AMD XCV50-4TQ144C

Overview

XCV50-4TQ144C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells in a 16×24 CLB array, and 98 user I/O pins in a 144-pin Thin Quad Flat Pack (TQFP) package. It features four delay-locked loops (DLLs), hierarchical memory (LUTs configurable as 16-bit RAM/shift register/dual-port RAM), and supports 66-MHz PCI-compliant interfaces - deployed in high-reliability industrial control and legacy telecom interface boards.

For engineers reviewing the XCV50-4TQ144C datasheet, pinout, applications, or equivalent options, key selection criteria include its -4 speed grade (max 160 MHz system performance), TQ144 thermal profile (0°C to +85°C), dual-port block RAM capacity (32,768 bits), SelectIO™ multi-standard I/O support, and IEEE 1149.1 boundary-scan compliance for production testability.

Technical Context

The XCV50-4TQ144C implements a hierarchical routing architecture with general-purpose routing matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB reuse across logic revisions. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5-/6-input functions, and BUFTs for internal 3-state bus driving.

Each IOB supports independent input/output flip-flops with synchronous/asynchronous set/reset, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and selectable weak-keeper or pull-up/pull-down resistors. Eight I/O banks enforce VCCO/VREF voltage segregation - e.g., HSTL Class IV requires 1.5 V VCCO and 0.9 V VREF per bank, while LVTTL operates at 3.3 V VCCO with no VREF.

Key Specifications

Pinout & Package

Package: 144-pin Thin Quad Flat Pack (TQ144), 20 mm × 20 mm body, 0.5 mm pitch, lead-free (Pb-free) RoHS-compliant variant. Thermal pad not present; JEDEC MS-026 compliant footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV50-4TQ144C, the XCV50-5TQ144C delivers higher timing margin without changing logic utilization or I/O allocation, while the XCV100-4TQ144C provides headroom for functional growth within identical board space and thermal envelope.

Availability

XCV50-4TQ144C is available at Aetrix Electronics and suitable for industrial motion control, legacy telecom infrastructure, medical imaging subsystems, and avionics data concentrators requiring stable component supply amid long product lifecycles.

Supply support for XCV50-4TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, it develops FPGA, SoC, and adaptive compute platforms.

The Virtex family - including XCV50-4TQ144C - was engineered for high-performance, high-density logic replacement in mission-critical systems where ASIC development cost or time-to-market constraints prohibit custom silicon.

FAQ

What is the maximum operating frequency of the XCV50-4TQ144C?

The XCV50-4TQ144C has a -4 speed grade, guaranteeing worst-case register-to-register timing of 5.4 ns, corresponding to a maximum system clock frequency of 160 MHz. This applies to internal logic paths; I/O timing depends on selected standards - e.g., LVTTL at 180 MHz, HSTL Class IV at 200 MHz - and requires proper DLL configuration and board-level signal integrity design.

Does the XCV50-4TQ144C support hot-swapping in Compact PCI systems?

Yes, the XCV50-4TQ144C is explicitly designed for hot-swappable Compact PCI applications per its datasheet features. Its I/O structure, power sequencing tolerance, and robust ESD protection (including 5 V-tolerant LVTTL/PCI inputs) enable safe insertion/removal while the backplane remains powered - provided the carrier board implements proper edge-rate control and VIO ramp sequencing per PICMG 2.1.

How many block RAMs does the XCV50-4TQ144C contain, and what are their configurations?

The XCV50-4TQ144C contains eight block SelectRAM units, totaling 32,768 bits. Each block is a fully synchronous, dual-ported 4,096-bit RAM with independent address/data/control per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible bus-width conversion and ping-pong buffering in video or communications applications using the XCV50-4TQ144C.

Can the XCV50-4TQ144C be configured via JTAG, and what are the implications?

Yes, the XCV50-4TQ144C supports IEEE 1149.1 JTAG configuration in slave serial mode, enabling in-system programming and boundary-scan testing. Using TCK/TMS/TDI/TDO pins, it allows bitstream loading without external PROM, simplifying prototyping and field updates. However, JTAG configuration is slower than SelectMAP™ or master serial modes and does not support fallback or multi-bitstream selection - critical considerations for fail-safe systems built around the XCV50-4TQ144C.

Is the XCV50-4TQ144C still in active production, and what lifecycle support does Aetrix provide?

No - the XCV50-4TQ144C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). Aetrix Electronics maintains legacy inventory and offers extended lifecycle services including last-time-buy coordination, cross-reference engineering support, obsolescence forecasting, and controlled distribution to ensure continuity for installed base systems relying on the XCV50-4TQ144C.