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AMD XCV50-4PQ240I

Part No.:
XCV50-4PQ240I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP
Datasheet:
AetrixXCV50-4PQ240I.pdf
Description:
IC FPGA 166 I/O 240QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,707

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Product details

Overview

XCV50-4PQ240I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells in a 16×24 CLB array, and 166 user I/O pins in a 240-pin Plastic Quad Flat Pack (PQFP) package. It features four delay-locked loops (DLLs), hierarchical memory resources including distributed LUT RAM and 32,768-bit block SelectRAM, and supports 66-MHz PCI-compliant interfaces for industrial control and communications infrastructure.

For engineers reviewing the XCV50-4PQ240I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specifications, CLB timing parameters, and migration guidance from Virtex-1 generation devices.

Technical Context

The XCV50-4PQ240I implements a hierarchical routing architecture with General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain two slices each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and dual-port synchronous storage elements.

Each IOB supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI 3.3 V, HSTL Class IV, and SSTL2/3, with banked VCCO (1.5 V / 2.5 V / 3.3 V) and VREF (0.75–1.5 V) constraints. Four DLLs provide clock deskew and phase alignment across global clock nets, while IEEE 1149.1 boundary-scan ensures testability.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 57,906 - defines logic capacity for ASIC replacement in mid-complexity digital systems
Logic Cells 1,728 - CLB-based programmable units supporting combinational logic, arithmetic, and registered functions
User I/O Pins 166 - available signal lines constrained by PQ240 package and I/O banking rules
Block RAM 32,768 bits - eight 4k-bit dual-ported synchronous RAM blocks for FIFOs, buffers, or lookup tables
Max Clock Frequency 200 MHz - achievable synchronous system performance including I/O timing closure
Speed Grade -4 - worst-case timing grade specifying setup/hold and propagation delays at industrial temperature
Operating Temperature –40°C to +100°C - qualified for industrial environments without derating

Pinout & Package

Package: 240-pin Plastic Quad Flat Pack (PQ240), 0.5 mm pitch, 32.0 × 32.0 mm body size, lead-free compatible (per Xilinx DS003-4 Module 4).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Dedicated low-skew inputs feeding four DLLs; require external termination and controlled impedance routing
PROGRAM_B Configuration Initiate Active-low asynchronous reset that clears configuration memory and forces high-impedance I/O state
INIT_B Configuration Status Open-drain output indicating successful bitstream loading; pulled high externally during configuration
CCLK Configuration Clock Input-driven clock for master serial mode; frequency ≤ 25 MHz; drives internal PROM interface
TCK/TMS/TDI/TDO JTAG Boundary Scan IEEE 1149.1 compliant test access port; enables in-system programming and verification
VCCINT Core Supply 2.5 V ± 3% supply for CLBs and routing; requires low-noise decoupling near power pins
VCCO_0–VCCO_7 I/O Bank Supply Bank-specific output voltage (1.5/2.5/3.3 V); all pins in same bank must share identical VCCO
VREF_0–VREF_7 I/O Threshold Reference Bank-specific input reference (0.75–1.5 V); required only for HSTL/SSTL standards; internally tied within bank

Key Features

Feature Design Value
Dual-Port Block RAM Eight 4k-bit synchronous RAMs with independent read/write clocks and widths - enables true dual-clock FIFOs without external logic
SelectIO™ Interface 16 I/O standards supported per bank, including 66-MHz PCI and HSTL Class IV - eliminates level-shifter ICs in high-speed backplane designs
Delay-Locked Loops (DLLs) Four fully integrated DLLs with <50 ps jitter (typ.) - provides deterministic clock deskew across 200 MHz global nets without external PLLs
LUT-as-RAM Mode Each 4-input LUT configurable as 16×1-bit RAM, 16×2-bit RAM, or 16-bit shift register - enables compact datapath storage and burst capture
Carry Chain Arithmetic Dedicated 2-bit-per-CLB carry chain with XOR/AND logic - achieves 32-bit adder propagation delay < 4.4 ns (worst-case)

Applications

Industrial Motion Control PCI-Based Data Acquisition

Use Scenario: Real-time servo loop execution with encoder feedback, PWM generation, and safety monitoring in CNC machines.

IC Role / Device Role / Timing Role: Configurable logic fabric implementing closed-loop PID controllers, quadrature decoder, and fault-safe I/O gating.

Use Value: Deterministic 200 MHz clock domain enables sub-microsecond interrupt latency and synchronized multi-axis motion profiles.

Use Scenario: High-throughput analog-to-digital data streaming from 16-channel 12-bit ADCs into host PC via 66-MHz 32-bit PCI bus.

IC Role / Device Role / Timing Role: PCI target interface controller with DMA engine, FIFO buffering, and sample timestamping logic.

Use Value: Native 66-MHz PCI compliance eliminates external bridge ICs; 166 I/O pins support parallel ADC bus + control signals.

Telecom Line Card Interface Legacy System Emulation

Use Scenario: Protocol translation between T1/E1 framing and packetized VoIP streams in access concentrators.

