AMD XCV50-4BG256I

Overview

XCV50-4BG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells, 180 user I/O pins, and four dedicated delay-locked loops (DLLs) for clock management. It implements configurable logic via 4-input LUTs, supports dual-ported 4k-bit block RAM, and delivers up to 200 MHz system performance in industrial temperature range (–40°C to +100°C). It is used in high-reliability embedded control and legacy PCI-compliant interface bridging.

For engineers reviewing the XCV50-4BG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its 2.5 V core voltage, BG256 ball-grid array package with industrial-grade thermal rating, 32,768 bits of block SelectRAM, support for 16 SelectIO™ standards including LVTTL and HSTL Class IV, and IEEE 1149.1 boundary-scan compliance.

Technical Context

The XCV50-4BG256I employs a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLB contains two slices, each with four logic cells featuring 4-input LUTs, dedicated carry chains, and flip-flops with synchronous/asynchronous set/reset.

Each IOB supports programmable drive strength (up to 24 mA source / 48 mA sink), optional weak-keeper circuitry, and configurable input reference voltage (VREF) per I/O bank. The device uses eight independent I/O banks-each requiring uniform VCCO-and integrates die-temperature sensor diodes for thermal monitoring.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (BG256), 1.27 mm pitch, body size 27 mm × 27 mm, JEDEC MO-205AC compliant. Thermal resistance θ_JA = 26.5°C/W (typical, still-air).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV50-4BG256I, the –5 speed grade improves timing margin without changing pinout or power profile, while XCV100-4BG256I adds headroom for feature expansion but increases static current by 35% and requires revised floorplanning.

Availability

XCV50-4BG256I is available at Aetrix Electronics and suitable for industrial motion control, legacy PCI bridge interface, and avionics data concentrator applications requiring stable component supply and long-term lifecycle support.

Supply support for XCV50-4BG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered SRAM-based FPGA architectures and advanced design toolchains.

The Virtex family was designed for high-performance, high-density logic implementation in infrastructure and industrial systems where reconfigurability, I/O flexibility, and deterministic timing are critical - exemplified by XCV50-4BG256I's 2.5 V core, DLL-based clock management, and multi-standard I/O.

FAQ

What is the maximum operating frequency of the XCV50-4BG256I?

The XCV50-4BG256I achieves up to 200 MHz system clock performance under worst-case timing conditions for register-to-register paths. This figure is validated in Xilinx DS003-1 (v4.0) Table 2 and applies to synchronous logic with proper placement and routing. Actual frequency depends on design topology, I/O standard selection, and thermal conditions - the device's four DLLs enable precise clock deskew to sustain this rate across large logic blocks.

Does the XCV50-4BG256I support hot-swap operation?

Yes, the XCV50-4BG256I supports hot-swap functionality for Compact PCI applications as stated in DS003-1 Feature list. Its IOBs include robust ESD protection, programmable weak-keeper circuits, and controlled slew-rate drivers that prevent bus contention during insertion/removal. Implementation requires adherence to PCI Hot-Plug Specification Rev 2.0 and proper sequencing of VCCO and VCCINT rails.

How many block RAMs does the XCV50-4BG256I contain?

The XCV50-4BG256I contains eight 4,096-bit block SelectRAMs totaling 32,768 bits, as confirmed in DS003-2 Table 3. Each block is fully synchronous, dual-ported, and configurable for depths from 1 to 4096 with corresponding data widths (e.g., 16×256 or 8×512). These blocks operate independently of distributed LUT RAM and are accessed via dedicated routing to minimize congestion.

What I/O standards are supported by the XCV50-4BG256I?

The XCV50-4BG256I supports 16 SelectIO™ standards including LVTTL (3.3 V, 2–24 mA), LVCMOS2 (2.5 V), PCI 5 V and 3.3 V, HSTL Classes I/III/IV, SSTL3/SSTL2, GTL/GTL+, and CTT. Per DS003-2 Table 1, compatibility depends on bank-level VCCO and VREF assignment - for example, HSTL Class IV requires 1.5 V VCCO and 0.9 V VREF, while LVTTL requires 3.3 V VCCO and no VREF.

Is the XCV50-4BG256I still in production?

No, the XCV50-4BG256I is obsolete per Xilinx DS003-1 (v4.0) Revision History: "The products listed in this data sheet are obsolete. See XCN10016 for further information." However, Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle management support including cross-reference guidance and obsolescence mitigation planning for ongoing production programs.