AMD XCV50-4FG256C

Overview

XCV50-4FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells, 176 user I/O pins in a 256-ball fine-pitch BGA package, and four dedicated delay-locked loops (DLLs) for clock management. It supports 66-MHz PCI compliance and hot-swappable operation in Compact PCI systems, targeting high-speed digital signal processing and reconfigurable embedded control applications.

For engineers reviewing the XCV50-4FG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level resource allocation, block RAM configuration options, and timing-critical DLL jitter specifications - all specific to the -4 speed grade in FG256 packaging.

Technical Context

The XCV50-4FG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing. Its CLBs contain two slices each with four 4-input LUTs, dedicated carry chains, and dual-port 16-bit shift register capability per LUT.

It features eight I/O banks with independent VCCO and VREF supply domains, supporting mixed-voltage signaling standards including LVTTL (3.3 V), LVCMOS2 (2.5 V), HSTL Class IV (1.5 V), and SSTL2 (2.5 V). Each IOB includes three configurable storage elements with synchronous/asynchronous set/reset, programmable polarity, and weak-keeper circuitry.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG256), 256-ball array, 1.0 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV50-4FG256C, the XCV50-5FG256C offers improved timing margin without altering logic utilization or I/O allocation, while the XCV100-4FG256C provides scalable logic headroom within the same board layout - both preserving FG256 mechanical compatibility and I/O banking structure.

Availability

XCV50-4FG256C is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, reconfigurable DSP subsystems, CompactPCI hot-swap managers, and high-speed protocol conversion requiring stable component supply across extended product lifecycles.

Supply support for XCV50-4FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family was designed for high-performance, high-density reconfigurable computing in telecommunications infrastructure, military/aerospace systems, and industrial automation - emphasizing clock integrity, I/O flexibility, and silicon efficiency.

FAQ

What is the maximum operating frequency of the XCV50-4FG256C?

The XCV50-4FG256C has a -4 speed grade specifying worst-case internal register-to-register performance up to 160 MHz. System-level operation at 200 MHz is achievable in optimized designs with minimal routing delay, as confirmed in Xilinx DS003-1 Table 2 for pipelined multiplier and address decoder functions. Actual frequency depends on placement, routing, and I/O standard selection.

Does the XCV50-4FG256C support 5 V tolerant I/Os?

Yes, the XCV50-4FG256C supports 5 V tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, implemented via internal Zener-like clamping structures. However, 5 V tolerance applies only to inputs - outputs are driven at VCCO (1.5 V / 2.5 V / 3.3 V) and are not 5 V capable. This is explicitly documented in DS003-2 Table 1 and I/O banking section.

How many block RAMs does the XCV50-4FG256C contain?

The XCV50-4FG256C contains eight block SelectRAMs, each providing 4,096 bits of synchronous dual-ported memory, totaling 32,768 bits. These are physically arranged in two columns along the vertical edges of the die, with each block supporting independent port widths (1–16 bits) and depths (256–4096 words), as specified in DS003-2 Table 3 and Figure 6.

Can the XCV50-4FG256C be configured via JTAG?

Yes, the XCV50-4FG256C supports IEEE 1149.1 JTAG boundary-scan configuration in slave serial mode. The TDI, TDO, TCK, and TMS pins are dedicated for this purpose, and the device includes full TAP controller logic. JTAG is used for programming, debugging, and in-system verification - confirmed in DS003-2 Architectural Description and DS003-4 Pinout Tables.

What is the role of the VREF pins on the XCV50-4FG256C?

VREF pins on the XCV50-4FG256C provide user-supplied input reference voltages for I/O standards requiring threshold calibration - including SSTL2/3, HSTL I/III/IV, and GTL+. Each of the eight I/O banks has dedicated VREF pins; all VREF pins within a bank must be tied to the same external voltage source, as defined in DS003-2 I/O Banking section and Figure 3.