IC Role / Device Role / Timing Role: Multi-standard I/O transceiver handling HDB3/AMI line coding, jitter attenuation, and HDLC framing.

Use Value: SelectIO™ support for HSTL Class IV and SSTL3 allows direct connection to line drivers/receivers at 100+ Mbps.

Use Scenario: Replacement of obsolete gate arrays in avionics maintenance test equipment requiring field-upgradable logic.

IC Role / Device Role / Timing Role: Reconfigurable glue logic emulating custom PAL/GAL behavior with in-system reprogramming.

Use Value: SRAM-based configuration enables remote firmware updates without hardware change; -4 speed grade ensures timing compatibility.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV50-5PQ240I Higher speed grade (-5 vs. -4); 15% faster CLB timing and 100 ps lower DLL jitter Required for designs targeting >180 MHz system clocks or tighter hold-time margins Select when timing closure fails on XCV50-4PQ240I despite optimization; same pinout and configuration interface
XCV100-4PQ240I Higher density (108,904 gates, 2,700 logic cells); identical PQ240 package and I/O count Needed for designs exceeding 1,728 logic cells but constrained by existing 240-pin PCB footprint Choose for logic scalability without board redesign; shares same thermal profile and power delivery requirements

Compared with XCV50-4PQ240I, the -5 variant improves timing margin for high-frequency control loops, while the XCV100-4PQ240I retains mechanical compatibility while doubling logic capacity - both enable incremental upgrades without changing PCB layout or cooling design.

Availability

XCV50-4PQ240I is available at Aetrix Electronics and suitable for industrial motion control, PCI-based data acquisition, telecom line card interface, and legacy system emulation requiring stable component supply across extended product lifecycles.

Supply support for XCV50-4PQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, it delivers FPGA, adaptive SoC, and ACAP platforms.

The Virtex family was designed as Xilinx's flagship high-performance FPGA line for demanding compute, signal processing, and interface applications - emphasizing silicon efficiency, clock management, and I/O flexibility in 0.22 μm CMOS.

FAQ

Is XCV50-4PQ240I still in production or considered obsolete?

XCV50-4PQ240I is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and is no longer manufactured. However, Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle management support, including obsolescence forecasting and last-time-buy coordination for ongoing production programs.

What configuration modes does XCV50-4PQ240I support?

XCV50-4PQ240I supports four configuration modes: Master Serial (reads bitstream from external PROM via CCLK), Slave Serial (receives bitstream from microcontroller), SelectMAP™ (8-bit parallel interface), and JTAG (boundary-scan programming). All modes retain full functionality, though JTAG is preferred for debug and field updates due to its standardized interface.

Can XCV50-4PQ240I operate with mixed I/O standards on the same package?

Yes, but only within I/O banking constraints: each of the eight banks must use a single VCCO voltage and, if applicable, one shared VREF. For example, HSTL Class I (1.5 V VCCO, 0.75 V VREF) and GTL (no VCCO dependency) may coexist in Bank 0, but LVTTL (3.3 V VCCO) must be isolated in a separate bank with dedicated VCCO pins.

Does XCV50-4PQ240I include on-chip temperature sensing?

Yes, XCV50-4PQ240I integrates a die-temperature sensor diode as specified in DS003-1. This analog element requires external biasing and measurement circuitry (e.g., constant-current source and ADC) to derive junction temperature - used for thermal monitoring and dynamic clock throttling in industrial deployments.

What is the maximum operating frequency of the DLLs in XCV50-4PQ240I?

The four DLLs in XCV50-4PQ240I operate up to 200 MHz input frequency with jitter performance of <50 ps (typical) and <150 ps (worst-case) per DS003-3. They lock within 100 μs and support phase-shifted outputs for source-synchronous interfaces like DDR SDRAM controllers.

XCV50-4PQ240I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
240-BFQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Total RAM Bits:
32768
Number of I/O:
166
Number of Gates:
57906
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV50-4PQ240I FAQ

1.How can I place an order for XCV50-4PQ240I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV50-4PQ240I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV50-4PQ240I reliable?

The price and inventory of XCV50-4PQ240I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV50-4PQ240I is usually 5 days.

3.What payment methods are accepted for XCV50-4PQ240I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV50-4PQ240I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV50-4PQ240I?

XCV50-4PQ240I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV50-4PQ240I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV50-4PQ240I?

For technical support, including XCV50-4PQ240I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV50-4PQ240I requirements.

6.How does Aetrix verify that XCV50-4PQ240I is sourced from the original manufacturer or authorized distributors?

All XCV50-4PQ240I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV50-4PQ240I meets industry standards.

7.What is the process for return or replacement of XCV50-4PQ240I?

All XCV50-4PQ240I units undergo pre-shipment inspection (PSI). If there is an issue with XCV50-4PQ240I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV50-4PQ240I part is unused and in its original packaging.

Return procedure for XCV50-4PQ240I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV50-4PQ240I Tags

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