register, bypass register, and device identification support

Applications

PCI Bridge Controller High-Speed Data Acquisition

Use Scenario: Implementing a 66-MHz PCI-to-local bus bridge in industrial instrumentation chassis with hot-swap capability.

IC Role / Device Role / Timing Role: FPGA acts as protocol translator and timing arbiter between PCI bus and custom ADC/DAC interface; DLLs synchronize internal logic to PCI clock domain.

Use Value: Enables deterministic 66-MHz PCI compliance without external clock buffers; 180 I/O pins accommodate address/data multiplexing and control signal fanout.

Use Scenario: Capturing 100+ MSPS parallel ADC samples into on-chip FIFOs before streaming to DDR SDRAM via external controller.

IC Role / Device Role / Timing Role: FPGA serves as high-speed interface glue logic and first-stage buffering; LUT-based shift registers capture burst-mode samples at system clock rate.

Use Value: 32,768 bits of block RAM provide 32k × 1-bit deep FIFO; 1,728 logic cells implement sample decimation and header insertion logic.

Telecom Line Card Interface Legacy System Emulation

Use Scenario: Replacing obsolete gate arrays in T1/E1 line interface cards requiring HSTL or SSTL3 signaling to framer ICs.

IC Role / Device Role / Timing Role: FPGA provides physical layer adaptation, framing logic, and jitter-tolerant clock recovery using DLL-locked internal clocks.

Use Value: Eight I/O banks allow simultaneous HSTL Class IV (1.5 V) and SSTL3 (3.3 V) interfaces on same device; eliminates need for level-shifter ICs.

Use Scenario: Emulating vintage ASICs in avionics maintenance test equipment where original parts are no longer available.

IC Role / Device Role / Timing Role: FPGA replicates exact pinout, timing, and functional behavior of legacy chip using behavioral HDL models and timing-accurate constraints.

Use Value: SRAM-based configuration allows field updates to match evolving test requirements; -4 speed grade ensures timing closure on legacy timing paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV50-5BG256C Higher speed grade (-5 vs. -4); 15–20% faster internal timing, identical pinout and logic resources Suitable for designs requiring tighter setup/hold margins or higher clock frequencies beyond 160 MHz Select when timing closure fails on XCV50-4BG256C under worst-case voltage/temperature conditions
XCV100-4BG256C Same package and speed grade, but 108,904 system gates and 2,700 logic cells - 56% more capacity Required for larger logic functions, additional block RAM (40,960 bits), or expanded I/O count within same footprint Choose when design exceeds XCV50-4BG256C resource utilization or requires future scalability headroom

Compared with XCV50-4BG256C, the -5 variant improves timing margin without layout change, while XCV100-4BG256C increases logic density and memory within identical BG256 mechanical constraints - both retain full toolchain compatibility with Xilinx Foundation and Alliance software.

Availability

XCV50-4BG256C is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, high-speed data acquisition systems, telecom line card interfaces, and legacy ASIC emulation requiring stable component supply through obsolescence management programs.

Supply support for XCV50-4BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and historically responsible for introducing the first commercial FPGA architecture.

The Virtex family - including XCV50-4BG256C - was designed for high-performance, high-density system integration in telecommunications infrastructure, military/aerospace platforms, and industrial automation where reconfigurability and silicon efficiency were critical.

FAQ

What is the maximum operating frequency supported by XCV50-4BG256C?

XCV50-4BG256C supports synchronous system clock rates up to 200 MHz when using DLL-compensated clock networks and optimized placement. The -4 speed grade guarantees timing closure for register-to-register paths at 160 MHz under worst-case commercial conditions (0°C to +85°C, 2.5 V ±5%). Actual achievable frequency depends on design topology, routing congestion, and I/O standard selection.

Does XCV50-4BG256C support hot-swap operation in Compact PCI systems?

Yes, XCV50-4BG256C is explicitly designed for hot-swappable Compact PCI applications. Its I/O structure meets PCI 66-MHz electrical specifications, and its configuration architecture allows safe power-up sequencing and isolation during card insertion/removal. The device includes bus-hold circuitry and programmable weak-keeper logic to maintain signal integrity during transition states.

How many block RAMs does XCV50-4BG256C contain, and what are their configurations?

XCV50-4BG256C contains eight 4,096-bit block SelectRAMs totaling 32,768 bits. Each block is a fully synchronous dual-ported RAM with independent address, data, and control buses per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible FIFO depth/width trade-offs and on-chip buffer memory without consuming CLB resources.

Can XCV50-4BG256C interface directly with 5 V TTL devices?

XCV50-4BG256C supports 5 V tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, but only when configured with appropriate VCCO and termination. Outputs are not 5 V tolerant - they operate at VCCO levels (1.5 V, 2.5 V, or 3.3 V). Direct connection to 5 V logic requires external level-shifting or clamping for output signals; input-only connections may use series resistors and rely on internal Zener protection.

What configuration modes are supported by XCV50-4BG256C?

XCV50-4BG256C supports four configuration modes: Master Serial (loads bitstream from external PROM), Slave Serial (receives bitstream from host processor), SelectMAP™ (8-bit parallel interface with handshaking), and JTAG (boundary-scan based programming and debugging). All modes use the same BG256 pinout; mode selection is determined by INIT_B, PROGRAM_B, and mode pins at power-up.

XCV50-4BG256C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
256-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Total RAM Bits:
32768
Number of I/O:
180
Number of Gates:
57906
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-PBGA (27x27)

XCV50-4BG256C FAQ

1.How can I place an order for XCV50-4BG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV50-4BG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV50-4BG256C reliable?

The price and inventory of XCV50-4BG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV50-4BG256C is usually 5 days.

3.What payment methods are accepted for XCV50-4BG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV50-4BG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV50-4BG256C?

XCV50-4BG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV50-4BG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV50-4BG256C?

For technical support, including XCV50-4BG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV50-4BG256C requirements.

6.How does Aetrix verify that XCV50-4BG256C is sourced from the original manufacturer or authorized distributors?

All XCV50-4BG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV50-4BG256C meets industry standards.

7.What is the process for return or replacement of XCV50-4BG256C?

All XCV50-4BG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCV50-4BG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV50-4BG256C part is unused and in its original packaging.

Return procedure for XCV50-4BG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV50-4BG256C Tags

  • XCV50-4BG256C
  • XCV50-4BG256C PDF
  • XCV50-4BG256C Datasheet
  • XCV50-4BG256C Specifications
  • XCV50-4BG256C Images
  • AMD
  • AMD XCV50-4BG256C
  • Buy XCV50-4BG256C
  • XCV50-4BG256C Price
  • XCV50-4BG256C Distributor
  • XCV50-4BG256C Supplier
  • XCV50-4BG256C Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER