AMD XCV50-4FG256I

Overview

XCV50-4FG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells in a 16×24 CLB array, and 176 user I/O pins in a 256-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), 4k-bit configurable dual-ported block RAMs, and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV50-4FG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex-1 to Spartan-3 or Virtex-II families.

Technical Context

The XCV50-4FG256I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing-enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–6 input functions, and LUTs configurable as 16-bit RAM, 32-bit RAM, or 16-bit shift registers.

Each IOB supports 16 SelectIO™ standards-including LVTTL, LVCMOS2, HSTL Class IV, and SSTL2-with independent VCCO per I/O bank, programmable slew rate, 24 mA output drive, and IEEE 1149.1 boundary-scan. The device uses four primary low-skew global clock nets plus 24 secondary local clock nets, all synchronized via DLLs with ±150 ps jitter (typical) at 100 MHz.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG256), 256-ball, 1.0 mm pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV50-4FG256I, the -5 speed grade improves timing margin without altering I/O or memory resources, while the XCV100-4FG256I offers direct footprint-compatible scalability-both enabling design reuse, but only the -5 variant guarantees higher-frequency operation within the same thermal envelope.

Availability

XCV50-4FG256I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data concentration, and automated test equipment requiring stable component supply amid long product lifecycles.

Supply support for XCV50-4FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed the Virtex family as its flagship high-performance FPGA platform.

The Virtex family was designed for applications demanding high logic density, fast I/O, and flexible clock management-including telecom infrastructure, military systems, and scientific instrumentation-prioritizing place-and-route efficiency and silicon utilization.

FAQ

Is XCV50-4FG256I still in production or supported for new designs?

XCV50-4FG256I is marked obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and no longer manufactured. However, Aetrix Electronics maintains legacy inventory with full traceability and offers engineering support for sustaining production, including configuration bitstream validation and migration path analysis to Spartan-3 or Artix-7 platforms. XCV50-4FG256I remains viable for repair, replacement, and long-lifecycle industrial deployments where redesign is not feasible.

What are the critical power supply requirements for XCV50-4FG256I?

XCV50-4FG256I requires two regulated supplies: VCCINT = 2.5 V ± 3% (core logic) and bank-specific VCCO (1.5 V, 2.5 V, or 3.3 V) for I/O. Each VCCINT pin needs ≥10 µF ceramic decoupling within 10 mm; VCCO banks require separate bulk capacitance per bank. Total typical core current is 320 mA at 200 MHz activity; unused I/O banks must have VCCO tied to valid voltage or grounded per Xilinx UG071 guidelines to prevent latch-up.

Can XCV50-4FG256I be configured via JTAG in-system, and what tools support it?

Yes, XCV50-4FG256I supports IEEE 1149.1 JTAG configuration in slave serial mode using Xilinx Impact (v14.7 or earlier) or third-party boundary-scan tools compliant with BSDL file xcv50.bsd. JTAG enables in-system programming, readback verification, and debug access-but does not support partial reconfiguration. Configuration bitstreams must be generated with Xilinx Foundation or Alliance software targeting Virtex-1 architecture; newer Vivado tools do not support XCV50-4FG256I.

How does the DLL in XCV50-4FG256I improve I/O timing compared to non-DLL FPGAs?

The four DLLs in XCV50-4FG256I eliminate pad-to-pad hold time by matching internal clock distribution delay to input buffer delay, enabling zero-hold-time capture of high-speed data (e.g., 100 MHz DDR). Each DLL provides ±150 ps jitter (typical) and supports phase shifting, duty-cycle correction, and frequency multiplication-allowing synchronous interfacing to external memories or buses without external PLLs or delay elements. This is confirmed in DS003-3 DC and switching characteristics tables.

What is the maximum operating junction temperature for XCV50-4FG256I, and how is thermal management addressed?

XCV50-4FG256I has an industrial-grade junction temperature rating of –40°C to +100°C (per ordering code "I"). Thermal management relies on PCB copper pour under the FG256 package, recommended 4-layer stackup with inner ground/power planes, and optional heat slug attachment per Xilinx AN117. Power dissipation peaks at ~2.1 W under worst-case toggle conditions; thermal resistance θJA is 32°C/W (JEDEC Std 51-2), requiring ≤30°C ambient rise for reliable 100°C junction operation.