AMD XCV50-4TQ144I

Overview

XCV50-4TQ144I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells in a 16×24 CLB array, and 98 user I/O pins in a 144-pin Thin Quad Flat Pack (TQFP) package. It features four delay-locked loops (DLLs), supports 66-MHz PCI compliance, and operates across the industrial temperature range (–40°C to +100°C). It is used in high-reliability embedded control and legacy telecom interface modules requiring reprogrammable logic with deterministic clock management.

For engineers reviewing the XCV50-4TQ144I datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed I/O count (98), industrial-grade thermal rating, DLL-based clock deskew capability, SelectIO™ standard support (LVTTL, LVCMOS2, PCI 3.3 V), and block RAM capacity (32,768 bits).

Technical Context

The XCV50-4TQ144I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5-/6-input functions, and LUTs configurable as 16-bit RAM, shift registers, or dual-ported memory.

Each IOB supports independent input/output flip-flops with synchronous/asynchronous set/reset, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and IEEE 1149.1 boundary-scan. Eight I/O banks enforce VCCO/VREF voltage segregation, with TQ144 package bonding all VCCO pins internally - requiring single-supply configuration per bank.

Key Specifications

Pinout & Package

Package: 144-pin Thin Quad Flat Pack (TQ144), 20 × 20 mm body, 0.5 mm pitch, lead-free (Pb-free) compatible. All VCCO pins are internally bonded - requires single 3.3 V supply per I/O bank. Eight I/O banks defined (Bank 0–7), with Bank 0/1 on top edge, Bank 2/3 on right, Bank 4/5 on bottom, Bank 6/7 on left.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV50-4TQ144I, the XCV50-5TQ144I delivers higher timing margin at identical density and package, while the XCV100-4TQ144I offers scalable logic and memory headroom without changing PCB layout - both preserve industrial temperature rating and configuration compatibility.

Availability

XCV50-4TQ144I is available at Aetrix Electronics and suitable for industrial motion control, legacy telecom infrastructure, medical imaging subsystems, and automated test equipment requiring stable component supply amid long product lifecycles.

Supply support for XCV50-4TQ144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and design toolchains widely adopted in aerospace, communications, and industrial systems.

The Virtex family - including XCV50-4TQ144I - was engineered for high-performance, high-density reconfigurable logic in mission-critical applications where flexibility, deterministic timing, and long-term availability outweigh cost-per-gate optimization.

FAQ

What is the maximum system clock frequency supported by the XCV50-4TQ144I?

The XCV50-4TQ144I supports synchronous system clock rates up to 200 MHz including I/O paths, though actual achievable frequency depends on design complexity and placement. The –4 speed grade guarantees timing closure for designs meeting worst-case 125 MHz internal logic paths and 66 MHz PCI-compliant I/O interfaces. For XCV50-4TQ144I, typical register-to-register performance is 5.0 ns, enabling robust operation at 160 MHz in well-optimized implementations.

Does the XCV50-4TQ144I support hot-swap operation in Compact PCI systems?

Yes, the XCV50-4TQ144I is explicitly designed for hot-swappable Compact PCI applications. Its I/O architecture meets the electrical and timing requirements for live insertion/removal, including controlled power-up sequencing, high-impedance default states on configuration pins, and robust ESD protection on all user I/O. This capability is documented in DS003-1 and verified across industrial temperature operation.

How many block RAMs does the XCV50-4TQ144I contain, and what are their configurations?

The XCV50-4TQ144I contains eight 4,096-bit block SelectRAMs, totaling 32,768 bits. Each block is a fully synchronous dual-ported RAM with independent address, data, and control buses per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible data buffering, FIFOs, and lookup tables without consuming CLB resources.

Is the XCV50-4TQ144I still in production, and what is its obsolescence status?

The XCV50-4TQ144I is marked as obsolete/under obsolescence per Xilinx documentation (DS003-1 v4.0, March 2013) and XCN10016. However, Aetrix Electronics maintains legacy inventory and supports extended lifecycle procurement, including traceable sourcing from authorized channels and continuity planning for ongoing production programs requiring this specific device.

Can the XCV50-4TQ144I interface directly with 5 V TTL logic?

No, the XCV50-4TQ144I is not 5 V tolerant on its I/O pins. While it supports LVTTL and PCI 5 V standards *input-only* via internal clamping structures, its output drivers operate at 3.3 V (VCCO) and cannot drive 5 V logic levels. Direct connection to 5 V TTL loads risks damage or incorrect logic thresholds; level-shifting circuitry is required for bidirectional 5 V interfacing.